Heat radiating device

Abstract

The invention relates to a heat dissipation device used for dissipating the heat of an electronic element, which comprises a base having a bottom contacted with the electronic element, a radiator and a thermotube used for connecting the base and the radiator. The thermotube comprises a heat-absorbing section combined with the top of the base and bends consecutively to form horizontal heat-absorbing section that are parallel to each other, a first heat-discharging section and a second heat-discharging section, and the first heat-discharging section and the second heat-discharging section are far away from the heat-absorbing section. The radiator comprises a first heat dissipation fin assembly and a second heat dissipation fin assembly which are horizontally arranged side by side. The first heat dissipation fin assembly and the second heat dissipation fin assembly are provided with a joint face for mutual joint; a plurality of grooves for containing the heat-discharging sections of the thermotube are arranged on the joint faces of the first heat dissipation fin assembly and the second heat dissipation fin assembly corresponding to the first heat-discharging section and the second heat-discharging section of the thermotube. The heat is widely and evenly transferred to the heat dissipation fins through few thermotubes by the heat dissipation device, therefore, the heat dissipation capacity of the heat dissipation device is enhanced and the cost of the dissipation device is reduced.

Description

Technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device used for heat dissipation of electronic components. Background technique [0002] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially the central processing unit) continue to increase, and the heat generated by them increases, making their temperature continue to rise, which seriously threatens the performance of electronic components during operation. To ensure the normal operation of electronic components, the large amount of heat generated by the electronic components must be discharged in time. [0003] For this reason, the industry usually uses a kind of heat sink to dissipate heat from electronic components. These existing heat sinks all include a base and a number of heat sink fins arranged on the base. The heat sink base is a solid metal with a smooth bottom surface fo...

AI Technical Summary

Problems solved by technology

However, because the upper end of the heat pipe is only in contact with the heat dissipation fin once, the heat transferred to the upper part of the heat dissipation fin is relatively small, and the upper part of the heat dissipation fin cannot be fully utilized in the heat dissipation process, and the heat transfer distance of the heat pipe cannot be fully utilized. , Fast heat transfer performance, this situation is more obvious when the longitudinal and horizontal dimensions of the cooling fins are larger

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