Thimble device

A technology of thimble and ejector pin, which is applied in the manufacture of electrical components, semiconductor/solid state devices, circuits, etc. It can solve the problems of reduced work efficiency, chip damage and fragmentation, and the failure of the manipulator to transfer chips normally, so as to avoid chip jumping and production. inefficient effect
CN1851898AActive Publication Date: 2006-10-25BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Publication Date
2006-10-25

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Abstract

This invention relates to a semiconductor etching device, in which, the thimble device includes a thimble containing a main body and a mandril, a slot is set in the main body and plugged with the mandril and a space is set between the bottom surface of the mandril and the bottom wall of the slot and a height deformer and a position sensor are set in the space, the deformed volume of the deformer is 0.05-1.2mm, which applies an telescopic thimble to test the deformation volume of a spring contacting with a wafer when the thimble rises to test the residual charge of the wafer then puts up the wafer to finish the transmission of the manipulator.
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Description

technical field

[0001] The invention relates to semiconductor etching equipment, in particular to a thimble device for supporting wafers in a plasma reaction chamber. Background technique

[0002] In general, electrostatic chucks are used for microelectronic chip processing, mainly in plasma etching, CVD and other equipment. By adding a DC voltage to the DC electrode of the electrostatic chuck, the wafer generates an opposite voltage, thereby generating electrostatic adsorption. The force makes the wafer stick to the electrostatic chuck. After the etching process is completed, due to the residual electrostatic charge on the wafer, it is necessary to add a reverse voltage (bipolar electrostatic chuck) or continue the plasma state (unipolar electrostatic chuck) to remove the electrostatic charge of the wafer, take out the wafer, and transfer it to the next piece Wafers to be processed.

[0003] figure 1 , describing the fundamentals of plasma etching (ICP). According to th...

Claims

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