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Method for preparing calibration standard sheet and method for calibrating with the standard sheet

A technology of calibration standards and standard slices, which is applied in the field of preparation of calibration standard slices, can solve the problems of actual precision constraints, high calibration frequency, sample damage, etc., and achieve the effect of improving measurement accuracy and reducing costs

Active Publication Date: 2011-12-14
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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AI Technical Summary

Problems solved by technology

In order to ensure the accuracy of the sample, the difference cannot be very small, so the actual accuracy of the calibration is restricted
[0004] At the same time, the existing SEM measurement will cause slight damage to the sample, and the accuracy of the high-precision standard sample will gradually decrease as time goes by
Therefore, if the semiconductor manufacturer has a lot of measurement equipment and the daily calibration frequency is high, the purchase cost of high-precision standard chips is very high

Method used

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  • Method for preparing calibration standard sheet and method for calibrating with the standard sheet
  • Method for preparing calibration standard sheet and method for calibrating with the standard sheet
  • Method for preparing calibration standard sheet and method for calibrating with the standard sheet

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preparation example Construction

[0018] An example of the preparation method of the calibration standard sheet of the present invention is as follows:

[0019] Prepare a photomask first, on the photomask as figure 2 The same test patterns are placed in the three positions shown in position 1, position 2 and position 3 respectively. The test pattern can be as figure 1 The shown 100nm linear dense pattern may also be a 100nm spatial dense pattern. After the photomask is made, the actual values ​​of the test patterns CD at the three positions are 101nm, 100nm, and 99nm. Mask manufacturers can accurately measure the values ​​of these three points, and the difference is within 2nm.

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Abstract

The invention discloses a preparation method of calibration standards, the calibration standards are used for calibrating a measure device with nanometer size, the invention is characterized in that the preparation method comprises the following steps: 1) preparing a photolithographic masking plate, placing the testing figures on more than two different positions of the photolithographic masking plate; 2) employing different exposure conditions, using the photolithographic masking plate for expositing at different positions of one silicon chip, and then developing and etching to obtain the calibration standards. According to the invention, a series of measured measure figures are taken as the calibration standards which are greatly raised the measure precision of equipments. Simultaneously, the difference for measuring the figures is generated through different illumination conditions, production can be realized in a common semiconductor factory, so that the cost of the calibration standards can be greatly reduced.

Description

technical field [0001] The invention relates to a method for preparing a calibration standard slice of a measuring device in semiconductor preparation. Background technique [0002] With the increasing development of semiconductor technology, the minimum critical dimension continues to shrink, how to accurately control the actual critical dimension in production becomes crucial. And ensuring the accuracy and stability of the measuring equipment is the key and the only feasible monitoring method to ensure the control ability in production. Therefore, it is very important for every semiconductor manufacturer to continuously improve the accuracy of daily monitoring of measuring equipment, which directly determines the production capacity of the factory. [0003] For the existing calibration method, a high-precision standard sample is usually used as a ruler, and then the standard sample is measured and compared with the set data every day, and the equipment is calibrated if an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/00G03F9/00
Inventor 王雷
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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