Plating internal stress measurement program and plating internal stress measurement system

Abstract

In order to measure a plating internal stress, the plating internal stress measurement program in a plating internal stress measurement system makes a computer function as: a plating condition input mechanism for inputting a plating condition; a calculation formula data memory mechanism that memorizes in advance film thickness calculation formula data for calculating a plating film thickness and stress calculation formula data for calculating a plating internal stress; a film thickness calculation mechanism for reading the film thickness calculation formula data and calculating the plating film thickness at each timing during plating; a stress calculation mechanism for reading the stress calculation formula data and calculating the plating internal stress at the each timing during the plating; a stress data memory mechanism for memorizing the plating internal stress; and a stress output mechanism for outputting the plating internal stress calculated at the each timing during the plating.

Description

technical field [0001] The present invention relates to an electroplating internal stress measurement program and an electroplating internal stress measurement system, which are used to measure the internal stress of an electroplating film (hereinafter referred to as "electroplating internal stress" for short as required) by using a strain gauge, and are mainly used for research on electroplating , testing, production and production control. Background technique [0002] Generally, as a system for controlling plating conditions and plating results, paragraphs 0007 to 0010 of Japanese Patent Laid-Open Publication No. 2002-302800 and figure 2 As shown, an electroplating control system is disclosed. [0003] In the process of performing electroplating, in order to form the required electroplating film, the following conditions must be properly set when performing electroplating: a kind of electroplating solution; the temperature, pH value and concentration of the electroplatin...

AI Technical Summary

Problems solved by technology

However, because only at each timing in the electroplating process, the film thickness is reversely calculated by performing proportional calculations based on the film thickness when the electroplating is completed, and the reversely calculated film thickness is used, so it is not possible to obtain real-time data in the electroplating process. Each timing plating internal stress

[0013] Therefore, there is a problem that in the process of performing electroplating, plating internal stress cannot be obtained and controlled; and thus curling and / or cracks of the plating object eventually occur in the plating film

Images