Liquid-cooling radiating system micro-pump

A heat dissipation system and micro-pump technology, applied in the direction of non-variable pumps, pumps, pump devices, etc., can solve the problems of impeding the rotation of the impeller, hindering the circulation of the working liquid, reducing the heat dissipation effect, etc., to reduce disturbance and improve the heat dissipation effect , the effect of improving cycle efficiency

Inactive Publication Date: 2006-05-17
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the working liquid enters the chamber from the liquid inlet pipe, the working liquid directly impacts the blades of the impeller, thereby generating disturbance in the chamber, hindering the rotation of the impeller and thus hindering the circulation of the working liquid and reducing the heat dissipation effect

Method used

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  • Liquid-cooling radiating system micro-pump
  • Liquid-cooling radiating system micro-pump
  • Liquid-cooling radiating system micro-pump

Examples

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Embodiment Construction

[0012] Please refer to figure 1 and figure 2 As shown, the micropump of the liquid cooling heat dissipation system of the present invention includes a casing 1 , an impeller set 2 assembled in the casing 1 and a driving unit 3 , wherein the impeller set 2 is driven to rotate by the driving unit 3 .

[0013] The casing 1 includes a hollow body 11 and an upper cover 10 and a lower cover 19 fastened with the body 11 . The upper and lower covers 10 , 19 are respectively fitted with the top end 101 and the bottom end 102 of the main body 11 to form an integral body. A sealing ring 108 is disposed between the upper cover 10 and the top end 101 of the body 11 to prevent leakage of working fluid. The lower end of the upper cover 10 is provided with an annular groove 106 matched with the sealing ring 108 . The upper cover 10 is also provided with a liquid inlet port 104 .

[0014] A baffle 14 is disposed inside the body 11 , thereby forming an upper chamber 15 and a lower chamber ...

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Abstract

The present invention relates to a micro pump of liquid-cooled heat-radiating system. It includes a shell body whose interior is a closed space, liquid inlet and liquid outlet which are communicated with said closed space and blade wheel group for driving circulating liquid. The shell body interior also is equipped with a partition board which can be used for separating said closed space into first containing cavity and second containing cavity. Said partition board is correspondent to the middle region of blade wheel group, and is equipped with a through hole communicated with said first containing cavity and second containing cavity, the blade wheel group is placed in said second containing cavity, said liquid inlet and liquid outlet are, respectively communicated with first containing cavity and second containing cavity. Besides, said invention also provides its working principle.

Description

【Technical field】 [0001] The invention relates to a micropump, in particular to a micropump of a liquid-cooled heat dissipation system. 【Background technique】 [0002] With the rapid development of electronic technology, the heat generated by electronic components such as central processing units is increasing day by day, and the problem of heat dissipation is becoming increasingly prominent. The heat dissipation device assembled by the traditional heat sink and fan has gradually failed to meet the heat dissipation requirements, and the liquid cooling heat dissipation system has gradually been widely used in the heat dissipation of electronic components. [0003] A general liquid-cooled heat dissipation system includes a heat-absorbing element that is in contact with a heat source to absorb the heat of the heat source, a heat-dissipating element that is equipped with a working liquid, and a pump body that promotes the circulation of the working liquid. Heat exchange takes p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F01P5/10F04D13/06
Inventor 李学坤赖振田周志勇
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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