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Thermosetting resin composition and adhesive films

A resin composition and thermosetting technology, which is applied in the field of thermosetting resin compositions and laminates, can solve the problems of insufficient solder heat resistance of laminates, insufficient film processability, etc.

Inactive Publication Date: 2005-07-20
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The adhesive film is an opaque material, and it is judged that the film processability is not sufficient
In addition, when electric and electronic components are laminated on the adhesive film as an adherend and adhered by thermosetting, the solder heat resistance of the resulting laminate is insufficient.

Method used

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  • Thermosetting resin composition and adhesive films
  • Thermosetting resin composition and adhesive films
  • Thermosetting resin composition and adhesive films

Examples

Experimental program
Comparison scheme
Effect test

manufacture example

[0170] (1) Preparation of a solution containing component (A) (mixture of component (A) and component (D))

[0171]

[0172] 20 parts by weight of (A-1) component and 80 parts by weight of toluene were put into a flask, stirred and dissolved at 80° C. for 1 hour while insulated, to obtain a toluene solution containing 20% ​​by weight of (A-1) component.

[0173]

[0174] 20 parts by weight of (A-2) component and 80 parts by weight of acetone were put into a flask, stirred and dissolved at 80°C for 1 hour while insulated to obtain an acetone solution containing 20% ​​by weight of (A-2) component.

[0175]

[0176] 20 parts by weight of (A-3) component and 80 parts by weight of methyl ethyl ketone were put into a flask, stirred and dissolved at 80°C for 1 hour while insulated to obtain a methyl ethyl ketone solution containing 20 wt% of (A-3) component.

[0177]

[0178] A commercially available xylene / methyl ethyl ketone solution containing 60% by weight of the componen...

manufacture example 1

[0190] A polyethylene terephthalate (PET) film ("FF-50" manufactured by UNITICA Co., Ltd.) as a supporting base was treated with a mold release treatment on one side of the PET film using a Mayer rod coater. , the thickness of the supporting substrate is 50 μm) on the surface of the mold release treatment, apply the adhesive obtained according to the above (4), and dry it in an oven at 90 ° C for 3 minutes to obtain the two layers of the supporting substrate and the adhesive layer. Formed adhesive film. In addition, three types of two-layer-adhesive films having an adhesive layer thickness of 4 μm, 8 μm, and 20 μm were produced by adjusting the application amount of the adhesive.

manufacture example 2

[0192] A polyethylene terephthalate (PET) film ("DIAFOIL T600E50 W07" manufactured by Mitsubishi Chemical Co., Ltd.) was used as a supporting substrate with a Mayer rod coater, and the PET film was coated on both sides, and the supporting substrate was The thickness is 50 μm) on one side, coating according to the adhesive obtained in (4) above, and with 90 ℃ of oven drying 3 minutes, obtain the adhesive film that is made of these two layers of PET film and adhesive layer. In addition, three types of two-layer adhesive films having an adhesive layer thickness of 4 μm, 8 μm, and 20 μm were produced by adjusting the application amount of the adhesive.

[0193] (7) Film processability

[0194] The external appearance of the adhesive film layer of the two-layer adhesive film obtained by said (5) and (6) was visually observed, and the result is collectively shown to Tables 1-3.

[0195] In addition, the appearance of the adhesive film was observed and judged according to the follow...

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Abstract

The present invention provides a thermosetting resin composition containing the following components (A) and (B), an adhesive containing the thermosetting resin composition and an organic solvent and / or water, and an adhesive film containing the thermosetting resin composition. (A) represents at least one phenolic resin selected from the group consisting of alkylphenolic novolaks, adducts of aliphatic polymers having double bonds with phenol, and adducts of alicyclic polymers having double bonds with phenol, and (B) represents an epoxy-containing ethylenic copolymer obtained by polymerizing the components (b1) and (b2): (b1) ethylene and / or propylene, and (b2) a monomer represented by the general formula (1): (1) wherein R is a hydrocarbon group having 2 to 18 carbon atoms and a double bond, at least one hydrogen atom of which group may be replaced by halogen, hydroxyl, or carboxyl; and X is a single bond or carbonyl.

Description

technical field [0001] The present invention relates to a thermosetting resin composition composed of a phenolic resin and an epoxy group-containing vinyl copolymer, an adhesive film obtained from the composition, and an adhesive film obtained by laminating and curing the adhesive film and an adherend. The resulting laminate. Background technique [0002] In recent years, in the field of electrical and electronic components, thinner and smaller has gradually been promoted, and as semiconductor packaging materials, solar cells or EL (electroluminescence) lamps and other electronic component packaging materials, integrated circuits / substrates Adhesives for electrical and electronic parts such as die bonding sheets between substrates and interlayer insulating layers between substrates, in addition to heat resistance to solder (hereinafter referred to as solder heat resistance), also have Low elastic modulus and thin film are required. Therefore, in order to simplify the man...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L15/00C08L61/06C08L61/08C08L65/00C09J7/10C09J7/35C09J123/02C09J161/06C09J163/00
CPCC08L61/06C09J2461/00C09J2463/00C08L63/00C09J7/00C09J7/35C08L2666/22C08G59/62C08J5/18C09J7/10
Inventor 藤木彻森俊树井山浩畅内藤茂树
Owner SUMITOMO CHEM CO LTD