38 results about "Semiconductor fab" patented technology

The invention relates to the technical field of communication, and particularly discloses a front-end communication circuit and a communication method, and the front-end communication circuit comprises a communication chip, a first external change-over switch and a second external change-over switch. The communication chip is provided with a first transceiver interface, a second transceiver interface and a third transceiver interface. The first external change-over switch is configured to selectively route a middle-high frequency band signal to the first transceiving interface or allow the signal to be input through the second transceiving interface or the third transceiving interface; meanwhile, the second external change-over switch is used for switching the MIMO radio frequency signal to the second transceiver interface or the third transceiver interface. All the selected signals are finally input into the communication chip through corresponding interfaces to be processed. According to the scheme, flexible frequency band combination and carrier aggregation configuration can be supported so as to meet the differentiation requirements of global 5G frequency bands. In addition, through dynamic configuration of an external switch and an interface, a single hardware design can be compatible with module schemes of multiple domestic semiconductor manufacturers, and repeated development investment is avoided.

Apparatus and methods for process tool tending in a semiconductor fab are disclosed. In certain embodiments, a robot includes a robotic arm and a turntable that rotates relative to the robotic arm. The turntable holds at least one lot box storing a wafer cassette of semiconductor wafers, and the robotic arm includes an end-effector operable to manipulate the lot box. Accordingly, the robot handles wafer lot boxes to improve semiconductor fab throughput by automating unloading and loading processes that are conventionally performed manually. For example, the robot can transport a wafer lot box to a point of use, remove the wafer cassette from the lot box, load the wafer cassette into a tool at the point of use, remove the wafer cassette from the tool after processing, reload the wafer cassette into the lot box, and transport the lot box to the next point of use.

The invention discloses a semiconductor plant collaborative construction and delivery method integrating BIM and digital twinning, and belongs to the technical field of plant construction. The invention discloses a semiconductor plant collaborative construction and delivery method fusing BIM and digital twinning. The method comprises the following steps: acquiring related data of a semiconductor plant; carrying out BIM (Building Information Modeling) and digital twin base construction; monitoring the construction progress of the semiconductor plant; carrying out visual acceptance check; and generating a delivery result. According to the invention, the problems of equipment installation coordinate deviation, pipeline gradient abnormity and the like in the prior art are difficult to find in time are solved, the dynamic precision verification of the construction process can be realized, the construction progress and the quality acceptance result can be obtained in real time, the communication cost caused by information asymmetry is avoided, and the construction efficiency is improved. The whole life cycle tracing of each component is realized through the component ID, detailed information can be quickly obtained without on-site investigation during subsequent asset checking and transformation, and the efficiency is greatly improved.

The invention discloses a spatial position adjusting mechanism and adjusting method for a light receiving device, and the mechanism comprises a circumferential adjusting module and a channel adjusting module, and the circumferential adjusting module drives the light receiving device to move in the circumferential direction of a wafer, and is used for adjusting the circumferential light receiving angle of the light receiving device. The channel adjusting module adjusts the inclined light receiving angle of the light receiving device according to the inclination angle of the scattered light in a spatial range with the inclination angle larger than 0 degree and smaller than or equal to 90 degrees relative to the surface of the wafer, and the range covers wide and narrow channels of the scattered light generally understood in the field. According to the spatial position adjusting mechanism of the light receiving device, the flexibility of wafer defect detection is improved, and the requirement of a semiconductor manufacturer for flexible detection of specific types of defects can be met.

The invention relates to the field of battery exchange station equipment, in particular to an automatic battery exchange station which comprises a bottom plate used for supporting, a cabinet fixedly arranged on the upper portion of the bottom plate and three battery charging assemblies, and the three battery charging assemblies are arranged on the front portion of the inner end face of the cabinet at equal intervals. Batteries are fixedly clamped in the three battery charging assemblies, and the battery charging assemblies are used for charging the batteries. The automatic battery exchange station is an automatic AMR battery exchange system specially designed for the environment of a clean room of a semiconductor FAB wafer factory, during battery exchange, seamless battery exchange of multiple AMRs can be supported, efficient, stable and safe battery management is ensured, the battery exchange efficiency is improved, meanwhile, the charging and battery exchange process is fully automatic, and the battery exchange efficiency is improved. And in addition, operation under the Class 100 cleanliness environment is supported, the strict FAB manufacturing requirement is met, and the operation stability and safety of equipment are improved.

The present application relates to a semiconductor factory production data analysis and presentation method and system based on multi-agent cooperation. First, access to multi-source heterogeneous production data and standardization processing. Subsequently, a plurality of serial special ability agents are executed in turn: data agent classifies and stores data; aggregation analysis agent performs cross-system calculation to generate comprehensive indicators; scene recognition agent matches real-time data with preset rules to identify the current running scene; key parameter recommendation agent outputs a sorted key parameter list according to the scene. Finally, the scene, indicators and parameter list are integrated and visualized through a leadership cockpit with natural language interaction function, and can respond to user queries to trigger reanalysis. Through agent cooperation, the present application realizes automatic data processing, scene recognition and dynamic key parameter recommendation, and solves the technical problem of quickly focusing on core production problems from isolated data.

The invention belongs to the technical field of computer system design, and particularly relates to an airborne dual-redundancy ARINC429 circuit based on logic switching, which is used for realizing reliable communication of an airborne ARINC429 interface and comprises an ARINC429 transceiving circuit and an FPGA (Field Programmable Gate Array) minimum system circuit which are communicated with each other, a modular design method is adopted, an ARINC429 circuit is abstracted into a plurality of functional modules, and the functional modules comprise a redundant backup channel circuit, a self-checking channel circuit, a logic switching circuit and a minimum system circuit. And each functional circuit module can be realized by adopting chip design of different semiconductor manufacturers according to specific application scenes, so that the flexibility of the circuit is improved.

The invention relates to the technical field of electronic water pumps, in particular to a liquid-cooled electronic water pump which comprises a pump base, a pump body arranged at the top end of the pump base and a pump head installed at one end of the pump body, the electronic water pump can conduct liquid cooling heat dissipation so as to be free of external environment limitation, liquid cooling is higher than traditional air cooling efficiency, the temperature of a motor can be accurately controlled, and the service life of the motor is prolonged. Operation heat is absorbed by liquid in the sealing cover and then is discharged through the leading-out pipe, the environment temperature and humidity are not interfered, the electronic water pump is matched with scenes such as semiconductor plants and data machine rooms, and meanwhile through the arrangement of the waste heat dissipation assembly, after the electronic water pump is stopped, cooling liquid in the water drainage box is sprayed to a pump body and cooling fins through a water drainage head of a liquid drainage pipe for waste heat dissipation; the cooling liquid after heat dissipation finally flows into the receiving box to be collected, the whole process is uninterrupted, the temperature of the motor in the pump body can be slowly reduced to a safety interval, damage of waste heat to core components of the pump body is effectively avoided, the overall service life is prolonged, and the operation stability during follow-up starting is guaranteed.

The present invention relates to a damper structure for increasing the initial rigidity of a semiconductor FAB structure and, more specifically, to a damper structure provided in a building so as to buffer impact and vibration, comprising: a guide frame body for connecting an upper structure and a lower structure of the building to each other; and a damper unit fastened to the guide frame body, and the damper structure supporting a structure comprises the guide frame body and the damper unit, and thus has improved constructability, is easily replaced and maintained, has improved efficiency since the damper unit is composed of a plurality of damper members, can effectively buffer vibration or impact due to earthquakes or external impact, and has improved resistance to shear deformation and axial deformation.

The present application discloses a clean room for semiconductor manufacturing plants, belonging to the technical field of clean rooms. The clean room comprises a clean workspace, comprising a clean work area for high-precision processing and a processing service area for semiconductor pre-processing. A partition is provided between the clean work area and the processing service area, wherein curtains are provided at intervals within the partition. The curtains are arranged along the length of the partition, and filter assemblies for filtering air are provided on both sides of the adjacent curtains, each of which is spaced apart from each other. The filter assemblies include a first filter and a second filter arranged at intervals along the partition. A first ventilation system for conveying clean air is provided in both the clean work area and the processing service area, and a second ventilation system for conveying clean air is provided in the partition. The present application has the effect of improving the air cleanliness within the clean room.

The invention provides a production schedule Gantt chart drawing method, device and equipment for a semiconductor factory, and belongs to the field of semiconductor manufacturing, and the method comprises the steps: receiving work order schedules of all processing machines, and determining the time granularity of a time axis of a Gantt chart according to the work order schedules; constructing a data structure hierarchy corresponding to the processing machine to display the association between the business scenes; receiving a real-time Gantt chart fed back by rendering, receiving interface data corresponding to each processing machine, calculating the interface data, and drawing task bars forming a business scene according to time granularity through each Gantt chart component to obtain a real-time Gantt chart corresponding to the work order schedule; and displaying the real-time Gantt chart so as to carry out dragging modification on the task bar, and outputting the real-time Gantt chart after dragging verification. According to the processing scheme provided by the invention, different Gantt chart levels are designed for different types of machine processing flows in a semi-conductor factory, and an association relationship is established; and the page time axis granularity can be adjusted, and more comprehensive information can be displayed.

The utility model relates to an electrostatic chuck cleaning clamp. The electrostatic chuck cleaning clamp comprises a plurality of connecting parts and a plurality of adjusting parts arranged on the connecting parts. Every two adjacent connecting parts are connected through one adjusting part, and the adjusting parts and the connecting parts are arranged in a matched mode to define a regular polygon containing space used for containing an electrostatic chuck. The adjusting part adjusts the size of the regular polygon containing space so as to adapt to different electrostatic chucks. According to the utility model, the electrostatic chuck can be quickly placed upside down, and the cleaning surface is ensured to be completely exposed in the cleaning liquid without being blocked; meanwhile, various cleaning clamps with different models and sizes can be defined by adjusting the position relation between the adjusting component and the connecting component, and the electrostatic chuck cleaning clamp has the advantages of being efficient and convenient to use and can well meet the actual requirement of current semiconductor factories for electrostatic chuck cleaning.

The utility model discloses a semiconductor factory affair comprehensive waste gas treatment device which comprises an oxygen catalyst of an existing structure, at least one waste gas treatment mechanism connected with the oxygen catalyst and an ionization treatment mechanism which are connected in sequence, the waste gas treatment mechanism comprises a shell, and a containing cavity is formed in the shell. An inlet is formed in the first side of the lower bottom face of the shell, and an outlet is formed in the second side of the top of the shell. An air guide pipe is integrally formed at the inlet towards the interior of the containing cavity, a plurality of air holes are formed in the end of the air guide pipe, solid filler or liquid filler is arranged in the containing cavity, and a bent part is arranged on the air guide pipe so that the air holes can be located in the solid filler or the liquid filler. The waste gas treatment mechanism adopted by the utility model can react with solid or liquid fillers in a multi-stage manner, so that the waste gas treatment efficiency is improved, and the device is suitable for organic and inorganic comprehensive waste gas.

This invention relates to the field of semiconductor manufacturing virtual simulation technology, and discloses a method and system for simulating hardware communication protocols. This scheme achieves asynchronous decoupled communication between AMHS services and machine services through message queues (such as MQ), replacing the traditional hardware parallel I / O interaction method. The core includes: defining a protocol format for packaging multi-bit signals (such as 16-bit binary numbers); encoding signals such as VALID and CS_0 into single sequence messages (such as hexadecimal "4030"); maintaining a predefined sequence list (indexing corresponding communication steps) and the latest sequence status; and verifying whether a new message matches the expected sequence. If it matches, the status is updated and the process is advanced; otherwise, it is rejected and reset. The system includes AMHS services, machine services, message queue components, a storage module, and a verification module. This invention solves the problems of service dependency, bandwidth waste, and complex sequence verification in virtual scenarios, significantly improving simulation efficiency and realism, and is suitable for the interactive simulation of AMHS and machine interactions in semiconductor FAB plants.

The utility model discloses a CMP (chemical mechanical polishing) grinding machine drain pipe waste liquid sediment recovery device of a semi-conductor factory, which is mounted between a machine power secondary distribution drain pipe and a discharge pipeline and comprises a rectangular box, a first pipeline and a second pipeline, the rectangular box is positioned on the first pipeline, the first pipeline is provided with a first valve and a second valve, and the second pipeline is provided with a second valve. The first valve and the second valve are communicated with the front end face and the rear end face of the rectangular box respectively, the second pipeline is a bypass of the first pipeline, and the second pipeline is provided with a third valve. The device can effectively reduce and clean pipeline sediments, settled wastewater can be smoothly discharged to a factory service wastewater storage tank, and the device aims to reduce downtime caused by pipeline blockage, prolong the service life of a main pipeline, ensure normal operation of a system and reduce operation cost, and is convenient to install, free of space occupation and easy to clean.

To provide a tape processing device for a semiconductor work-piece which can further improve efficiency in processing a tape for a semiconductor work-piece, and a method for replacing a tape for a semiconductor work-piece.SOLUTION: A tape processing device for a semiconductor work-piece comprises: a tape supply part 3 which is provided with a plurality of original fabric rolls 11 of an adhesive tape T, and supplies the adhesive tape T from the original fabric rolls 11 arranged at an attachment position G1; a tape attaching part 4 that performs predetermined processing on a wafer W using the adhesive tape T; and a tape collecting part 5 which is provided with a plurality of winding cores 15 for winding up an unwanted tape Tn, and winds up the unwanted tape Tn around the winding cores 15 arranged at a collection position K1. The tape supply part 3 is configured to be able to carry the unused original fabric roll 11 into a preparation position G2 that is different from a feeding-out position G1, and the tape collecting part 5 is configured to be able to carry the winding core 15 from the stand-by position K2.SELECTED DRAWING: Figure 1

This invention discloses a deep learning-based method for predicting and tracing semiconductor contaminants, relating to the field of semiconductor pollution monitoring technology. The method includes simultaneously acquiring raw spectral data of gaseous contaminants from multiple monitoring devices in a semiconductor plant; generating standardized mass spectrometry time series data through time alignment and signal intensity normalization; comparing the data with a pollution source inventory database to identify contaminant types and preliminary concentrations; inputting the data into a pre-trained neural network model predicting spatiotemporal evolution to generate a predicted field for the spatiotemporal distribution of contaminant concentrations; calculating the mass migration flux of contaminants; and, combined with the plant's spatial structure, using a deconvolution diffusion model to simulate the diffusion process and deduce the location of potential release sources. This invention enables accurate identification, spatiotemporal prediction of concentrations, and precise source tracing of new gaseous contaminants in semiconductor plants, adapting to the contaminant control needs of complex semiconductor industrial plants.

The application relates to the technical field of electronic water pumps, in particular to a liquid-cooled electronic water pump, which comprises a pump base, a pump body arranged at the top end of the pump base and a pump head mounted at one end of the pump body. The electronic water pump can perform liquid cooling heat dissipation, thereby being free from the restriction of external environment, and the liquid cooling is more efficient than traditional air cooling. The motor temperature can be accurately controlled, the operating heat is absorbed by the liquid in the sealing cover and then discharged through the lead-out pipe, the environment temperature and humidity are not disturbed, and the electronic water pump is suitable for scenes such as semiconductor workshops and data machine rooms. Meanwhile, through the arrangement of a waste heat dissipation assembly, when the electronic water pump stops, the cooling liquid in the drainage tank is sprayed on the pump body and the heat dissipation fins through the drainage head of the liquid discharge pipe to perform waste heat dissipation. The cooling liquid after heat dissipation finally flows into the receiving tank for collection, the whole process is uninterrupted, the motor temperature in the pump body can be gently reduced to a safe range, the damage of the waste heat to the core components of the pump body is effectively avoided, the overall service life is prolonged, and the operation stability during subsequent start-up is ensured.

The present application relates to a kind of semiconductor facility layout simulation method, computer system and non-transitory computer readable medium.In computer system, the computer system includes processor and memory, the memory stores the program code executable by processor;Wherein, the processor executes the following steps: by first layout method or second layout method, the facility arranged in semiconductor FAB is laid out, and according to layout method, the result is simulated, and the simulation result is compared by various parameters.

According to the fabricated ribbed beam structure of the steel structure semiconductor plant, the mode that a cheese plate is replaced by the reinforced concrete ribbed beam is adopted, the construction difficulty is lowered, construction is easier and more convenient, the construction period is greatly shortened, and meanwhile the aperture ratio is higher. The structure comprises main beams, secondary beams and ribbed beams, the main beams comprise horizontal main beams and vertical main beams, the horizontal main beams and the vertical main beams are crossed and distributed in a net shape, the secondary beams are evenly distributed in the main beams distributed in the net shape in the horizontal direction and connected with the main beams, and the ribbed beams are precast beams made of reinforced concrete and distributed at the upper ends of the main beams and the secondary beams in the vertical direction.

The invention relates to the technical field of semiconductor manufacturing virtual simulation, and discloses a method and a system for simulating a hardware communication protocol. According to the scheme, asynchronous decoupling communication between the AMHS service and the machine service is achieved through the message queue (such as MQ), and a traditional hardware parallel I / O interaction mode is replaced. The method comprises the following steps of: defining a protocol format (such as a 16-bit binary number) of multi-bit signal packaging, and encoding signals such as VALID (Video Address Limit Identifier) and CS0 (Coding Sequence 0) into a single sequence message (such as hexadecimal '4030'); maintaining a predefined sequence list (an index corresponds to a communication step) and a latest sequence state; and checking whether a new message is matched with an expected sequence or not when receiving the new message, if so, updating the state propulsion process, otherwise, refusing and resetting. The system comprises an AMHS service, a machine service, a message queue component, a storage module and a verification module. According to the method, the problems of service dependence, bandwidth waste and sequence verification complexity in a virtual scene are solved, the simulation efficiency and fidelity are remarkably improved, and the method is suitable for interactive simulation of the AMHS and the machine of the semiconductor FAB factory.

The invention provides a semiconductor plant heat recovery system control method and device, a terminal and a storage medium, and relates to the technical field of flow and temperature control of semiconductor plant heat recovery systems. The method comprises the following steps: constructing a heat recovery automatic control model of the semiconductor plant heat recovery system, wherein the heat recovery automatic control model comprises a flow distribution mechanism model and a data model; the flow distribution mechanism model is used for conducting distribution calculation on the inlet total flow of the semiconductor plant heat recovery system, and bypass branch flow and heat exchange branch flow are obtained; the bypass branch flow and the heat exchange branch flow are input into the data model, and the bypass valve predicted opening degree and the heat exchange valve predicted opening degree are updated in real time; and based on the predicted opening degree of the bypass valve and the predicted opening degree of the heat exchange valve, the semiconductor plant heat recovery system is controlled to operate, so that the convergence temperature of the semiconductor plant heat recovery system reaches the preset convergence temperature. Accurate temperature control, valve precision driving and energy consumption optimization can be achieved.

The invention provides a tank car operation behavior analysis method based on an improved YOLO network for a semiconductor factory service system, and belongs to the field of semiconductor manufacturing, and the method specifically comprises the steps: collecting a real-time image of a tank car operation region; marking a target area corresponding to multiple view angles of each detection target in the real-time image through an improved YOLO network; generating a real-time behavior sequence according to the target area of each detection target marked by the real-time image; judging whether the real-time behavior sequence conforms to a specification or not; judging whether the operation behavior of the tank car occurs at a specified position or not by combining a mapping relation between the marked target area of each detection target and the area position of the shooting scene; and outputting a real-time analysis result corresponding to the tank car operation behavior according to the real-time behavior sequence and a judgment result of the tank car operation behavior. Through the processing scheme provided by the invention, all-around intelligent supervision of tank car operation from physical operation to flow compliance is realized, and the safety and management efficiency of a high-risk operation scene are remarkably improved.

Examples are disclosed that relate to virtual semiconductor fab environments. One example provides a method of monitoring a process performed on a substrate in a processing tool. The method comprises obtaining runtime data from sensors of the processing tool while running the process in the processing tool. The method further comprises performing a runtime simulation by simulating a digital twin using the runtime data and a recipe for the process. The method further comprises receiving a selection of a spatial viewpoint within the digital twin of the processing tool. The method further comprises rendering an image of a virtual state of the processing tool using the runtime simulation and the spatial viewpoint, and outputting the image of the virtual state.

The invention provides a semi-conductor factory scheduling method and device based on maximum entropy reinforcement learning, equipment and a medium, and belongs to the field of semi-conductor scheduling, and the method comprises the steps: obtaining the state information of a current production line; constructing a heterogeneous graph of production scheduling in real time according to the state information; analyzing the heterogeneous graph by using a graph neural network to obtain a characterization vector; action embedding of work order nodes-machine nodes is generated through a heterogeneous graph Transform architecture; generating a plurality of feasible schedules by adopting a maximum entropy reinforcement learning strategy network based on action embedding; selecting a specific schedule from the feasible schedules through a policy network; the heterogeneous graph is adjusted according to the specific schedule, and update state information is generated; evaluating the executed specific schedule, and generating a reward signal; and optimizing and adjusting the strategy network in real time according to the reward signal and a maximum entropy reinforcement learning algorithm. Through the processing scheme provided by the invention, a high-quality scheme is generated within second-level time in the face of scheduling requirements in actual production, and the dynamic adjustment requirements of a semiconductor workshop are perfectly matched.

Disclosed herein is an AI-based system and method for optimizing lot dispatching in a semiconductor Fab using reinforcement learning (RL) and a Fab-wide digital twin. The system leverages a policy neural network and Monte Carlo Tree Search (MCTS) to enhance cycle time, output, and on-time delivery. The RL agent continuously trains in the background, adapting to changes in Fab operations, ensuring optimized real-time decision-making.

1. The name of the design product: three-band flame detector (AC-11). 2. The use of the design product: for flame detection at the end of the semiconductor machine, suitable for semiconductor clean room and wet process environment, specially monitoring the flame producing carbon dioxide (CO₂) in the combustion process, including IPA burning flame. 3. The design points of the design product: in the combination of shape and pattern. 4. The picture or photo that best indicates the design points: perspective view.

The invention relates to the technical field of virtual scenes, and discloses a virtual semi-conductor factory wafer carrier supervision method, which comprises the following steps: configuring middleware of a data interaction center to connect an MCS, an MES and a machine, and constructing the virtual data interaction center; on the basis of the MCS, the Carrier ID data is inserted when the carrying task is finished, and the data interaction center actively queries the MES to obtain the corresponding Slot Map data and associatively stores the Slot Map data; and the machine reads the data from the data interaction center as required and reports the data to the EAP for verification and instruction issuing. According to the method, the data detection accuracy and the virtualization application reliability are improved, the waste film risk is reduced, the operation controllability is enhanced, and the simulation fidelity, the detection accuracy and the overall process efficiency are improved.

In a computer system including a processor; and a memory storing a program code executable by the processor, wherein the processor performs steps of laying out facilities disposed in a semiconductor FAB through a first layout method or a second layout method and simulating a result according to the layout method; and comparing the simulated result through various parameters.

To provide a tape processing device for a semiconductor work-piece which can improve efficiency in processing a tape for a semiconductor work-piece, and a replacing method for a tape for a semiconductor work-piece.SOLUTION: A tape processing device for a semiconductor work-piece comprises: a tape supply part 3 which is provided with a plurality of original fabric rolls 11 of an adhesive tape T, and supplies the adhesive tape T from the original fabric rolls 11 arranged at an attachment position G1; a tape attaching part 4 that performs predetermined processing on a wafer W using the adhesive tape T; a tape collecting part 5 which is provided with a plurality of winding cores 15 for winding up an unwanted tape Tn, and winds up the unwanted tape Tn around the winding cores 15 at a collection position K1; an original fabric roll storing part 2 that stores the original fabric rolls 11; a winding core storing part 6 that stores the winding cores 15; an original fabric roll conveying mechanism 7 that conveys the original fabric rolls 11, between a preparation position G2 and the original fabric roll storing part 2; and a winding-core conveying mechanism 8 that conveys the winding cores 15, between a stand-by position K2 and the winding core storing part 6.SELECTED DRAWING: Figure 1