Heat dissipation device, semiconductor production system and fault monitoring method of heat dissipation fan

A heat dissipation device and heat dissipation fan technology, which is applied in semiconductor/solid-state device manufacturing, pump control, non-variable pumps, etc., can solve the problems that the failure of the heat dissipation fan cannot be found in time, the production accident monitoring circuit is complex, and the lack of real-time monitoring of the heat dissipation fan, etc. problem, to achieve the effect of simple fault monitoring method, simple structure, and avoiding production accidents

Active Publication Date: 2019-10-18
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a fault monitoring method for a heat sink, a semiconductor production system and a heat dissipation fan, which is used to solv...

Method used

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  • Heat dissipation device, semiconductor production system and fault monitoring method of heat dissipation fan
  • Heat dissipation device, semiconductor production system and fault monitoring method of heat dissipation fan
  • Heat dissipation device, semiconductor production system and fault monitoring method of heat dissipation fan

Examples

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Embodiment 1

[0044] Such as figure 1 and figure 2 As shown, the present invention provides a heat dissipation device 1, the heat dissipation device 1 includes a cooling fan 11 and a current monitoring module 12; the cooling fan 11 includes a motor 111; the current monitoring module 12 has an input terminal and an output terminal, wherein The input terminal of the current monitoring module 12 is connected to the motor 111 for monitoring the induced current of the motor 111, and the output terminal of the current monitoring module 12 is used for outputting the detected induced current. The cooling fan 11 needs to be connected to a power supply Vcc during operation, and the power supply is generally a converted DC power supply.

[0045] The heat dissipation fan 11 can be a fan with blades or a fan without blades. Although the working principles are slightly different, they all take heat away by accelerating the flow of air. For example, the bladeless fan uses the motor 111 to suck air into...

Embodiment 2

[0056] Such as figure 1 and figure 2As shown, the present invention also provides a semiconductor production system, the semiconductor production system includes semiconductor production equipment 2, a power supply device 3 and a heat dissipation device 1, wherein the power supply device 3 is connected to the semiconductor production equipment 2; The heat dissipation device 1 includes a heat dissipation fan 11 and a current monitoring module 12, and the heat dissipation fan 11 is located in the power supply device 3 for dissipating heat to the power supply device 3, and the heat dissipation fan 11 includes a motor 111; the current The monitoring module 12 has an input terminal and an output terminal. The input terminal of the current monitoring module 12 is connected to the motor 111 to monitor the induced current of the motor 111. The output terminal of the current monitoring module 12 is used for outputting The sensed current is monitored. The heat dissipation device 1 is...

Embodiment 3

[0059] The present invention also provides a method for monitoring the failure of the cooling fan. When the cooling fan 11 is working, the induced current of the motor 111 located in the cooling fan 11 is monitored in real time, and the cooling fan is judged according to the detected induced current. Whether fan 11 is faulty.

[0060] Such as image 3 As shown, in order to achieve the purpose of the present invention, a monitoring circuit is constructed in this embodiment, and the monitoring circuit is connected to the motor 111 in a heat dissipation fan 11, and is used to monitor in real time when the heat dissipation fan 11 is working. The induced current of the motor 111 in the cooling fan 11 is used to determine whether the cooling fan 11 is faulty according to the detected induced current.

[0061] As an example, the monitoring circuit includes a current monitoring module 12, the current monitoring module 12 has an input terminal and an output terminal, wherein the input...

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PUM

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Abstract

The invention provides a heat dissipation device. The device comprises a heat dissipation fan and a current monitoring module, wherein the heat dissipation fan comprises a motor, the current monitoring module is provided with an input end and an output end, wherein the input end of the current monitoring module is connected with the motor and used for monitoring the induction current of the motor.The invention further provides a semiconductor production system. The system involves semiconductor production equipment, a power supply device and the heat dissipation device, wherein the power supply device is connected with the semiconductor production equipment, the heat dissipation device comprises the heat dissipation fan and the current monitoring module, the heat dissipation fan is located in the power supply device and used for dissipating heat for the power supply device, the heat dissipation fan comprises the motor, the current monitoring module is provided with the input end and the output end, and the input end of the current monitoring module is connected with the motor and used for monitoring the induction current of the motor. According to the device and the system, the structure is simple, the use is convenient, the cost is low, and a guarantee can be provided for the safe production of a semiconductor factory; and the fault monitoring method of the heat dissipation fan is simple and feasible, and has great popularization value.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a fault monitoring method for a cooling device, a semiconductor production system and a cooling fan. Background technique [0002] For industrial equipment, especially large-scale power equipment like semiconductor production equipment that operates 24 hours a day for 365 days, heat dissipation is a very important issue, especially at the power supply end of the equipment. Cool the power supply unit. Because electric energy will inevitably be lost during the transmission process, the lost electric energy will generally be dissipated in the form of heat; in addition, the power supply device is generally composed of hundreds of electronic components such as resistors and capacitors. Components also generate heat when they are in working condition. If the heat is not dissipated in time, the temperature of the entire power supply device will rise, and the greater the power sup...

Claims

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Application Information

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IPC IPC(8): F04D27/00H01L21/67
CPCF04D27/001F04D27/008H01L21/67011
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC
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