Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for determining machinery processing sequence and manufacturing system therewith

A technology for manufacturing systems and machines, used in semiconductor/solid-state device manufacturing, instruments, special data processing applications, etc., and can solve problems such as lost delivery time and delays

Inactive Publication Date: 2006-11-01
POWERCHIP SEMICON CORP
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, due to variation among machines, machines in the same group are prohibited from producing some products. In addition, the production capacity of each process machine is limited. If the priority assignment of machines is not appropriate, it will cause loss of output and delay in delivery

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for determining machinery processing sequence and manufacturing system therewith
  • Method for determining machinery processing sequence and manufacturing system therewith
  • Method for determining machinery processing sequence and manufacturing system therewith

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are listed below and described in detail in conjunction with the accompanying drawings.

[0014] The embodiment of the present invention discloses a method and system for determining the order of machine dispatching. In solving the problem of machine dispatching, a supply chain planning tool (such as the MCP developed by ADEXA) is adopted. (Material & Capacity Planner)), which is used to estimate the output and time of each batch per day, and even determine the input and output in the production plan within half a year. As for the mixed production mode mentioned above, the production demand is divided into two parts, one is order production, and the other is stock production. Because each batch has a production deadline for order production, when the estimated production When the delivery time may exceed the deadline, it will enjoy th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention is for use in a semiconductor fabrication system and provides a first machine and a second machine, and a first semiconductor technology and a second semiconductor technology capable of being executed by said machines. The quantity of output required by first and second semiconductor technology is calculated. The tasking priority of first and second machine is determined by using a statistical method, wherein the said statistic method is a two stages data feedback method. The execution process comprises the following steps: in the first stage, the machine tasking sequence where the priority is not set is executed to get the machine utilization rate; in the second stage, the result obtained from the first stage is used; wherein, if the first machine has a lowest utilization rate, then the tasking priority of the first machine is set into the first tasking priority, and meanwhile the tasking priority of the second machine is set into the second tasking priority.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a method for determining the dispatching sequence of machines in a semiconductor manufacturing system, so as to achieve both on-time delivery and maximum output. Background technique [0002] In the semiconductor fab (Fab), regarding the setting of production goals, foundries with diversified production require on-time delivery, while memory fabs with relatively simple products require maximization of machine utilization and output. If a memory factory transforms into a foundry, its production mode will be mixed mode, half of which will be made to order (make to order), and the other half will be made to stock (make to stock), that is, both on-time delivery and Maximum output. However, there is a trade-off relationship between cycle time and utilization, and the assignment of bottleneck machines will seriously affect the cycle time and utilization, coupled with machine-to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00G06F17/00
Inventor 曾丽娟刘志能傅嘉仁
Owner POWERCHIP SEMICON CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products