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High density LED array

A high-density, LED array technology, applied in the field of light sources, can solve the problems of increasing cost and increasing light output

Inactive Publication Date: 2006-01-18
OSRAM SYLVANIA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even though LEDs are solid-state devices, the heat generated by the lamp becomes a problem requiring heat shields or heat dissipation add-ons, which increase the cost of the lamp while under the energy requirements necessary for some applications such as the automotive use mentioned above. The light output of the solid-state device increases with time when driven
When the density of the LED source increases as a function of the light output of the lamp, for example, using LEDs in headlight applications, the heat generated becomes a significant problem

Method used

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Embodiment Construction

[0015] For a better understanding of the invention, with additional objects, advantages and features thereof, reference is made to the following disclosure and appended claims taken in conjunction with the above-mentioned accompanying drawings.

[0016] With particular reference now to the accompanying drawings, Figure 1a Shown is a high density LED array 10 capable of representing X LEDs / unit area comprising a first LED having X / 2 LEDs 18 / unit area and X / 2 holes 20 aligned therewith. Surface 14 of the first printed circuit board 12 .

[0017] The printed circuit board 12 can be formed from two layers (see figure 2 ), a first layer 12a comprising a thermally conductive, electrically insulating material having conductive tracks 12b thereon, bonded to a metal plate 12c serving as a heat sink. The metal plate 12c can have legs 12d to further dissipate heat away from the active LEDs.

[0018] The second printed circuit board 22 has a surface 23 and can also be formed in two la...

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Abstract

A high-density LED array (10) capable of presenting a density of X LEDs / unit area has a first printed circuit board (12) having X / 2 LEDs / area and X / 2 apertures arrayed therewith. A second printed circuit board (22) is spaced from the first printed circuit board (12) and has X / 2 LEDs 28 / unit area. The LEDs (28) on the second printed circuit board are aligned with the apertures (20) in the first printed circuit board. Each of the LEDs (28) on the second printed circuit board (22) has an optical fiber (30) associated therewith and each of the light guides (30) extends through one of the apterures (20). Each of the mounted LEDs on the first printed circuit board can have an optical fiber associated therewith and the light guides can be bundled to direct light to a remote source.

Description

[0001] Cross References to Related Literature [0002] Applicants here claim the benefit of their provisional application No. 60 / 580526, filed June 17, 2004, for "Light Emitting Diode Lamps with Bundled Light Guides". technical field [0003] The present invention relates to light sources, and in particular to light sources using light emitting diodes (LEDs). In particular it concerns lamps with high density LED arrays. Background technique [0004] Due to their long service life and reasonable energy requirements, LED lamps have gained acceptance as an alternative to the more common incandescent type of lamp. These applications are in particular in the automotive industry which uses LED lamps as tail lights and brake lights, such as the required center high mounted stop lights (CHMSL). However, even though LEDs are solid-state devices, the heat generated by the lamp becomes a problem requiring heat shields or heat dissipation add-ons, which increase the cost of the lamp w...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V8/00H05K1/18F21W131/00F21Y101/02F21K9/61F21Y115/10
Inventor C・M・库谢恩M・塔克尔T・特斯诺R・约翰逊S・西德维尔
Owner OSRAM SYLVANIA INC