Photoresist edge edge-wash data measuring system and measurement monitoring method

Abstract

The invention discloses a photoresist edge edge-wash data measuring system. The system comprises a developing post-measuring machine, a wafer edge position sensor, an edge-wash line position sensor, a logic operation unit and a pre-warning unit. The system can be used for carrying out developing post-measuring on the wafer and simultaneously calculating the edge-wash width of the photoresist edge and the offset of the edge-wash line, thus the photoresist edge edge-wash data can be obtained in time. The invention further discloses a measurement monitoring method of the photoresist edge edge-wash data, comprising the following steps: measuring and calculating the photoresist edge edge-wash data by using the system; automatically collecting the data, and sending the data to an automatic monitoring system of a semiconductor factory; judging whether the edge-wash width exceeds the maximum allowable width and whether the offset of the edge-wash line exceeds the maximum allowable offset, when exceeds, raising an alarm, and sending the edge-wash width and the offset to workers for measurement. According to the method, the real-time monitoring of the photoresist edge edge-wash data can be realized, and the offset of the edge-wash line can be discovered in time.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a photoresist edge washing data measurement system and a measurement monitoring method. Background technique [0002] The photolithography process is one of the most important process steps in semiconductor manufacturing. The main function of photolithography is to copy the pattern on the mask plate to the semiconductor wafer to prepare for the next etching or ion implantation process. In the photolithography process, the gluing process occupies a very important position, because the quality of the gluing directly determines the quality of the alignment in the lithography process. In the process of gluing, the photoresist usually covers the entire semiconductor wafer. In order to prevent pollution to the semiconductor machine and avoid photoresist burrs on the edge of the semiconductor wafer, it is usually necessary to remove the photoresist in the edge area o...

AI Technical Summary

Problems solved by technology

Therefore, the offset of the edge washing line cannot be found in time, which will affect the yield rate of integrated circuits and the performance of semiconductor devices

[0007] In order to detect the offset of the edge washing line earlier, the current measure is visual inspection. However, it is very difficult to find the offset of the edge washing line through visual inspection, and it is also extremely unscientific

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