39 results about "Semiconductor fab" patented technology

An address-transparent device is disclosed that couples between two network interfaces in a semiconductor fab for communicating packets between a host coupled to a first network interface and a tool coupled to a second network interface. Alternatively, the address-transparent device couples between two networks in a semiconductor fab for communicating packets between a host on a first network and a tool on a second network. In a first aspect of the invention, the address-transparent device routes packets between the first network and the second network that is independent of any protocol. The address-transparent device couples to the host through the first network and couples to the tool through the second network where the address-transparent device having a first port with no IP address and a second port with a subnet IP address. In a second aspect of the invention, the address-transparent device intercepts packets for local use by a data consumer that resides within or outside of the address-transparent device. The address-transparent device can intercept all or a portion of data streams, while forwards other portions of data streams to a destination. The header of the original packet is stored for subsequent use for sending a reply to an intercepted packet. In a third aspect of the invention, the address-transparent device reroutes packet to another destination by changing the header of the received packet. The header of the original packet is modified, replacing the original header information with the header information of the destination device. The header of the original packet is stored for subsequent use for sending a reply to a rerouted packet.

The invention relates to a measurement device for stray inductance in an IGBT module. The measurement device is characterized in that the measurement device comprises a power supply device, a to-be-measured IGBT module, a current probe, a voltage probe, an oscilloscope, a pulse triggering device, controllable switches S1, S2, S3, a DC capacitor C1, a DC discharging resistor R1, a load inductor L1 and a freewheeling diode D1; the controllable switch S2 is serially connected with the DC discharging resistor R1 and is parallelly connected with the DC capacitor C1; the freewheeling diode D1, the controllable switch S3 and the to-be-measured IGBT module are serially connected; the pulse triggering device is connected with the controllable switch S3; and the load inductor L1 is parallelly connected with two sides of the freewheeling diode D1. The measurement device can effectively evaluate induction voltage of an inner packaging parasitic parameter when the IGBT module is in a switching-off transient state. The packaged stray inductance which is calculated according to the voltage and current over two ends of a parasitic inductor is more practical and can be used for evaluating an IGBT safety margin, and furthermore can be used for verifying IGBT module designing. The measurement device and the measurement method have a certain meaning to semiconductor manufacturers and IGBT application parties.

The present invention provides a method for improving the efficiency of a product manufacturing process such as a semiconductor fab process, wherein a given step of the process has a quality result which can be actually measured on each product or group of products, and wherein the process comprises a subsequent, adjustable step, the method comprising:—providing a correlation model of the behavior of said given step as a function of available parameters;—for each product or group of products at the output of said manufacturing step, computing a predicted quality result based on said correlation model as a function of the actual values of the parameters during the manufacturing step, and—providing the quality result to a control system for adjusting said subsequent step.

A semiconductor wafer design and process having test pads (36) reducing cracks generated during the wafer saw process from extending into and damaging adjacent die. The present invention provides a plurality of circular test pads (36) in a wafer scribe street (34) such that any cracks generated in the test pad during wafer saw self terminate in the periphery of the circular test pad. By providing a curved test pad periphery, cracks will tend to propagate along the edges of the test pads and self terminate therein. The circular test pads avoid any sharp corners as is conventional in rectangular test pads which tend to facilitate the extension of cracks from corners to extend into the adjacent wafer die (32). The present invention utilizes existing semiconductor fab processing and utilizes new reticle sets to define the curved test pads.

The invention provides a method for controlling the doping density of a doped region of a semiconductor device accurately. In the method, a silicon wafer is oxidized; a photoresist is added to a boron emulsion source in the coating process; and the boron emulsion source is mixed with the photoresist, and the mixture is placed in a stirring vessel for sufficient stirring so as to obtain an emulsion source coating liquid, wherein the photoresist is carbonized at a high temperature to so as to remove gases carried in the diffusion process, thus obtaining the required impurity density distribution in a boron region. The method is easy and convenient to operate, simple in equipment and is suitable for massive production. The diffusion parameters of the method can be controlled and adjusted freely; the doping density is adjustable; a silica oxidation layer is formed on the silicon wafer by diffusible oxidation; the thickness accuracy in oxidization is controlled so as to reach the density for controlling diffusion impurities accurately; the technological process is simplified; the production cost is reduced; and the yield of the semiconductors is improved by over 20%. The method is particularly suitable for low and medium-grade semiconductor manufacturers to produce the semiconductors massively; and the method has the advantage of remarkable economic benefit.

A design-based manufacturing optimization (DMO) server comprises a distributed computing system and a DMO software module incorporating with a design scanner to scan and analyze design data of a semiconductor device for optimizing manufacturing of the semiconductor device. The DMO software module sets up a pattern signature database and a manufacturing optimization database, generates design-based manufacturing recipes, interfaces with manufacturing equipment through a manufacturing interface module, and interfaces with electronic design automation suppliers for the design data through a design interface module. The DMO server executes the design-based manufacturing recipes for manufacturing optimization.

The present invention relates to a full-automatic wafer appearance inspection system which comprises a wafer box opening carrier, a wafer taking and placing manipulator, a wafer position calibration mechanism, a wafer turnover mechanism and a microscope detection mechanism, the wafer box opening carrier is used for opening a wafer conveying box, the wafer taking and placing manipulator is used for carrying wafers, and the wafer position calibration mechanism is used for determining the circle center position of the wafer and rotating the wafer to a specified angle; and the wafer turnover mechanism is used for turnovering a wafer so as to inspect the back surface of the wafer, and the microscope detection mechanism inspects the surface of the wafer. The wafer can be automatically transmitted to the microscope for observation, so that damage caused by manual carrying is avoided; the surface and the back surface of the wafer can be visually inspected; and linear motion is adopted in the transmission process, and the wafers are prevented from being thrown out. The system is suitable for being used in semiconductor factories and wafer test factories.

Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconductor fab plant. A machine-vision system for imaging an object having a first side and a second side includes an imager, and an optics apparatus that images two or more views of the first side of the object and images two or more views of the second side of the object. The two or more views of the first side and the second side of the object are each from different angles. The object includes at least one major surface. A divider background surface is placed near the at least one major surface of the object to obtain separate images of features of the object on the first side of the object and features of the object on the second side of the object. In one embodiment, the divider diffuses light to back light the features on the object on the first side and back light the features on the second side of the object.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. The tool pedestal/pad for modern semiconductor FABs are required have very small tolerance to ambient vibration. Therefore, reduction and isolation of vibration of tool pedestal/pad is the key requirement for safe, reliable and uninterrupted operation of modern semiconductor FABs. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam.

The invention discloses a scrubbing tower used for acidic and alkaline exhaust gas of semiconductor plants. The scrubbing tower comprises a circulation detergent box. A porous separation plate is arranged at the middle of the circulation detergent box. The part of the circulation detergent box below the separation plate is used for collecting a detergent. A filling material used for increasing the contact area between the acidic and alkaline exhaust gas and the detergent is arranged on the separation plate. The scrubbing tower also comprises a circulation pump and a circulation pipeline. The circulation pump is connected with the circulation detergent box through the circulation pipeline, and is used for driving the circulation flow of the detergent. The scrubbing tower also comprises a liquidometer which is arranged on the lower part of the circulation detergent box and is connected with the circulation detergent box through a connection device. A filtering device is arranged on the connection device. With the scrubbing tower provided by the invention, impurities and scraps of filling materials can be effectively prevented from entering the liquidometer and damaging the liquidometer; and scrubbing tower scrubbing effect is prevented from being affected by excessively low liquid level in the scrubbing tower. The scrubbing tower has a simple structure, and provides an excellent processing effect upon semiconductor plant acidic and alkaline exhaust gases.

The invention discloses the protection circuit between the standard mechanical interface and the fabricating desk. First, the fabricating desk utilized in the semicondutor industry, the protection circuit and the automatic transport machining with the standard mechanical interface are provided. The protection circuit and the automatic transport machine with the standard mechanical interface are provided. The protection circuit includes at least the voltage sensing element, the logic assembly and the two luminous elements. The protection circuit through the voltage-sensing element receives the signal output by the fabricating desk and through the logic assembly makes the logic judgement to the signal output from the fabricating desk. The protecting circuit through the two luminous element displays the state of the fabricating desk and outputs the logic signals to the standard mechanical interface so as to control the operation of the automatic arm.