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System and method for monitoring parameters of a semiconductor factory automation system

An automation system and semiconductor technology, applied in general control systems, semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, etc., can solve problems such as difficult to identify automation systems, automation system errors and deviations, cumbersome and slow

Active Publication Date: 2018-02-13
KLA TENCOR TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manual identification of errors and deviations in semiconductor production line automation systems is cumbersome and slow, making it difficult to identify the root cause of errors and deviations in automation systems

Method used

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  • System and method for monitoring parameters of a semiconductor factory automation system
  • System and method for monitoring parameters of a semiconductor factory automation system
  • System and method for monitoring parameters of a semiconductor factory automation system

Examples

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Embodiment Construction

[0026] Reference will now be made in detail to the disclosed subject matter illustrated in the accompanying drawings.

[0027] generally refer to Figures 1A to 4B A system and method for monitoring one or more conditions of a semiconductor automation system in accordance with one or more embodiments of the present invention will be described. Embodiments of the present invention are directed to automatic measurement and / or monitoring of one or more parameters and / or conditions of an automation system of a semiconductor factory or production line. For example, parameters and / or conditions measured and / or monitored by embodiments of the invention may include, but are not limited to, leveling, teaching, alignment, cleanliness, pressure, and / or health of an automated system. Such automated systems may include, but are not limited to, automated material handling systems (such as overhead transport systems, automated warehouses, and the like) and FOUP / wafer handling systems for ha...

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PUM

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Abstract

A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included onthe one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.

Description

[0001] Cross References to Related Applications [0002] This application claims under 35 U.S.C. §119(e) named Mor Azarya, Michael D. Brain, Ami Appelbaum, The inventors, Shai Mark and Arie Hoffman, are entitled "Automated Measurement and Monitoring of Leveling, Teaching, Alignment, Cleanliness, and Method of Healthy Parameters (METHOD TOAUTOMATICALLY MEASURE AND MONITOR PARAMETERS SUCH AS THE LEVELING, TEACHING, ALIGNMENT, CLEANLINESS, AND HEALTH OF SEMICONDUCTOR FACTORY AUTOMATION SYSTEMSAND WAFER CHARGER) "US Provisional Application No. 62 / 180 on June 16, 2015, Claim to the Provisional Application, the entirety of which is hereby incorporated by reference. technical field [0003] The present invention relates generally to monitoring conditions of a semiconductor factory automation system, and more particularly, the present invention relates to an instrumented substrate for monitoring parameters of a semiconductor factory automation system. Background technique [0004...

Claims

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Application Information

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IPC IPC(8): G05B19/418
CPCG05B2219/31368G05B19/41875G05B19/4184H01L22/34G05B2219/31372H01L21/67253G05B2219/45031Y02P90/02G05B19/418H01L21/02H01L21/67005
Inventor 莫尔·阿扎耶迈克尔·布雷恩阿米·阿佩尔博姆沙伊·马克阿里·奥罗曼
Owner KLA TENCOR TECH CORP
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