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Method and apparatus for control of layer thicknesses

A kind of equipment and substrate technology, applied in the direction of coating, semiconductor/solid-state device manufacturing, device for coating liquid on the surface, etc., can solve the problem of low efficiency

Inactive Publication Date: 2006-01-11
SINGULUS TECHNOLGIES AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Also, polycarbonate is a good thermal insulator, so cooling and / or heating liquids dispensed onto a surface with a plastic base is less efficient

Method used

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  • Method and apparatus for control of layer thicknesses
  • Method and apparatus for control of layer thicknesses
  • Method and apparatus for control of layer thicknesses

Examples

Experimental program
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Embodiment Construction

[0027] figure 1 The substrate 1 is shown on a support 2 . The base has a central hole which allows centering around the axis of rotation 3 . Arrows indicate the direction of rotation of the mount and base. The rotary drive is not shown. During the rotation, the excess liquid is rotated outwards, and the shutters 4 and 6 protect the surrounding environment from being polluted by this excess liquid.

[0028] figure 2 yes figure 1 An embodiment with a movable arm 11 with a radiation source 10. The movability of the support arm 11 is indicated by arrow 12 . It will be readily appreciated that the arms may be moved linearly, pivoted horizontally or vertically or in any other suitable manner so as to leave the area of ​​the base and stand. This is especially necessary when substrates are loaded onto or unloaded from racks. The loading and unloading mechanisms are not shown, but they can be inferred from the state of the art state of the art. Arrow 13 represents the effecti...

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PUM

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Abstract

It is shown a method and apparatus for distributing a viscous liquid over a surface of a substrate (1), e. g. a semiconductor wafer or a datastorage media, by conditioning the substrate thermally, locally specific before or during the spin coating process.

Description

technical field [0001] The invention relates to the field of substrate spin coating, in particular to a method and equipment for controlling coating thickness distribution by controlling the temperature distribution of the coating on the substrate. Background technique [0002] In the prior art, especially in the field of semiconductor manufacturing and certain fields of optics and biotechnology, liquids can be evenly distributed on substantially planar substrates by rotating the substrate about an axis perpendicular to the horizontal plane of the substrate surface. By applying a viscous liquid to the substrate surface during rotation, centrifugal force affects the radially outward distribution of the liquid on the surface. This "spin" process is used to dispense substances such as paint, resin, light stabilizer, etc. on semiconductor substrates. In addition, it is used in the production of optical data storage technology to provide a substantially uniform coating of resins...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C1/08H01L21/00B05C11/08
CPCB05C11/08H01L21/6715
Inventor 欧阳契
Owner SINGULUS TECHNOLGIES AG