Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High performance silence aluminum extrusion radiating fin array

A heat dissipation fin and aluminum extrusion technology, which is applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., can solve the problems of difficult choice between noise and heat dissipation, and achieve the effect of low-cost manufacturing method

Inactive Publication Date: 2006-01-18
QUANTA COMPUTER INC
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increase of the flow field will make the bottleneck of noise and heat dissipation difficult to choose

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High performance silence aluminum extrusion radiating fin array
  • High performance silence aluminum extrusion radiating fin array
  • High performance silence aluminum extrusion radiating fin array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] In order to solve the bottleneck that is difficult to choose between noise and heat dissipation, the present invention proposes a high-efficiency sound-absorbing aluminum extruded fin array, by cutting oblique grooves on each fin in the array, and making the The radiating fins at the front and back of the groove diverge left and right. This structure helps to change the flow velocity distribution, and then makes the noise spectrum curve change accordingly.

[0014] Please refer to Figure 2A , which shows a schematic diagram of an aluminum extruded heat dissipation fin array according to a preferred embodiment of the present invention. Different from the existing aluminum extruded heat dissipation fin array, the aluminum extruded heat dissipation fin array 30 of this preferred embodiment cuts a plurality of oblique grooves 38 on each heat dissipation fin, and the oblique grooves 38 The extension direction is preferably an inverted V shape, so that no matter the flow f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a mute aluminum extruded radiant ribbed body array, which comprises a base and many radiant ribbed bodies, which are vertically positioned on the base. Between the radiant ribbed bodies there are intervals. Each radiant ribbed body uses two slope grooves to divide it into three radiant ribbed bodies, wherein the radiant ribbed body between the two sloping grooves bends to the intervals. When air current blows to the intervals of radiant ribbed bodies, it can meet the bending son radiant ribbed bodies so as to distribute flow speed and mute noise.

Description

technical field [0001] The invention relates to a high-efficiency sound-absorbing aluminum extruded heat dissipation fin array, in particular to a high-efficiency sound-absorbing aluminum extruded heat dissipation fin array applied to a notebook computer. Background technique [0002] As the computer responds to the market demand for thinner computers, it is no longer possible to reserve enough natural convection space inside the notebook computer casing for the space required by the heat dissipation design. Especially in high-frequency components (such as central processing units and graphics chips), they have already faced considerable bottlenecks in the implementation of thermal design. Therefore, increasing the rotation speed of the fan and increasing the average convection co-efficiency between the cooling fins and the air has become the main structure of the cooling mechanism of the notebook computer. [0003] Figure 1A A schematic diagram of an existing aluminum ext...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 黄玉年余顺达王正郁曾俊发
Owner QUANTA COMPUTER INC
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com