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Metal contact lga socket

A grid array and contact technology, which is applied in the field of contact grid array socket and its manufacturing, can solve the problems of reduced elasticity and reduced normal force of contact interface.

Active Publication Date: 2006-10-25
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Consequently, their elasticity is reduced and the normal force applied to the contact interface is also reduced

Method used

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  • Metal contact lga socket
  • Metal contact lga socket
  • Metal contact lga socket

Examples

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Embodiment Construction

[0068] The present invention relates to land grid array (LGA) interconnects and methods of making the same. As used herein, the term LGA is meant to define many different interconnects. For example, it may be interpreted to mean a chip interconnected on a printed circuit board. However, it can also mean a board-to-board interconnection. In this application, the invention will be described in terms of interconnections on chips.

[0069] First refer to figure 1 , which shows that the LGA interconnect 2 includes an insulating housing 4 that holds and positions a substrate 6 connected thereto, wherein the substrate 6 supports a plurality of contact assemblies 8 in a fixed array as shown. pass figure 1 It should be understood that the housing 4 includes a plurality of peripheral walls 10 , 12 , 14 and 16 , all of which form an internal chip-receiving slot, generally indicated herein by reference numeral 20 . It should be further understood that the housing 4 includes corner st...

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PUM

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Abstract

A land grid array interconnect (2) comprises a substrate (6) and a plurality of contact assemblies (8) . The substrate has a plurality of apertures (90) therethrough arranged in an array. Each of the contact assemblies includes an insulative member (112) that holds a conductive contact (110), and each said insulative member is positioned in a respective one of the apertures. Each said conductive contact includes an upper contact portion (116) extending above the substrate and a lower contact portion (118) extending below the substrate. The insulative member isolates its respective conductive contact from the substrate.

Description

technical field [0001] The invention relates to a land grid array (Land Grid Array, LGA) socket and a manufacturing method thereof. Background technique [0002] Various packages or devices exist in the computer industry that require interconnection to printed circuit boards. These devices have contacts or solder balls placed at 1.0mm centerline spacing and below. These devices are constructed in 50 x 50 or even larger arrays. Considering the number of contacts, their center-to-center spacing and considering the forces applied to the respective contacts, various problems are encountered when these devices are attached to a printed circuit board. [0003] Sockets exist for interconnecting such devices, wherein the sockets include columns of conductive polymer to allow interconnection between the devices and a printed circuit board. However, these devices also suffer from some problems. For example, conductive polymers may creep over time and after temperature exposure and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/10
Inventor 戴维·A·特劳特杰弗里·B·麦克林顿基思·M·穆尔彼得·C·奥唐奈霍利斯·P·雷蒙德戴维·B·赛尼西阿塔利·S·泰勒安德鲁·D·巴尔萨泽理查德·N·怀恩达里尔·L·沃茨
Owner TE CONNECTIVITY CORP