58 results about "Semiconductor factory" patented technology

The invention belongs to the network communication technology, in particular to a SECS communicating method based on SEMI standard. The method comprises the following steps of: realizing the connection of equipment to a host by an HSMS communication module and carrying out data transmission by a network; carrying out SECS II coding and decoding by an SECS protocol module and realizing data collection, equipment control and exception handling. The communicating method adopted can realize automatic management of a semiconductor factory, can meet characteristic requirements of high vacuum, high cleanness, high dustless, and the like in the manufacturing process of semiconductors, can standardize different equipment control systems, improve production efficiency and reduce production cost.

The invention relates to the automation technical field of a semiconductor factory, in particular to a management method for semiconductor manufacturing process formulation. On the basis of dividing specific functional roles between a factory automation system and a device, the management method for the semiconductor manufacturing process formulation provided by the invention realizes the management on the process formulation in accordance with a plurality of strategies between the system and the device such as connection, disconnection and management. Through specifically dividing roles between the factory automation system and the device, two systems manage the process formulation coordinately, thereby decreasing the complexity of management and improving the efficiency of management.

The invention relates to a regeneration system and method of a tetramethyl ammonium hydroxide developing waste liquid. The regeneration system comprises a plurality of feeding pumps, at least one group of neutralization separation device, at least one group of adsorption device, at least one group of cation exchange device, at least one group of anion exchange device and at least one group of purification processing device, wherein the neutralization separation device, the adsorption device, the cation exchange device, the anion exchange device and the purification processing device are sequentially connected by material tubes with control valves. According to the regeneration system, high-purity tetramethyl ammonium hydroxide developing liquid can be stably and circularly regenerated for a long time, so that the purposes of energy conservation and environment protection are achieved; meanwhile, the wastewater discharge pressure of a semiconductor factory is reduced, and the wastewater treatment cost of the factory is saved, so that the effective cyclic utilization of resources is realized.

A software module for use within an integrated circuit fabrication facility sends commands to a tool according to a method that operates with any tool that satisfies SEMI standards to add or subtract steps in a process without reprogramming or recompiling. The program operates autonomously to change parameters of commands that it sends to the tool to improve performance of the fab.

A method for monitoring at least one server in a semiconductor factory automation (FA) system, includes the steps of: a) providing server state information from at least one server to a real-time database, wherein the server state information includes an availability of a central processing unit, an availability of a disk and a state of a program process related to the server; b) storing the processor state information in the real-time database; c) retrieving the server state information to monitor the server; and d) displaying the server state information retrieved. Therefore, the method monitors at least one server in a real time so that an operator can easily locate a failure of at least one-server.

The invention discloses a method for measuring temperature by using a thermal wave meter. In a semiconductor manufacturing process, a lattice structure of a monocrystalline silicon wafer is damaged by ion injection, and the damage threshold, called as TW (Thermal Wave) value, can be measured through the thermal wave meter. The damage of a lattice can be repaired after annealing at a certain temperature and then the TW value is reduced. More importantly, the degree of the reduction is directly related to the temperature. According to the relation, the injected monocrystalline silicon wafer is respectively measured before and after the monocrystalline silicon wafer enters a machine platform of which the temperature is to be measured, the prior valve is called as TW0 and the later valve is called as TW1; the decay rate is calculated according to the formula that: TW decay rate is equal to (1-TW1/TW0)*100%; the decay rate corresponds to a fixed temperature; and the temperature of wafer-accessed machine platform is obtained by comparing the fixed temperature and base data. The method has the advantages that: the operation is simple; the time is saved; the cost is low; the process imitativeness is high; the environment of the machine platform is not damaged; the adaptability is high; a film in a semiconductor factory can be etched; and the temperature of the alloy furnace tube machine platform can be measured.

The invention discloses a defect operating system of a semiconductor factory. The defect operating system of the semiconductor factory is used for immediately processing a plurality of defect data; then, coordinate correction, defect size correction and analysis by using critical area analysis are carried out to generate a fatal defect data file; then, an integrated circuit design company carriesout fault analysis and generates failure fatal defect data to generate new design layout data; and finally, the new design layout data and the failure fatal defect data are transmitted back to the semiconductor factory through a network. The defect operating system of the semiconductor factory is used for mutually paying and feeding back defect data and solving the root cause of the defect by theintegrated circuit design company and the semiconductor factory so as to achieve the purpose of improving the yield.

A depository monitoring system for use in a semiconductor factory comprises a plurality of carriers, each holding at least one semiconductor object; a depository monitoring host for monitoring a depository of each carrier; and a plurality of RFID tags and a plurality of RFID readers. It is characterized in that the RFID tags are disposed on the carriers and/or semiconductor objects, respectively, wherein each RFID tag has a tag information; the RFID readers read/write the tag information from/to the RFID tags; and the depository monitoring host comprises: a legacy database to store information related to the depository monitoring system; an RFID middleware for processing operations between the RFID readers and the RFID tags; a web interface for processing commands and query results through a B2B internet; an input/output interface for processing commands and query results through an intranet; and a depository controller for performing a sequence of processes in depository monitoring.

The configuration mode for semiconductor factory workshops includes seven main areas including one central hexagonal area, four peripheral hexagonal areas to the right and left sides and two peripheral trapeziform areas in the other two sides. The manufacture workshop most closely relative to material circulation is set in the central area for the automatic material circulation in shortest path and highest efficiency. The configuration may be planned flexibly according to the required areas, environment and numbers of equipment in different workshops to raise the overall utilization of the factory area. The configuration is beneficial to concentrated management and control, simplified building construction, etc.

The invention discloses a photoresist edge edge-wash data measuring system. The system comprises a developing post-measuring machine, a wafer edge position sensor, an edge-wash line position sensor, a logic operation unit and a pre-warning unit. The system can be used for carrying out developing post-measuring on the wafer and simultaneously calculating the edge-wash width of the photoresist edge and the offset of the edge-wash line, thus the photoresist edge edge-wash data can be obtained in time. The invention further discloses a measurement monitoring method of the photoresist edge edge-wash data, comprising the following steps: measuring and calculating the photoresist edge edge-wash data by using the system; automatically collecting the data, and sending the data to an automatic monitoring system of a semiconductor factory; judging whether the edge-wash width exceeds the maximum allowable width and whether the offset of the edge-wash line exceeds the maximum allowable offset, when exceeds, raising an alarm, and sending the edge-wash width and the offset to workers for measurement. According to the method, the real-time monitoring of the photoresist edge edge-wash data can be realized, and the offset of the edge-wash line can be discovered in time.

The present invention relates to a full-automatic wafer appearance inspection system which comprises a wafer box opening carrier, a wafer taking and placing manipulator, a wafer position calibration mechanism, a wafer turnover mechanism and a microscope detection mechanism, the wafer box opening carrier is used for opening a wafer conveying box, the wafer taking and placing manipulator is used for carrying wafers, and the wafer position calibration mechanism is used for determining the circle center position of the wafer and rotating the wafer to a specified angle; and the wafer turnover mechanism is used for turnovering a wafer so as to inspect the back surface of the wafer, and the microscope detection mechanism inspects the surface of the wafer. The wafer can be automatically transmitted to the microscope for observation, so that damage caused by manual carrying is avoided; the surface and the back surface of the wafer can be visually inspected; and linear motion is adopted in the transmission process, and the wafers are prevented from being thrown out. The system is suitable for being used in semiconductor factories and wafer test factories.

A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included onthe one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.

The invention provides a heat dissipation device. The device comprises a heat dissipation fan and a current monitoring module, wherein the heat dissipation fan comprises a motor, the current monitoring module is provided with an input end and an output end, wherein the input end of the current monitoring module is connected with the motor and used for monitoring the induction current of the motor.The invention further provides a semiconductor production system. The system involves semiconductor production equipment, a power supply device and the heat dissipation device, wherein the power supply device is connected with the semiconductor production equipment, the heat dissipation device comprises the heat dissipation fan and the current monitoring module, the heat dissipation fan is located in the power supply device and used for dissipating heat for the power supply device, the heat dissipation fan comprises the motor, the current monitoring module is provided with the input end and the output end, and the input end of the current monitoring module is connected with the motor and used for monitoring the induction current of the motor. According to the device and the system, the structure is simple, the use is convenient, the cost is low, and a guarantee can be provided for the safe production of a semiconductor factory; and the fault monitoring method of the heat dissipation fan is simple and feasible, and has great popularization value.

The invention provides a method and system for controlling a lifting mechanism of an air transport vehicle, which are applied to the technical field of semiconductor wafer manufacturing equipment.The method for controlling the lifting mechanism of the air transport vehicle comprises the steps that when the air transport vehicle runs to a preset position in a track, the lifting mechanism is started to drive a clamping mechanism; therefore, the clamping mechanism does lifting motion; and acquiring a speed value of the lifting motion, and performing segmented control on the lifting motion of the clamping mechanism according to the speed value of the lifting motion. The speed of the lifting motion is acquired in real time, and the lifting motion is subjected to stable and rapid segmentation control according to the real-time speed, so that the whole lifting motion runs stably, the running stroke perimeter is obviously optimized, the wafer carrying efficiency in automatic application of a semiconductor factory is greatly improved, and the wafer production efficiency is improved.

The present invention relates to an indoor concentration combustion system having a catalytic poison oxidizer. The system comprises: a VOCs gas collecting unit (210), which is installed on the front surface of a square-box shaped zeolite concentrator unit and is capable of efficiently collecting a volatile material at a room temperature; a pre-filter (220), which is coupled to a rear portion of the VOCs gas collecting unit and is used to remove granular substances in the captured VOCs such as dust; and a zeolite concentrator (230) unit, which adsorb volatile substances such as benzene, paint thinner, odor, and the like, to filter VOCs in the pre-filter (220). The provided system is installed in a semiconductor factory or a display production factory and is capable of processing VOCs effectively.

The invention discloses a polyvinyl alcohol cinnamate type KPR photoresist etching residue stripping agent composition, which comprises 40-70% of an organic solvent, 1-20% of organic amine, 0.5-10% of a corrosion inhibitor, 0.2-5% of a surfactant, 1-5% of fluoride and the balance of ultrapure water, the surfactant is one or a mixture of more of ethylene glycol, glycerol, glucose, sorbitol, pentaerythritol, xylitol and AEO-7; the organic amine is one or a mixture of more of monoethanolamine, triethanolamine and isopropanolamine; the corrosion inhibitor is one or a mixture of more of phenols, carboxylic acids and benzotriazoles. The stripping agent has higher cleaning efficiency, the cleaning time is remarkably shortened compared with that of similar products, the cleaning effect and the protection effect on a wafer base material are better, and the operation cost of a semiconductor factory can be remarkably reduced.