Method and system for controlling lifting mechanism of air transport vehicle

A technology of a lifting mechanism and a control method, which is applied in the field of semiconductor wafer manufacturing equipment, can solve problems such as prolonging the clamping or releasing time of target items, prolonging the clamping or releasing action cycle, and affecting production efficiency, so as to improve wafer production efficiency , shorten the action cycle, improve the effect of handling efficiency

Active Publication Date: 2022-05-10
MEETFUTURE TECH (SHANGHAI) CO LTD
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]In the existing aerial transport vehicles, due to production needs, belts are often used to achieve flexible connection between the clamping mechanism and the lifting mechanism, and the flexible characteristics of the belt make the lifting mechanism In the process of lowering the clamping mechanism, the clamping mechanism shakes and swings to a certain extent relative to the lifting mechanism, so the clamping mechanis

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for controlling lifting mechanism of air transport vehicle
  • Method and system for controlling lifting mechanism of air transport vehicle
  • Method and system for controlling lifting mechanism of air transport vehicle

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0059] Embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0060] Embodiments of the present application are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. The present application can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a method and system for controlling a lifting mechanism of an air transport vehicle, which are applied to the technical field of semiconductor wafer manufacturing equipment.The method for controlling the lifting mechanism of the air transport vehicle comprises the steps that when the air transport vehicle runs to a preset position in a track, the lifting mechanism is started to drive a clamping mechanism; therefore, the clamping mechanism does lifting motion; and acquiring a speed value of the lifting motion, and performing segmented control on the lifting motion of the clamping mechanism according to the speed value of the lifting motion. The speed of the lifting motion is acquired in real time, and the lifting motion is subjected to stable and rapid segmentation control according to the real-time speed, so that the whole lifting motion runs stably, the running stroke perimeter is obviously optimized, the wafer carrying efficiency in automatic application of a semiconductor factory is greatly improved, and the wafer production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer manufacturing equipment, in particular to a method and system for controlling the lifting mechanism of an aerial transport vehicle in an automatic material handling system. Background technique [0002] The aerial transport vehicle in the automatic material handling system (AMHS, Automatic Material Handling System, also known as the crane system) needs to move the target clamping object from one place to the set position as required. Since the aerial transport vehicle runs above the production equipment, it is therefore The aerial transport vehicle includes a relatively fixed lifting mechanism and a liftable clamping mechanism, and then the lifting mechanism controls the lifting of the clamping mechanism, so that the clamping mechanism reaches a predetermined position to pick up the target item (such as a wafer box), Movements such as transport and release. [0003] In the existing ae...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B66C1/44B66C13/16B66C13/18H01L21/677
CPCB66C1/44B66C13/16B66C13/18H01L21/67733
Inventor 杜宝宝缪峰
Owner MEETFUTURE TECH (SHANGHAI) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap