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Thimble device

A technology of thimble and ejector pin, which is applied in the manufacture of electrical components, semiconductor/solid state devices, circuits, etc. It can solve the problems of reduced work efficiency, chip damage and fragmentation, and the failure of the manipulator to transfer chips normally, so as to avoid chip jumping and production. inefficient effect

Active Publication Date: 2006-10-25
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

However, using the method of time control will also cause certain problems. Taking the unipolar electrostatic chuck as an example, if the time for continuing to generate plasma is too short, it will cause the chip to be damaged and broken or jump when the mechanical thimble device is raised. film, so that the manipulator cannot transfer the film normally; if the plasma continues to be generated for too long, the work efficiency will be reduced

Method used

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Embodiment Construction

[0019] The specific implementation of the thimble device of the present invention will be further described in detail below in conjunction with the accompanying drawings, but it is not used to limit the protection scope of the present invention.

[0020] see figure 2 , image 3 and Figure 4 . The thimble device of the present invention includes a thimble 4, and the thimble 4 includes a thimble body 15 and a thimble rod 11, wherein a slot is provided in the thimble body 15, and the thimble rod 11 is inserted in the slot, and the thimble A space 16 is provided between the bottom end surface of the ejector rod 11 and the bottom wall of the slot. The height of the space 16 is 1 mm, and the height is feasible within the range of 0.5 mm to 2 mm. A spring 12 and a position sensor 14 are housed in the space 16 . The spring 12 can be replaced by other height deformers such as dampers. The force generated by the deformation of the spring 12 at about 0.1 mm is slightly greater tha...

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Abstract

This invention relates to a semiconductor etching device, in which, the thimble device includes a thimble containing a main body and a mandril, a slot is set in the main body and plugged with the mandril and a space is set between the bottom surface of the mandril and the bottom wall of the slot and a height deformer and a position sensor are set in the space, the deformed volume of the deformer is 0.05-1.2mm, which applies an telescopic thimble to test the deformation volume of a spring contacting with a wafer when the thimble rises to test the residual charge of the wafer then puts up the wafer to finish the transmission of the manipulator.

Description

technical field [0001] The invention relates to semiconductor etching equipment, in particular to a thimble device for supporting wafers in a plasma reaction chamber. Background technique [0002] In general, electrostatic chucks are used for microelectronic chip processing, mainly in plasma etching, CVD and other equipment. By adding a DC voltage to the DC electrode of the electrostatic chuck, the wafer generates an opposite voltage, thereby generating electrostatic adsorption. The force makes the wafer stick to the electrostatic chuck. After the etching process is completed, due to the residual electrostatic charge on the wafer, it is necessary to add a reverse voltage (bipolar electrostatic chuck) or continue the plasma state (unipolar electrostatic chuck) to remove the electrostatic charge of the wafer, take out the wafer, and transfer it to the next piece Wafers to be processed. [0003] figure 1 , describing the fundamentals of plasma etching (ICP). According to th...

Claims

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Application Information

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IPC IPC(8): H01L21/687C23F4/00
Inventor 赵梦欣
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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