Composite slurry for doping in semiconductor industry and curing film-forming processing method

A composite slurry and semiconductor technology, applied in semiconductor/solid-state device manufacturing, heating water/sewage treatment, electrical components, etc., can solve the problems of economy, environmental loss, cumbersome process, environmental pollution, etc.

Pending Publication Date: 2020-10-27
崔恩密 +1
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, this patent represents the domestic level of the doped membrane product industry. According to this process, the finished membrane can be produced, but there are problems such as cumbersome process, serious waste of solvent, and serious environmental pollution, especially in today's environmental protection. A large amount of VOC is discharged into the atmosphere. Even after waste gas treatment, a large amount of solvents will inevitably escape and enter the atmosphere, causing economic and environmental losses.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite slurry for doping in semiconductor industry and curing film-forming processing method

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0041] Weigh 30kg of rubber material (natural rubber, polyisoprene rubber or hydroxyl-terminated polybutadiene-styrene rubber) as the main body,

[0042] Take by weighing 15kg polyethylene glycol as dispersant;

[0043] Weigh 35kg of water and ethanol as the dispersion medium, and the ratio of water and ethanol is 1:2;

[0044] Take by weighing 30kg calcium carbonate as solid filler,

[0045] Take by weighing 15kg borax,

[0046] Stir the above materials evenly to form a viscous fluid.

preparation Embodiment 2

[0048] Weigh 40kg of rubber material (hydroxymethyl cellulose ether, ethyl cellulose or soluble starch) as the main body,

[0049] Take by weighing 9kg methyl amyl alcohol as dispersant;

[0050] Take by weighing 25kg toluene as dispersion medium;

[0051] Take by weighing 25kg titanium dioxide as solid filler,

[0052] Take by weighing 10kg trimethyl borate,

[0053] Stir the above materials evenly to form a viscous fluid.

preparation Embodiment 3

[0055] Weigh 50kg of rubber material (polyvinyl alcohol, polyvinyl butyral, polyvinyl formal or thermoplastic linear polyurethane (TPU)) as the main body,

[0056] Take by weighing 3kg fatty acid polyethylene glycol ester as dispersant;

[0057] Weigh 15kg of trichloroethylene and diethylene glycol as the dispersion medium, and the ratio of trichloroethylene and diethylene glycol is 1:1;

[0058] Weigh 20kg diatomaceous earth as solid filler,

[0059] Weigh 5kg phosphorus element,

[0060] Stir the above materials evenly to form a viscous fluid.

[0061] The invention relates to a solidification and film-forming processing method of a composite slurry for doping in the semiconductor industry. The composite slurry for doping is processed by wet papermaking equipment, and the doped The composite slurry is used for water washing, and the water washing adopts deionized water or ultrapure water.

[0062] During specific production, the above-mentioned slurry is immersed in pure...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
elongation at breakaaaaaaaaaa
Login to view more

Abstract

The invention discloses composite slurry for doping in the semiconductor industry and a curing film-forming processing method. The invention belongs to the field of high polymer materials, and particularly relates to composite slurry for doping in the semiconductor industry and a subsequent curing molding manufacturing method. According to the curing film-forming processing method of composite slurry for doping in the semiconductor industry, the composite slurry for doping is used for processing the composite slurry for doping by adopting wet papermaking equipment, and the composite slurry ischaracterized in that the composite slurry for doping is washed by deionized water or ultrapure water before being put into the wet papermaking equipment. The composite slurry and the forming film thereof are moderate in hardness, moderate in strength and uniform and consistent in doping, and the strict index requirement that the product yield is larger than 99.999% is met when parallel contrast tests are conducted on famous semiconductor manufacturers and imported products in China. The composite slurry has positive significance for realizing import substitution of the product and getting ridof dependence on foreign imported products.

Description

technical field [0001] The invention belongs to the field of macromolecular materials, and in particular relates to a composite slurry for doping in the semiconductor industry and a subsequent solidification molding manufacturing method. Background technique [0002] Doping (diffusion process) in the existing semiconductor industry mainly uses composite slurry and subsequent curing forming film products, which are niche products and have an extremely narrow application range. The national saturated market share is only tens of millions of RMB. At the same time, it belongs to high-end electronic chemicals, which has disadvantages such as high entry threshold, long certification cycle, and high compensation costs for quality problems. Therefore, it is rare to invest large-scale funds in this field for R & D and production, so this product has been monopolized by foreign companies for a long time. At present, FILMTRONICS products imported from the United States are on the dome...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/02C08J3/11C08L7/00C08L9/00C08L9/06C08L1/28C08L3/02C08L29/04C08L29/14C08L75/04C08K3/26C08K3/38C08K3/22C08K5/55C08K7/26C08K3/02C08J5/18C02F1/04H01L21/225
CPCC08J3/02C08J3/11C08J5/18C02F1/04H01L21/2251C08J2307/00C08J2309/00C08J2309/06C08J2301/28C08J2303/02C08J2329/04C08J2329/14C08J2375/04C08K2003/265C08K2003/387C08K2003/2241C08K5/55C08K7/26C08K2003/026
Inventor 崔恩密王毅崔乐珅
Owner 崔恩密
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products