94 results about "Semiconductor factory" patented technology

The invention discloses a virtual environment modeling method for an OHT system of a semiconductor factory, and belongs to the technical field of semiconductor production, and the method comprises the following steps: data collection and preprocessing: collecting field facility data of a semiconductor factory production line, operation related data of an OHT vehicle, and product information data, and carrying out the preprocessing of the data, so as to obtain basic data; virtual environment modeling: constructing a virtual environment model according to the basic data; simulation and optimization: carrying out simulation operation based on the constructed virtual environment model, and carrying out performance evaluation; then, optimization is carried out according to a simulation result and a performance evaluation condition; and verifying and applying a result. According to the method, accurate modeling and simulation are carried out on the OHT system, the configuration and scheduling strategy of the OHT system is optimized, resource utilization can be optimized, the cost can be reduced, and the stability, reliability and flexibility of the system can be enhanced.

The invention relates to the field of semiconductor factory material handling, and discloses a semiconductor material flow direction EM path-finding system, which comprises a layout drawing module, a path and equipment configuration module, an information acquisition module, a task generation module, a path planning module and a task execution module. The method comprises the following steps of: selecting a plurality of devices, marking material nodes and functions of the nodes, inputting state information and task information of each device obtained in a scheduling system into a path-finding system to analyze a dynamic adjustment path weight, and sending a path-finding instruction to the path-finding system through the scheduling system to trigger planning of a material carrying path. And the planned optimal path is returned to the scheduling system, and the execution task of the corresponding equipment is called according to the path configuration, so that the problems of independent scheduling of each equipment and low path planning efficiency in a traditional path-finding system are solved, efficient cooperation among the equipment is realized, conflicts and resource waste are eliminated, and the overall material handling efficiency is improved.

An article transfer and storage apparatus includes a case installed in a semiconductor factory and including a frame, the frame including at least a first shelf plate extending in a first horizontal direction, and a plurality of storage ports arranged on the first shelf plate and configured to accommodate a semiconductor carrier, and a storage port transport configured to move the storage ports in the first horizontal direction, and a transfer robot including a transport base at a bottom of the transfer robot, the transfer robot configured to place the semiconductor carrier in the case or take out the semiconductor carrier from the case and move the semiconductor carrier.

The invention discloses a semiconductor wafer manufacturing factory logistics jam prediction method and system, and relates to the technical field of semiconductor manufacturing process optimization, and the method comprises the steps: collecting and preprocessing historical logistics data of a semiconductor manufacturing intelligent factory, carrying out the spatial-temporal feature fusion of the preprocessed data, generating high-dimensional representation data, and carrying out the prediction of the logistics jam of the semiconductor wafer manufacturing factory. Performing coding feature extraction processing on the high-dimensional representation data, extracting spatio-temporal features through a time sequence dynamic sensing operation and a spatial relationship self-adaptive operation, performing spatio-temporal feature fusion processing, performing cross-sequence feature integration on a processing result and complex spatio-temporal features, and performing decoding prediction processing on the integrated features, and through a causal constraint attention mechanism and cross-sequence correlation modeling, predicting a logistics state matrix sequence, and based on the logistics state matrix sequence, carrying out congestion state determination. According to the method, high-precision prediction and quick response of logistics blockage of the semiconductor factory are realized, and the problems of spatial-temporal characteristic splitting, response lag and high false alarm rate of a traditional method are solved.

The utility model relates to the technical field of speed reducers, in particular to a harmonic speed reducer for a semiconductor factory, which comprises a speed reducer main body, a radiating ring is fixedly connected to the outer wall of the speed reducer main body, a first corrugated groove is arranged on the outer wall of the radiating ring, an oil pipe is mounted on the inner wall of the first corrugated groove, and two ends of the oil pipe respectively pass through two ends of the first corrugated groove. Limiting assemblies are symmetrically installed on the outer portion of the heat dissipation ring. Each limiting assembly comprises a first semi-ring cover and a second semi-ring cover. The oil pipe is wound and installed through the first corrugated groove formed in the heat dissipation ring, cooling oil in the oil tank can circulate between the oil pipe and the oil tank under the action of the oil pump through mutual cooperation between the oil pipe and the oil tank, then heat generated in the operation process of the speed reducer body is continuously output, and the effect of cooling the speed reducer body is achieved; the overall heat dissipation effect in the operation process is improved, and adverse effects on internal elements of the speed reducer body caused by too high temperature in the speed reducer body operation process are prevented.

The invention discloses a three-dimensional modeling device and method for a semiconductor factory. The method comprises the steps that an acquisition module acquires interface layout information and connection element data of the semiconductor factory; the equipment modeling module receives semiconductor factory interface layout information, determines a three-dimensional modeling starting point and generates a semiconductor factory equipment model containing an equipment interface; the connection element modeling module determines an element connection path by using semiconductor factory starting equipment or factory service interfaces, combining element interface matching rules and logic relation information among elements, and fusing a three-dimensional touch automatic checking algorithm and an optimal path algorithm based on safe distance correction; and interface connection among elements in each semiconductor factory equipment model in the equipment modeling module is realized, and three-dimensional modeling of the semiconductor factory is completed. According to the method, the layout information and the connection element information are fused, and three-dimensional modeling of the semiconductor factory is efficiently and accurately achieved through the logic relation between the connection elements and a three-dimensional touch automatic verification algorithm.

This invention discloses a device and method for generating a simulation system for pure water preparation in a semiconductor factory. The device includes: a process generation module, which acquires raw water parameters and pure water requirement parameters, and generates a pure water preparation process path and process parameters based on a pure water process selection unit; and a dynamic pure water preparation simulation system built based on the pure water preparation process path and process parameters; and a parameter configuration module, which embeds a functional material configuration quantity calculation unit into the dynamic pure water preparation simulation system, and configures the functional materials for each process by combining process parameters, pure water requirement parameters, and basic properties of functional materials. The generation device provided by this invention can significantly improve the efficiency and parameter accuracy of pure water preparation process design in semiconductor factories, calculate the optimal configuration quantity of functional materials required for each process, and reduce the construction cost of the pure water preparation system in a semiconductor factory.

The invention relates to the technical field of industrial automation and semiconductor manufacturing, in particular to a semiconductor factory material distribution control system and method based on multi-system collaboration, which can realize full-process automatic closed-loop control of material distribution by integrating a WMS, an MES, an OA system and an AGV / PDA device. Comprising the steps that after an MES work order module generates a work order, a WMS work order module is triggered to distribute material batches, an AGV control module dynamically dispatches and distributes the work order to a workshop, a PDA device scans a code, checks and synchronizes data, and a related department is notified through an OA cooperation module when a task is completed or abnormal, so that the problems of information island, much manual intervention, response lag and the like in a semiconductor factory are solved. And the material distribution efficiency and the cross-department cooperation capability are improved.

The utility model relates to the technical field of semiconductor processing, and discloses a thermal purging device of a three-way valve for a semiconductor factory, which comprises a base, an air extractor arranged on the right side of the top of the base, two mounting racks fixedly mounted on the top of the base and on the left side of the air extractor, and a high-pressure tank fixedly mounted on the tops of the mounting racks, a blowing device is arranged at the top of the base and on the left side of the high-pressure tank; the air blowing device comprises a three-way valve arranged on the left side of the base, a heating box fixedly installed at the top of the base, a connecting port communicating with the left side of the high-pressure tank, two electric valves communicating with the left side of the connecting port and an electric push rod fixedly installed at the top of the three-way valve. Nitrogen filtered and compressed by the air extractor is stored through the arrangement of the high-pressure tank, hot nitrogen is blown to the valve cavity through the arrangement of the air blowing device, the valve cavity is continuously blown, a flowing medium is not prone to condensation, and the maintenance period is prolonged.

The present application relates to a semiconductor factory production data analysis and presentation method and system based on multi-agent cooperation. First, access to multi-source heterogeneous production data and standardization processing. Subsequently, a plurality of serial special ability agents are executed in turn: data agent classifies and stores data; aggregation analysis agent performs cross-system calculation to generate comprehensive indicators; scene recognition agent matches real-time data with preset rules to identify the current running scene; key parameter recommendation agent outputs a sorted key parameter list according to the scene. Finally, the scene, indicators and parameter list are integrated and visualized through a leadership cockpit with natural language interaction function, and can respond to user queries to trigger reanalysis. Through agent cooperation, the present application realizes automatic data processing, scene recognition and dynamic key parameter recommendation, and solves the technical problem of quickly focusing on core production problems from isolated data.

The invention discloses a crown block track surface cleaning device in a semiconductor workshop, which comprises a bottom plate, a frame is arranged on the bottom plate, and a first negative pressure fan and a second negative pressure fan are arranged in the frame; a negative-pressure air draft longitudinal cylinder extending upwards is arranged in the frame, and the bottom end of the negative-pressure air draft longitudinal cylinder is connected with a first negative-pressure fan and a second negative-pressure fan through pipelines in a communicating mode. A negative pressure air draft transverse barrel is arranged at the top end of the negative pressure air draft longitudinal barrel, the negative pressure air draft transverse barrel is vertically arranged at the top end of the negative pressure air draft longitudinal barrel, and the negative pressure air draft transverse barrel is communicated and connected with the negative pressure air draft longitudinal barrel; the two ends of the negative-pressure air draft transverse barrel are provided with dust removal modules which protrude downwards and are matched and symmetrical, and each dust removal module comprises a dust removal head cavity. Through non-contact suspended positive and negative air passage cleaning, efficient and automatic cleaning of the crown block rail surface of the semiconductor workshop is achieved, and the cleanliness of the semiconductor production environment is effectively improved.

This invention discloses a method for predicting energy data in semiconductor factories based on the fusion of multiple time-series models. The method includes: cleaning and defining the features of energy data; selecting and training multiple individual models based on the data characteristics of the processed energy data; selecting a suitable individual model based on scenario discrimination indicators, wherein the scenario discrimination indicators include fluctuation amplitude and seasonal cycle; the fluctuation amplitude is calculated by the standard deviation of the data or the range within a moving window, and the seasonal cycle is obtained by detecting the cycle strength using an autocorrelation function; fusing the prediction results of the selected models; evaluating the fused model and making energy predictions based on the evaluation results. This invention can adaptively select the optimal model, ensuring the accuracy and stability of energy prediction.

A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included on the one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.

The invention relates to the technical field of electronic water pumps, in particular to a liquid-cooled electronic water pump which comprises a pump base, a pump body arranged at the top end of the pump base and a pump head installed at one end of the pump body, the electronic water pump can conduct liquid cooling heat dissipation so as to be free of external environment limitation, liquid cooling is higher than traditional air cooling efficiency, the temperature of a motor can be accurately controlled, and the service life of the motor is prolonged. Operation heat is absorbed by liquid in the sealing cover and then is discharged through the leading-out pipe, the environment temperature and humidity are not interfered, the electronic water pump is matched with scenes such as semiconductor plants and data machine rooms, and meanwhile through the arrangement of the waste heat dissipation assembly, after the electronic water pump is stopped, cooling liquid in the water drainage box is sprayed to a pump body and cooling fins through a water drainage head of a liquid drainage pipe for waste heat dissipation; the cooling liquid after heat dissipation finally flows into the receiving box to be collected, the whole process is uninterrupted, the temperature of the motor in the pump body can be slowly reduced to a safety interval, damage of waste heat to core components of the pump body is effectively avoided, the overall service life is prolonged, and the operation stability during follow-up starting is guaranteed.

The present application discloses a clean room for semiconductor manufacturing plants, belonging to the technical field of clean rooms. The clean room comprises a clean workspace, comprising a clean work area for high-precision processing and a processing service area for semiconductor pre-processing. A partition is provided between the clean work area and the processing service area, wherein curtains are provided at intervals within the partition. The curtains are arranged along the length of the partition, and filter assemblies for filtering air are provided on both sides of the adjacent curtains, each of which is spaced apart from each other. The filter assemblies include a first filter and a second filter arranged at intervals along the partition. A first ventilation system for conveying clean air is provided in both the clean work area and the processing service area, and a second ventilation system for conveying clean air is provided in the partition. The present application has the effect of improving the air cleanliness within the clean room.

This invention relates to a micro-factory equipment for semiconductors, comprising: an atmospheric pressure processing device; an atmospheric pressure equipment housing, wherein the atmospheric pressure processing device is disposed within the atmospheric pressure equipment housing; the atmospheric pressure equipment housing includes an inner protective layer mechanism and an outer protective layer mechanism, both of which are heat-insulating protective layer structures with metal layers, and an airflow buffer layer is formed between them; a temperature compensation unit connected to the processing area where the atmospheric pressure processing device is located, used to compensate for temperature fluctuations caused by changes in equipment power within the processing area; and a dust filtration unit disposed within the atmospheric pressure equipment housing. Through the above configuration, the problem of huge investment in the construction of cleanroom and constant-temperature workshops in current semiconductor factories can be solved.

The invention discloses a capacity management and control device and method for a semiconductor factory service system, and the device comprises a demand end module which is used for obtaining the position information and consumption demand information of machine equipment in a semiconductor factory; the supply end module is used for acquiring pipeline position information and pipeline supply capacity of a factory affair system in the semiconductor factory; the capacity management and control module is used for receiving the machine equipment position information given by the demand end module and the pipeline position information given by the supply end module, realizing column network matching of each machine equipment and each pipeline, and receiving the use amount demand information given by the demand end module and the pipeline supply capacity given by the supply end module, and the capacity management and control of the semiconductor factory service system is realized in combination with a point location distribution mode. According to the method, the power capacity of the whole factory is comprehensively and dynamically controlled through data communication between the factory affair system in the semiconductor factory and the machine equipment in the spatial dimension, and cost waste caused by mismatching of the demand end and the supply end is avoided.

The invention provides a production schedule Gantt chart drawing method, device and equipment for a semiconductor factory, and belongs to the field of semiconductor manufacturing, and the method comprises the steps: receiving work order schedules of all processing machines, and determining the time granularity of a time axis of a Gantt chart according to the work order schedules; constructing a data structure hierarchy corresponding to the processing machine to display the association between the business scenes; receiving a real-time Gantt chart fed back by rendering, receiving interface data corresponding to each processing machine, calculating the interface data, and drawing task bars forming a business scene according to time granularity through each Gantt chart component to obtain a real-time Gantt chart corresponding to the work order schedule; and displaying the real-time Gantt chart so as to carry out dragging modification on the task bar, and outputting the real-time Gantt chart after dragging verification. According to the processing scheme provided by the invention, different Gantt chart levels are designed for different types of machine processing flows in a semi-conductor factory, and an association relationship is established; and the page time axis granularity can be adjusted, and more comprehensive information can be displayed.

The utility model relates to an electrostatic chuck cleaning clamp. The electrostatic chuck cleaning clamp comprises a plurality of connecting parts and a plurality of adjusting parts arranged on the connecting parts. Every two adjacent connecting parts are connected through one adjusting part, and the adjusting parts and the connecting parts are arranged in a matched mode to define a regular polygon containing space used for containing an electrostatic chuck. The adjusting part adjusts the size of the regular polygon containing space so as to adapt to different electrostatic chucks. According to the utility model, the electrostatic chuck can be quickly placed upside down, and the cleaning surface is ensured to be completely exposed in the cleaning liquid without being blocked; meanwhile, various cleaning clamps with different models and sizes can be defined by adjusting the position relation between the adjusting component and the connecting component, and the electrostatic chuck cleaning clamp has the advantages of being efficient and convenient to use and can well meet the actual requirement of current semiconductor factories for electrostatic chuck cleaning.

A method for recognizing a location of an overhead hoist transport for an overhead hoist transport system, by which a process designing time can be shortened and thus costs can be reduced by installing location indicators in the same way at each semiconductor factory at the time of process design by acquiring accurate location information of the overhead hoist transport in real time and determining a work location based on the location information, there is no need to reattach location indicators and thus there is no need to work at heights due to reattachment work of the location indicators even in a case of changing work environment such as changing layout of a process or changing position of equipment so that a work time and costs thereof can be significantly reduced, and it is possible to remarkably improve post management and significantly improve efficiency of logistics transportation.

The application discloses an Ethernet and serial communication conversion device and method for semiconductor equipment, which comprises a hardware system and a software system, the hardware system contains an industrial-grade main controller, a plurality of independent configurable serial communication interfaces, an Ethernet interface, a state indication and alarm module and the like; the software system runs on the main controller and comprises a bidirectional protocol conversion module, a data priority processing and flow control module and a state monitoring and fault diagnosis module. The data priority processing and flow control module is internally provided with a data processing mechanism based on static priority, or adopts an adaptive priority dynamic re-marking and flow shaping method based on process stage sensing and queue pressure prediction, and the priority of a data frame and a token bucket injection rate are dynamically adjusted. The application can adapt to the harsh environment of a semiconductor factory, realize high-reliability and low-delay bidirectional conversion of a multi-protocol serial device and an Ethernet, and has perfect state monitoring and fault automatic recovery functions.

The application relates to a safety warning method, device and equipment for a semiconductor factory work scene. The method comprises the following steps: acquiring a work scene image of a semiconductor factory; inputting the work scene image into a target detection model and receiving a detection result of the target detection model; the detection result comprises a first detection result corresponding to a first target detection head and a second detection result corresponding to a second target detection head; determining an isolation index according to the first detection result and the second detection result; and determining safety warning information of the work scene according to the isolation index. The method can improve the warning accuracy.

The present disclosure provides a method for process control for a semiconductor plant, a higher-level computer, a controller and a system, and relates to the field of semiconductor technology.The process control procedure for a semiconductor plant comprises: capturing a process file required to control the semiconductor plant to execute a predefined process sequence; the process file being generated based on received process configuration parameters and comprising several process commands corresponding to all process operations required to execute the predefined process sequence, with each process command being assigned to a process operation; transmitting the process file to the controller at the start of the process so that the controller sequentially analyzes the process commands individually and controls the semiconductor plant based on the process parameters in the process commands to execute the corresponding process operation.The present disclosure enables controller-centric process control, increases the reliability of process control, improves the efficiency of information transfer, reduces plant costs and increases the stability of process control.

The invention discloses an electrical load prediction method, system and device for a semiconductor factory and a medium. The method comprises the following steps: acquiring historical electrical load data of a power grid system of the semiconductor factory; determining a lagging order according to the historical electrical load data, and screening input features according to the lagging order; a tree model algorithm is adopted to fit the input features and the electricity consumption in a period of time in the future, and a prediction model is constructed; and predicting future electric load data of the power grid system through the prediction model and outputting a result. According to the method, feature screening is carried out through hysteresis correlation, secondary screening is carried out on the features through feature importance of the tree model, and the autoregression prediction accuracy is improved.

The invention discloses a rapid loading and unloading method for a semiconductor factory, which belongs to the technical field of automation, and comprises the following steps: detecting an unloading signal of a machine A in real time through a material management server, acquiring processing material information and determining the position of a next machine B; the server generates loading and unloading tasks and dispatches the AGV, and the AGV executes efficient transportation and loading and unloading operation of the materials from the machine A to the machine B according to the priority order and the electronic map, so that the technical problem of reducing the on-site machine waiting time is solved, the priority of the materials can be efficiently managed, it is ensured that the high-priority tasks can be executed preferentially, and the working efficiency is improved. The complexity of task allocation is reduced, conflicts between AGVs on the route are avoided, the safety and efficiency of the whole scheduling process are improved, shutdown and waiting of a machine table caused by asynchronous feeding and discharging are avoided, the speed of material feeding and discharging is increased, the idle time of the machine table is shortened, and the overall production efficiency is improved.

The utility model discloses a semiconductor manufacturing execution system and a digital factory, which relates to the field of semiconductor manufacturing digitization, including: an MES execution system, an AMHS material control system, a warehouse logistics management system, a compound production equipment, and an AGV robot, wherein the number of the compound production equipment is multiple, and the number of the AGV robots is also multiple; the MES execution system, the AMHS material control system, the warehouse logistics management system, and the multiple compound production equipment are all located in the same space, and the MES execution system includes a total control module, a factory integration module, and a product integration module, and the total control module is connected to the factory integration module and the product integration module respectively. The beneficial effect of this application is that it can realize the upgrading and transformation of office buildings, build a bridge between semiconductor production and management, improve the operation of semiconductor factories and enhance management efficiency.

The utility model discloses a semiconductor factory affair comprehensive waste gas treatment device which comprises an oxygen catalyst of an existing structure, at least one waste gas treatment mechanism connected with the oxygen catalyst and an ionization treatment mechanism which are connected in sequence, the waste gas treatment mechanism comprises a shell, and a containing cavity is formed in the shell. An inlet is formed in the first side of the lower bottom face of the shell, and an outlet is formed in the second side of the top of the shell. An air guide pipe is integrally formed at the inlet towards the interior of the containing cavity, a plurality of air holes are formed in the end of the air guide pipe, solid filler or liquid filler is arranged in the containing cavity, and a bent part is arranged on the air guide pipe so that the air holes can be located in the solid filler or the liquid filler. The waste gas treatment mechanism adopted by the utility model can react with solid or liquid fillers in a multi-stage manner, so that the waste gas treatment efficiency is improved, and the device is suitable for organic and inorganic comprehensive waste gas.

The application relates to a safety warning method, device and equipment for a semiconductor factory work scene. The method comprises the following steps: acquiring a work scene image of a semiconductor factory; inputting the work scene image into a target detection model and receiving a detection result of the target detection model; the detection result comprises a first detection result corresponding to a first target detection head and a second detection result corresponding to a second target detection head; determining an isolation index according to the first detection result and the second detection result; and determining safety warning information of the work scene according to the isolation index. The method can improve the warning accuracy.

The invention discloses a semiconductor factory fault tracing method and system based on LLM and retrieval enhancement, belongs to the field of semiconductor manufacturing and intelligent troubleshooting, and aims to solve the problems that historical processes and defect report fields of a semiconductor factory are not uniform, a retrieval mode is single, the accuracy rate is low, and a fault tracing result lacks causal reasoning and interpretation. Firstly, report key information fields are extracted through combination of a large language model, rules and codes, and source identifiers are added; secondly, field semantic normalization is achieved through large language model cue word mapping, and field data structure specifications are unified; then writing the data into an elastic search database, defining text type fields and adding comprehensive content fields containing field combination information; when a user asks a question, the question is analyzed through a large language model to generate a selected statement for query, and two-stage retrieval is executed. According to the method, the retrieval accuracy and recall rate can be improved, the interpretability of fault tracing is realized, and the method has dynamic expansion capability and assists engineers in quickly removing faults and making decisions.

The application discloses a kind of semiconductor factory IPA-containing wastewater recycling device, it is related to semiconductor industry wastewater resource recovery technical field, including premixing tank, heat exchanger, rectifying column, buffer tank, osmotic vaporization membrane assembly, crude IPA tank, resin refining tank and finished product IPA storage tank.Premixing tank is provided with flow guide pipe, paddle assembly and rotating shaft stem, can drive wastewater circulation flow, realize raw material homogeneous premixing;Rectifying column bottom is provided with material scraping assembly, and material scraping assembly includes scraping shaft, scraping rod and spiral feeding auger, can be scraped to the deposition kettle residue at tower bottom and is transported to waste storage tank inside centralized collection and discharge;Premixing tank and material scraping assembly are linked by transmission mechanism, realize power sharing.The application can improve wastewater premixing effect and rectifying operation stability, reduce kettle residue deposition and shutdown cleaning frequency, pre-adjust pH value, realize the efficient resource recycling of semiconductor industry IPA-containing wastewater.