Heat dissipation device, semiconductor production system and fault monitoring method of heat dissipation fan

Abstract

The invention provides a heat dissipation device. The device comprises a heat dissipation fan and a current monitoring module, wherein the heat dissipation fan comprises a motor, the current monitoring module is provided with an input end and an output end, wherein the input end of the current monitoring module is connected with the motor and used for monitoring the induction current of the motor.The invention further provides a semiconductor production system. The system involves semiconductor production equipment, a power supply device and the heat dissipation device, wherein the power supply device is connected with the semiconductor production equipment, the heat dissipation device comprises the heat dissipation fan and the current monitoring module, the heat dissipation fan is located in the power supply device and used for dissipating heat for the power supply device, the heat dissipation fan comprises the motor, the current monitoring module is provided with the input end and the output end, and the input end of the current monitoring module is connected with the motor and used for monitoring the induction current of the motor. According to the device and the system, the structure is simple, the use is convenient, the cost is low, and a guarantee can be provided for the safe production of a semiconductor factory; and the fault monitoring method of the heat dissipation fan is simple and feasible, and has great popularization value.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a fault monitoring method for a cooling device, a semiconductor production system and a cooling fan. Background technique [0002] For industrial equipment, especially large-scale power equipment like semiconductor production equipment that operates 24 hours a day for 365 days, heat dissipation is a very important issue, especially at the power supply end of the equipment. Cool the power supply unit. Because electric energy will inevitably be lost during the transmission process, the lost electric energy will generally be dissipated in the form of heat; in addition, the power supply device is generally composed of hundreds of electronic components such as resistors and capacitors. Components also generate heat when they are in working condition. If the heat is not dissipated in time, the temperature of the entire power supply device will rise, and the greater the power sup...

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Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a fault monitoring method for a heat sink, a semiconductor production system and a heat dissipation fan, which is used to solve the problem of lack of real-time monitoring of the heat dissipation fan in the prior art. When the cooling fan fails, it cannot be found in time, causing serious production accidents or secondary risks due to the complexity of the monitoring circuit.

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