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Heat pipe radiator

A heat dissipation device and heat pipe technology, which is applied in cooling/ventilation/heating transformation, instrument cooling, instrument and other directions, can solve the problems of not making full use of heat dissipation fins and small contact area, and achieve rapid heat dissipation, increase contact area, and transmit hot fast effect

Inactive Publication Date: 2006-10-04
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small contact area between the upper end of the heat pipe and the heat dissipation fins, the heat transferred to the upper part of the heat dissipation fins is relatively small, and the upper part of the heat dissipation fins cannot be fully utilized to give full play to the heat transfer performance of the heat pipe. This situation is more obvious when the longitudinal and horizontal dimensions of the cooling fins are larger

Method used

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Examples

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Embodiment Construction

[0014] see figure 1 The heat pipe cooling device of the present invention is used to be installed on heating electronic components such as a central processing unit (not shown in the figure) to dissipate heat. The heat pipe cooling device includes a heat sink 10 , heat pipes 20 connected to the bottom, middle and top of the heat sink 10 , and a fan structure 30 installed on one side of the heat sink 10 .

[0015] Such as Figure 2-3 As shown, the heat sink 10 includes a base 12 , a cooling fin set 14 disposed on the upper surface of the base 12 , and a cover plate 16 sandwiching the cooling fin set 14 and the base 12 . The lower surface of the base 12 is attached to the surface of the central processing unit, a pair of parallel semi-cylindrical first grooves 120 are opened on the upper surface, and a pair of vertical sides of the base 12 and the first groove 120 are opened. Orifice 122. A pair of parallel semi-cylindrical second grooves 160 are defined on the lower surface ...

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Abstract

The invention relates to a heat pipe heat abstractor which comprises a heating radiator and at least one heat pipe, wherein the heating radiator comprises a base which can touch the electric unit and a dissipating heat finned group positioned on the base; the heating radiator also comprises a cover plate which is touched with the dissipating heat finned group; one side of the dissipating heat finned group forms a groove; the two ends of the heat pipe is touched with the base and the cover plate; the middle part is touched with the groove rim of the dissipating heat finned group.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat pipe heat dissipation device for cooling electronic components. 【Background technique】 [0002] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially the central processing unit) are constantly increasing. However, high frequency and high speed will increase the heat generated by electronic components, causing their temperature to rise continuously, which seriously threatens the performance of electronic components during operation. In order to ensure the normal operation of electronic components, a large amount of heat generated by electronic components must be discharged in time heat. [0003] For this reason, the industry uses heat sinks to carry out auxiliary heat dissipation for electronic components. The existing heat sinks include a base and a number of cooling fins arranged on th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G12B15/06H01L23/34G06F1/20
Inventor 李学坤赖振田谭治斌
Owner FU ZHUN PRECISION IND SHENZHEN