Polyvinyl alcohol cinnamate type KPR photoresist etching residue stripping agent composition

Abstract

The invention discloses a polyvinyl alcohol cinnamate type KPR photoresist etching residue stripping agent composition, which comprises 40-70% of an organic solvent, 1-20% of organic amine, 0.5-10% of a corrosion inhibitor, 0.2-5% of a surfactant, 1-5% of fluoride and the balance of ultrapure water, the surfactant is one or a mixture of more of ethylene glycol, glycerol, glucose, sorbitol, pentaerythritol, xylitol and AEO-7; the organic amine is one or a mixture of more of monoethanolamine, triethanolamine and isopropanolamine; the corrosion inhibitor is one or a mixture of more of phenols, carboxylic acids and benzotriazoles. The stripping agent has higher cleaning efficiency, the cleaning time is remarkably shortened compared with that of similar products, the cleaning effect and the protection effect on a wafer base material are better, and the operation cost of a semiconductor factory can be remarkably reduced.

Description

technical field [0001] The invention belongs to the technical field of semiconductor photoresist strippers, in particular to a fluorine-containing fast stripper used for removing KPR type photoresist etching residues. Background technique [0002] In the production process of semiconductor chips, it is necessary to use photolithography and etching to transfer the designed graphics from the mask to the wafer, so as to finally produce ultra-highly integrated chips. The specific process is to deposit thin films (including silicon dioxide, silicon nitride, polysilicon, silicon carbide, gallium nitride, titanium, titanium nitride, cobalt, tungsten, copper, aluminum, nickel, etc.) Resist coating, exposure, development, ion implantation or etching, ashing, cleaning. Among them, during the ion implantation or etching process, the photoresist will become hardened due to ion bombardment and difficult to remove, and the etching process will leave a large amount of polymer by-products ...

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Problems solved by technology

And longer cleaning time will make the occupancy rate of cleaning equipment remain high, thus prompting semiconductor factories to purchase more equipment and occupy more clean rooms to meet the growing cleaning demand

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