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Base plate treater and treating method

A substrate processing method and substrate processing technology, which are applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as device differences

Inactive Publication Date: 2006-01-11
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even if multiple processing devices are set with the same parameters (more specifically, suggestions are parameters that affect the processing results), the background art device still has the problem of differences between devices.

Method used

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  • Base plate treater and treating method
  • Base plate treater and treating method
  • Base plate treater and treating method

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Embodiment Construction

[0025] FIG. 1 is a plan view of a substrate processing apparatus 100 according to a preferred embodiment of the present invention. The substrate processing apparatus 100 is responsible for, for example, resist coating, development, and accompanying heat treatment and liquid chemical treatment in a photolithography process for forming a specific circuit pattern on a semiconductor substrate (hereinafter, simply referred to as a "substrate"). For the convenience of explanation and description, in FIG. 1 and the drawings following FIG. 1 , the vertical direction is defined as the Z-axis direction, and the horizontal plane is defined as the XY plane. These definitions are for convenience in clarifying relative positions. In FIG. 1 and the figures following FIG. 1 , the directions discussed below are not limited to these definitions.

[0026] Referring to Fig. 1, the substrate processing equipment 100 of the first preferred embodiment of the present invention mainly includes 5 area...

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Abstract

A substrate processing apparatus comprises a plurality of second coating processing units responsible for coating, a gas supply mechanism for supplying clean air through a supply path, and a cell controller. Each of the second coating processing units is provided with a control plate and an exhaust fun unit. The opening of the supply path is controlled by adjusting the angle of rotation of the control plate. The cell controller adjusts the angle of rotation of each control plate based on a setting previously determined to independently control the amount of air supply to the second coating processing units. Thus the pressures within the second coating processing units are controlled such that the second coating processing units provide substantially the same processing result. As a result, the difference among the plurality of second coating processing units can be suppressed.

Description

technical field [0001] The present invention relates to atmosphere control in a substrate processing apparatus including a plurality of processing devices for performing predetermined processing on semiconductor substrates, glass substrates for liquid crystal devices, and the like. Background technique [0002] In the manufacturing process of semiconductor devices or liquid crystal devices, substrate processing equipment that performs various processes on semiconductor substrates or glass substrates is used. In such a substrate processing facility, a plurality of processing apparatuses in charge of one process are provided to improve throughput by parallel processing by the plurality of processing apparatuses. [0003] However, if multiple devices are simply provided, the devices responsible for performing the same process cannot function in exactly the same way, resulting in quality differences between processed substrates. Such quality differences are due to differences b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/00
CPCC03C17/002H01L21/67253H01L21/67017H01L21/67178H01L21/02
Inventor 杉本宪司稻垣幸彦
Owner DAINIPPON SCREEN MTG CO LTD