Unlock instant, AI-driven research and patent intelligence for your innovation.

Method to recover spent components of a sputter target

A technology of sputtering target and mechanical method, applied to waste sputtering target and recovering components in waste target, the invention is in the field

Inactive Publication Date: 2005-11-30
CABOT CORP
View PDF7 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of such low melting point solders to bond the target substrate to the backing plate is not as versatile nor as reliable as the metallurgically attached bonding method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention relates to sputtering target assemblies. In particular, the sputter target assembly preferably has a tantalum or niobium target bonded to a backing plate. Some skilled in the art refer to a target bonded to a backing plate as a target substrate. Preferably, the target base is a tantalum or niobium target base. Alloys of niobium and tantalum may also be used herein, with preferred alloys containing a majority of niobium, tantalum, or both. The backing plate can be any conventional backing plate material used in the industry, such as copper, aluminum, titanium, any alloys thereof, and the like. For the purposes of the present invention, the composition of the backing plate is immaterial, although not necessarily, but is typically a material different from the target substrate material. For the purposes of the present invention, the purity, structure, and / or grain size of the target substrate can be any purity, structure, and / or grain size that is ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
purityaaaaaaaaaa
Login to View More

Abstract

A method to recover components of a sputter target assembly having a target bonded onto a backing plate is described. The method includes hydriding the tantalum or niobium target to a tantalum hydride or niobium hydride, respectively and then separating the tantalum hydride or niobium hydride from the backing plate. Sputter targets are further described as well as subsequent process steps.

Description

[0001] This application claims priority under 35 U.S.C. §119(e) to prior U.S. Provisional Patent Application No. 60 / 416,048, filed October 4, 2002, which is hereby incorporated by reference in its entirety. Background technique [0002] This invention relates to sputtering targets. More specifically, the present invention relates to spent sputtering targets and the recovery of components in the spent targets for subsequent use. [0003] Typically, sputter targets, such as tantalum sputter target assemblies, contain a tantalum target base bonded to a machined backing plate, typically made of copper or aluminum. During assembly, the backing plate is bonded to the target substrate using a low-melting solder as an adhesive, so that the spent target substrate and substrate can then be easily recycled by heating the assembly to a temperature above the melting point of the solder and then separating the two components Machined backing board. The use of such low melting point solder...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B34/24C23C14/34
CPCC22B34/24C22B7/002B22F9/023C23C14/3414Y02P10/20
Inventor 克里斯托弗·A·迈卡卢克罗伯特·B·福德
Owner CABOT CORP