34 results about "Semiconductor factory" patented technology

The invention discloses a three-dimensional modeling device and method for a semiconductor factory. The method comprises the steps that an acquisition module acquires interface layout information and connection element data of the semiconductor factory; the equipment modeling module receives semiconductor factory interface layout information, determines a three-dimensional modeling starting point and generates a semiconductor factory equipment model containing an equipment interface; the connection element modeling module determines an element connection path by using semiconductor factory starting equipment or factory service interfaces, combining element interface matching rules and logic relation information among elements, and fusing a three-dimensional touch automatic checking algorithm and an optimal path algorithm based on safe distance correction; and interface connection among elements in each semiconductor factory equipment model in the equipment modeling module is realized, and three-dimensional modeling of the semiconductor factory is completed. According to the method, the layout information and the connection element information are fused, and three-dimensional modeling of the semiconductor factory is efficiently and accurately achieved through the logic relation between the connection elements and a three-dimensional touch automatic verification algorithm.

This invention discloses a device and method for generating a simulation system for pure water preparation in a semiconductor factory. The device includes: a process generation module, which acquires raw water parameters and pure water requirement parameters, and generates a pure water preparation process path and process parameters based on a pure water process selection unit; and a dynamic pure water preparation simulation system built based on the pure water preparation process path and process parameters; and a parameter configuration module, which embeds a functional material configuration quantity calculation unit into the dynamic pure water preparation simulation system, and configures the functional materials for each process by combining process parameters, pure water requirement parameters, and basic properties of functional materials. The generation device provided by this invention can significantly improve the efficiency and parameter accuracy of pure water preparation process design in semiconductor factories, calculate the optimal configuration quantity of functional materials required for each process, and reduce the construction cost of the pure water preparation system in a semiconductor factory.

The present application relates to a semiconductor factory production data analysis and presentation method and system based on multi-agent cooperation. First, access to multi-source heterogeneous production data and standardization processing. Subsequently, a plurality of serial special ability agents are executed in turn: data agent classifies and stores data; aggregation analysis agent performs cross-system calculation to generate comprehensive indicators; scene recognition agent matches real-time data with preset rules to identify the current running scene; key parameter recommendation agent outputs a sorted key parameter list according to the scene. Finally, the scene, indicators and parameter list are integrated and visualized through a leadership cockpit with natural language interaction function, and can respond to user queries to trigger reanalysis. Through agent cooperation, the present application realizes automatic data processing, scene recognition and dynamic key parameter recommendation, and solves the technical problem of quickly focusing on core production problems from isolated data.

The invention discloses a crown block track surface cleaning device in a semiconductor workshop, which comprises a bottom plate, a frame is arranged on the bottom plate, and a first negative pressure fan and a second negative pressure fan are arranged in the frame; a negative-pressure air draft longitudinal cylinder extending upwards is arranged in the frame, and the bottom end of the negative-pressure air draft longitudinal cylinder is connected with a first negative-pressure fan and a second negative-pressure fan through pipelines in a communicating mode. A negative pressure air draft transverse barrel is arranged at the top end of the negative pressure air draft longitudinal barrel, the negative pressure air draft transverse barrel is vertically arranged at the top end of the negative pressure air draft longitudinal barrel, and the negative pressure air draft transverse barrel is communicated and connected with the negative pressure air draft longitudinal barrel; the two ends of the negative-pressure air draft transverse barrel are provided with dust removal modules which protrude downwards and are matched and symmetrical, and each dust removal module comprises a dust removal head cavity. Through non-contact suspended positive and negative air passage cleaning, efficient and automatic cleaning of the crown block rail surface of the semiconductor workshop is achieved, and the cleanliness of the semiconductor production environment is effectively improved.

This invention discloses a method for predicting energy data in semiconductor factories based on the fusion of multiple time-series models. The method includes: cleaning and defining the features of energy data; selecting and training multiple individual models based on the data characteristics of the processed energy data; selecting a suitable individual model based on scenario discrimination indicators, wherein the scenario discrimination indicators include fluctuation amplitude and seasonal cycle; the fluctuation amplitude is calculated by the standard deviation of the data or the range within a moving window, and the seasonal cycle is obtained by detecting the cycle strength using an autocorrelation function; fusing the prediction results of the selected models; evaluating the fused model and making energy predictions based on the evaluation results. This invention can adaptively select the optimal model, ensuring the accuracy and stability of energy prediction.

A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included on the one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.

The invention relates to the technical field of electronic water pumps, in particular to a liquid-cooled electronic water pump which comprises a pump base, a pump body arranged at the top end of the pump base and a pump head installed at one end of the pump body, the electronic water pump can conduct liquid cooling heat dissipation so as to be free of external environment limitation, liquid cooling is higher than traditional air cooling efficiency, the temperature of a motor can be accurately controlled, and the service life of the motor is prolonged. Operation heat is absorbed by liquid in the sealing cover and then is discharged through the leading-out pipe, the environment temperature and humidity are not interfered, the electronic water pump is matched with scenes such as semiconductor plants and data machine rooms, and meanwhile through the arrangement of the waste heat dissipation assembly, after the electronic water pump is stopped, cooling liquid in the water drainage box is sprayed to a pump body and cooling fins through a water drainage head of a liquid drainage pipe for waste heat dissipation; the cooling liquid after heat dissipation finally flows into the receiving box to be collected, the whole process is uninterrupted, the temperature of the motor in the pump body can be slowly reduced to a safety interval, damage of waste heat to core components of the pump body is effectively avoided, the overall service life is prolonged, and the operation stability during follow-up starting is guaranteed.

This invention relates to a micro-factory equipment for semiconductors, comprising: an atmospheric pressure processing device; an atmospheric pressure equipment housing, wherein the atmospheric pressure processing device is disposed within the atmospheric pressure equipment housing; the atmospheric pressure equipment housing includes an inner protective layer mechanism and an outer protective layer mechanism, both of which are heat-insulating protective layer structures with metal layers, and an airflow buffer layer is formed between them; a temperature compensation unit connected to the processing area where the atmospheric pressure processing device is located, used to compensate for temperature fluctuations caused by changes in equipment power within the processing area; and a dust filtration unit disposed within the atmospheric pressure equipment housing. Through the above configuration, the problem of huge investment in the construction of cleanroom and constant-temperature workshops in current semiconductor factories can be solved.

The invention discloses a capacity management and control device and method for a semiconductor factory service system, and the device comprises a demand end module which is used for obtaining the position information and consumption demand information of machine equipment in a semiconductor factory; the supply end module is used for acquiring pipeline position information and pipeline supply capacity of a factory affair system in the semiconductor factory; the capacity management and control module is used for receiving the machine equipment position information given by the demand end module and the pipeline position information given by the supply end module, realizing column network matching of each machine equipment and each pipeline, and receiving the use amount demand information given by the demand end module and the pipeline supply capacity given by the supply end module, and the capacity management and control of the semiconductor factory service system is realized in combination with a point location distribution mode. According to the method, the power capacity of the whole factory is comprehensively and dynamically controlled through data communication between the factory affair system in the semiconductor factory and the machine equipment in the spatial dimension, and cost waste caused by mismatching of the demand end and the supply end is avoided.

The application discloses an Ethernet and serial communication conversion device and method for semiconductor equipment, which comprises a hardware system and a software system, the hardware system contains an industrial-grade main controller, a plurality of independent configurable serial communication interfaces, an Ethernet interface, a state indication and alarm module and the like; the software system runs on the main controller and comprises a bidirectional protocol conversion module, a data priority processing and flow control module and a state monitoring and fault diagnosis module. The data priority processing and flow control module is internally provided with a data processing mechanism based on static priority, or adopts an adaptive priority dynamic re-marking and flow shaping method based on process stage sensing and queue pressure prediction, and the priority of a data frame and a token bucket injection rate are dynamically adjusted. The application can adapt to the harsh environment of a semiconductor factory, realize high-reliability and low-delay bidirectional conversion of a multi-protocol serial device and an Ethernet, and has perfect state monitoring and fault automatic recovery functions.

The application relates to a safety warning method, device and equipment for a semiconductor factory work scene. The method comprises the following steps: acquiring a work scene image of a semiconductor factory; inputting the work scene image into a target detection model and receiving a detection result of the target detection model; the detection result comprises a first detection result corresponding to a first target detection head and a second detection result corresponding to a second target detection head; determining an isolation index according to the first detection result and the second detection result; and determining safety warning information of the work scene according to the isolation index. The method can improve the warning accuracy.

The present disclosure provides a method for process control for a semiconductor plant, a higher-level computer, a controller and a system, and relates to the field of semiconductor technology.The process control procedure for a semiconductor plant comprises: capturing a process file required to control the semiconductor plant to execute a predefined process sequence; the process file being generated based on received process configuration parameters and comprising several process commands corresponding to all process operations required to execute the predefined process sequence, with each process command being assigned to a process operation; transmitting the process file to the controller at the start of the process so that the controller sequentially analyzes the process commands individually and controls the semiconductor plant based on the process parameters in the process commands to execute the corresponding process operation.The present disclosure enables controller-centric process control, increases the reliability of process control, improves the efficiency of information transfer, reduces plant costs and increases the stability of process control.

The invention discloses a semiconductor factory fault tracing method and system based on LLM and retrieval enhancement, belongs to the field of semiconductor manufacturing and intelligent troubleshooting, and aims to solve the problems that historical processes and defect report fields of a semiconductor factory are not uniform, a retrieval mode is single, the accuracy rate is low, and a fault tracing result lacks causal reasoning and interpretation. Firstly, report key information fields are extracted through combination of a large language model, rules and codes, and source identifiers are added; secondly, field semantic normalization is achieved through large language model cue word mapping, and field data structure specifications are unified; then writing the data into an elastic search database, defining text type fields and adding comprehensive content fields containing field combination information; when a user asks a question, the question is analyzed through a large language model to generate a selected statement for query, and two-stage retrieval is executed. According to the method, the retrieval accuracy and recall rate can be improved, the interpretability of fault tracing is realized, and the method has dynamic expansion capability and assists engineers in quickly removing faults and making decisions.

The invention discloses a semiconductor factory power demand simulation device and method considering scheduling and supply, and the device comprises a production scheduling module which is used for obtaining semiconductor production task information, and giving a processing sequence of each semiconductor production device; the equipment energy consumption module is used for acquiring the processing sequence, given by the production scheduling module, of each semiconductor production equipment, simulating the processing behavior of each semiconductor production equipment, and giving sequential power demand data of each semiconductor production equipment; and the pipe network supply module is used for acquiring the time sequence power demand data of each semiconductor production device given by the device energy consumption module, simulating a pipe network operation behavior according to the pipe network layout, and giving time sequence pipe network operation state data. By constructing a semiconductor factory power demand simulation model of three levels of production scheduling-equipment energy consumption-pipe network supply, accurate prediction of the power demand of the semiconductor factory is realized, and the problem that power demand prediction and planning of the semiconductor factory are disjointed is solved.

The application discloses a kind of semiconductor secondary configuration-oriented multi-source document intelligent question and answer method and device, method includes: obtaining user input information;By matching analysis to user input information and preset scene library, determine question and answer scene;Parse user input information, extract each target to be indexed, obtain index demand;Combining semiconductor factory hierarchical knowledge graph and index demand, determine multiple index objects;Based on index demand, and by multiple index mode in each index object is indexed, give multiple index results;Fusion question and answer scene and multiple index results, obtain the first question and answer result of each proxy point;The first question and answer result of each proxy point is context enhanced, obtain target question and answer result.Semiconductor factory hierarchical knowledge graph is constructed by the data characteristics of semiconductor secondary configuration, fusion question and answer scene and index demand, realize fast cross-document association query and traceable information retrieval, improve answer quality.

The application discloses a kind of semiconductor factory power demand simulation device and method considering scheduling and supply, device includes production scheduling module for obtaining semiconductor production task information, give the processing sequence of each semiconductor production equipment;Equipment energy module is used to obtain the processing sequence of each semiconductor production equipment given by production scheduling module, simulate the processing behavior of each semiconductor production equipment, give the time-sequenced power demand data of each semiconductor production equipment;Pipe network supply module is used to obtain the time-sequenced power demand data of each semiconductor production equipment given by equipment energy module, and according to pipe network layout, simulate pipe network operation behavior, give time-sequenced pipe network operation state data.Through the construction of "production scheduling-equipment energy-pipe network supply" three levels of semiconductor factory power demand simulation model, accurate prediction of semiconductor factory power demand is realized, and the problem that semiconductor factory is disconnected for power demand prediction and plan is solved.

The application relates to the technical field of semiconductor factory environment monitoring, and discloses a mobile environment parameter monitoring system and method based on a semiconductor chip factory, which comprises the following steps: first, dividing a monitoring coverage area into a plurality of preset areas connected by a mobile monitoring path; when a monitoring trolley enters a first preset area along the path, a PDA device on the trolley communicates with corresponding area monitoring points to obtain a measurement task; after a measurement period and a measurement frequency are configured, the environment parameters are measured to obtain results; then, the environment of the remaining preset areas is measured in sequence along the path; finally, the measurement results of the areas are summarized, and the monitoring results of the environment parameters of the whole factory area are output. The application realizes linkage between the monitoring trolley and the division of the factory area, standardizes the measurement standard, coordinates the measurement progress of multiple areas, improves the monitoring and data summarization efficiency, and meets the actual needs of the environment monitoring of the whole factory area of the semiconductor factory.

The utility model relates to a fork truck device for mobile special gas equipment cabinet, including first main body frame part, second main body frame part, telescopic connecting part, lifting tray part and control part. Its advantage lies in, and the first main body frame part and second main body frame part realize transverse extension through telescopic connecting part, and this design makes the device can be compatible with different specifications of special gas cabinet, especially suitable for the transfer demand of multiple size special gas cabinet in semiconductor factory, improves the application range of overall device, in addition, through setting tray lifting part on the first main body frame part and second main body frame part, can realize the automatic lifting to tray, compared with the lifting mode of small -size manual fork truck swing hydraulic arm, the device automatic lifting tray, improves the automation degree of lifting device, reduces the labor intensity of staff.

The invention provides a semiconductor plant heat recovery system control method and device, a terminal and a storage medium, and relates to the technical field of flow and temperature control of semiconductor plant heat recovery systems. The method comprises the following steps: constructing a heat recovery automatic control model of the semiconductor plant heat recovery system, wherein the heat recovery automatic control model comprises a flow distribution mechanism model and a data model; the flow distribution mechanism model is used for conducting distribution calculation on the inlet total flow of the semiconductor plant heat recovery system, and bypass branch flow and heat exchange branch flow are obtained; the bypass branch flow and the heat exchange branch flow are input into the data model, and the bypass valve predicted opening degree and the heat exchange valve predicted opening degree are updated in real time; and based on the predicted opening degree of the bypass valve and the predicted opening degree of the heat exchange valve, the semiconductor plant heat recovery system is controlled to operate, so that the convergence temperature of the semiconductor plant heat recovery system reaches the preset convergence temperature. Accurate temperature control, valve precision driving and energy consumption optimization can be achieved.

The invention provides a tank car operation behavior analysis method based on an improved YOLO network for a semiconductor factory service system, and belongs to the field of semiconductor manufacturing, and the method specifically comprises the steps: collecting a real-time image of a tank car operation region; marking a target area corresponding to multiple view angles of each detection target in the real-time image through an improved YOLO network; generating a real-time behavior sequence according to the target area of each detection target marked by the real-time image; judging whether the real-time behavior sequence conforms to a specification or not; judging whether the operation behavior of the tank car occurs at a specified position or not by combining a mapping relation between the marked target area of each detection target and the area position of the shooting scene; and outputting a real-time analysis result corresponding to the tank car operation behavior according to the real-time behavior sequence and a judgment result of the tank car operation behavior. Through the processing scheme provided by the invention, all-around intelligent supervision of tank car operation from physical operation to flow compliance is realized, and the safety and management efficiency of a high-risk operation scene are remarkably improved.

The application discloses an industrial big data collection method for a semiconductor factory, comprising the following steps: collecting industrial big data information by a mobile terminal; listening to a primary synchronization signal and a secondary synchronization signal sent by a base station by the mobile terminal; determining a first signal strength of the primary synchronization signal and a second signal strength of the secondary synchronization signal by the mobile terminal in response to the listening to the primary synchronization signal and the secondary synchronization signal sent by the base station; judging whether the absolute value of the difference between the first signal strength and the second signal strength is greater than a signal difference threshold by the mobile terminal; if it is judged that the absolute value of the difference between the first signal strength and the second signal strength is greater than the signal difference threshold, sending a first random access preamble to the base station on a PRACH resource by the mobile terminal, and sending a random access request and a scheduling request to the base station on a first PUSCH resource by the mobile terminal at the same time.

To provide a temperature control device that contributes to preventing global warming while achieving energy and cost savings. [Solution] The system comprises a heat exchanger 2, a water supply circuit 3 that supplies water produced in the semiconductor factory to the heat exchanger, and a control fluid circulation circuit 10 that circulates control fluid between various processes M in semiconductor manufacturing and the heat exchanger. The control fluid circulation circuit comprises a control fluid supply section that supplies control fluid to various processes, a control fluid circulation section that returns the control fluid used in the various processes to the heat exchanger, and a control fluid bypass section that connects the control fluid supply section and the control fluid circulation section. A pump 13 is placed in the middle of the control fluid supply section, a bypass valve 11 is placed in the middle of the control fluid bypass section, and a circulation valve 12 is placed in the middle of the control fluid circulation section. The amount of control fluid flowing to the heat exchanger is adjusted by adjusting the opening of the bypass valve and the circulation valve.

The present disclosure relates to a mapping system capable of accurately detecting an accommodated state of the object accommodated in the container even when the containers accommodating different objects are being transported within a semiconductor factory. A mapping system includes a substrate information acquisition unit acquiring a substrate information regarding a substrate accommodated in a predetermined container that is being transported or is in a state ready to be transported within a factory; a mapping threshold determining unit determining a mapping threshold used for mapping the predetermined container based on the substrate information; and a mapping unit for mapping the predetermined container using the mapping threshold

The invention provides a mapping system capable of accurately detecting a storage state of an object stored in a container even in a state in which containers for storing different objects in a semiconductor factory are mixed and conveyed. A mapping system is provided with: a substrate information acquisition unit that acquires substrate information, which is information of a substrate stored in a prescribed container, which is either a container that is being conveyed in a factory or is provided in a state in which the container can be conveyed; a mapping threshold value determination unit that uses the substrate information to determine a mapping threshold value to be used when mapping the predetermined container; and a mapping unit that maps the predetermined container using the mapping threshold value.

The invention relates to the technical field of virtual scenes, and discloses a virtual semi-conductor factory wafer carrier supervision method, which comprises the following steps: configuring middleware of a data interaction center to connect an MCS, an MES and a machine, and constructing the virtual data interaction center; on the basis of the MCS, the Carrier ID data is inserted when the carrying task is finished, and the data interaction center actively queries the MES to obtain the corresponding Slot Map data and associatively stores the Slot Map data; and the machine reads the data from the data interaction center as required and reports the data to the EAP for verification and instruction issuing. According to the method, the data detection accuracy and the virtualization application reliability are improved, the waste film risk is reduced, the operation controllability is enhanced, and the simulation fidelity, the detection accuracy and the overall process efficiency are improved.

The application discloses a batched semiconductor factory equipment digital twin model construction method and device, and the method comprises the following steps: based on determined modeling requirements, matching a preset basic parameter template library, giving corresponding basic parameter templates, and determining a structured parameter set; analyzing equipment basic parameters and production process parameters, and combining a mapping relationship with a component library, traversing equipment components and logical components in the component library, determining each target equipment component and a plurality of target logical components; fusing the target equipment component and the plurality of target logical components to form a target standard component; based on factory layout parameters, linking the target standard component to construct a semiconductor factory equipment digital twin model. Through the processing behavior of disassembling the equipment, the basic parameter template library and the component library are combined to realize the rapid batch generation of the target standard component, and on the basis of guaranteeing the simulation effect of the semiconductor equipment, the modeling efficiency of the digital twin model is improved.

The invention provides a method and a system for automatically inspecting a semiconductor factory by an intelligent agent, which are applied to the technical field of semiconductor manufacturing, and the method comprises the following steps: firstly, constructing and configuring an inspection intelligent agent at least comprising an equipment interface, a knowledge base and a workflow engine through an intelligent agent configuration platform; then, in a 2.5 D on-line semiconductor factory where physical factory layout and equipment are mapped, the intelligent agent is driven to execute the defined inspection process, and sensor data are obtained in real time; and finally, the workflow engine controls the intelligent agent to carry out anomaly recognition and root cause analysis on the data, and an inspection report is automatically generated in combination with a knowledge base, so that 7 * 24-hour uninterrupted intelligent and automatic factory inspection is realized, a large amount of vigor of engineers originally invested in repeated inspection is effectively released, and the inspection efficiency is improved. According to the method, engineers are enabled to concentrate on key areas such as high-value decision analysis and process optimization, the labor cost is remarkably reduced, the operation efficiency is improved, and stable operation of a semiconductor factory is ensured.

The utility model relates to a temperature adjusting device for semiconductor equipment, relates to the field of temperature adjustment of semiconductor equipment, and aims to solve the problems of overhigh equipment operation energy consumption and high-temperature aging of equipment cables caused by overhigh equipment energy consumption during operation of some processes in a semiconductor factory. An opening and closing valve is arranged between the injection pipe and the discharge pipe; and a medium flows in through the injection pipe, enters equipment through the opening and closing valve, passes through the equipment and is finally discharged through the discharge pipe. The semiconductor device has the effect of realizing temperature regulation of the semiconductor device.

The application discloses a semiconductor factory power load prediction method, system, device and medium, and the method comprises the following steps: acquiring historical power load data of a power grid system of a semiconductor factory; determining a lag order according to the historical power load data, and screening input features according to the lag order; adopting a tree model algorithm to fit the input features and power consumption in a future period of time, and constructing the prediction model; and predicting future power load data of the power grid system through the prediction model and outputting a result. According to the application, the feature screening is performed through lag correlation, and the feature is secondarily screened through the feature importance of the tree model, so that the autoregressive prediction accuracy is improved.

The invention discloses a single-plunger pneumatic pressurizing micro-jet cleaning device which comprises a pneumatic motor, a single-plunger pump, a nozzle and a control unit, a plunger is in rigid connection with a motor piston, a pump cavity forms a double-cavity reciprocating structure through two ball valves, pure water is sucked in from a liquid inlet and then is discharged twice, and low-pulsation high-pressure output is achieved. The gas pipeline is provided with the electric proportional valve, the water outlet pressure can be changed in a stepless mode by adjusting the gas inlet pressure, and an extra pressure sensor closed loop is not needed. The whole system only uses pure water, is free of lubricating oil and chemical reagents, and meets the strict requirements of semiconductor factories on metal ions and clean environments. And the structure is simplified, the maintenance amount is small, and traditional multi-plunger ultrahigh-pressure cleaning equipment can be replaced.