Combining method of copper and aluminium alloy

A copper-aluminum alloy and diffusion alloy technology, applied in metal processing equipment, non-electric welding equipment, manufacturing tools, etc., can solve problems such as high interface thermal resistance, affecting thermal conductivity, interface impedance, etc., to improve thermal conductivity and reduce manufacturing costs , The effect of low process cost

Inactive Publication Date: 2006-06-14
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology

[0008] The mechanical pressing method is to press aluminum and copper together mechanically. Because aluminum is ductile, copper can be combined with aluminum at room temperature. For example, there is a cylindrical hole on the aluminum material. A copper material is cylindrical, and its diameter is slightly larger than the diameter of the aluminum hole. The copper column is squeezed into the aluminum hole by mechanical means. The combination effect of this method is also considerable, but there is a fatal The disadvantage is that when the copper is extruded into the aluminum hole, the inner surface of the aluminum hole is easily scratched by the copper, which seriously affects the thermal conductivity, and there is still a problem of high interface thermal resistance.
[0009] As an enhanced process of aluminum extrusion technology, although the copper-aluminum bonding technology effectively solves the problems mentioned above, the biggest problem of the copper-aluminum bonding technology is the serious interface impedance problem. If this problem cannot be solved in the process, then The effect of the finished product will not even be as good as that of an all-aluminum extruded product

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  • Combining method of copper and aluminium alloy
  • Combining method of copper and aluminium alloy
  • Combining method of copper and aluminium alloy

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Embodiment Construction

[0018] The copper-aluminum alloy bonding method of the present invention mainly overcomes the interface impedance problem when copper-aluminum alloy materials are bonded through heat treatment, thereby greatly reducing the interface thermal resistance and improving heat transfer performance.

[0019] The copper-aluminum alloy bonding method generally uses a fast-heating heating device, such as a heating furnace. The heating furnace is heated from the periphery through a resistance wire, and the maximum temperature can reach 1200 ° C. The inner material of the heating furnace is ceramics. The copper-aluminum alloy material of the present invention includes copper (Cu) material (pure copper or copper alloy) and aluminum alloy (Al) material (pure aluminum or aluminum alloy).

[0020] figure 1 It is a flowchart of the main steps of the copper-aluminum alloy bonding method of the present invention, figure 2 It is a schematic diagram of the copper-aluminum alloy material combinati...

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Abstract

A method for binding two CuAl alloy materials includes such steps as treating the surfaces to be bound, closing two surface tightly, putting them in heater, fast heating, holding the temp constant for alloy diffusion, and natural cooling.

Description

【Technical field】 [0001] The invention relates to a method for combining copper-aluminum alloy materials, in particular to a method for combining copper-aluminum alloy materials which can overcome the interface resistance and reduce the interface thermal resistance. 【Background technique】 [0002] Copper-aluminum materials are widely used in industrial production. The connection of copper and aluminum plays a very important role in the connection of dissimilar metals. There are many copper-aluminum alloy bonding technologies on the market. The most typical example of copper-aluminum alloy bonding technology is the heat sink process technology for cooling electronic components. [0003] The central processing unit (CPU) is a high-density heat source. First, the heat should be dispersed to a larger area, and then distributed into the air by the forced convection of the fan to achieve the purpose of heat dissipation. Heat is dissipated from the CPU core to the surface of the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/00B23K20/14
CPCC22F1/00C22F1/04C22F1/08
Inventor 洪居万骆长定方彝群吴荣源林雨利张朋朋
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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