Method for patterning a substrate surface

Abstract

An elastomeric stamp (10) is provided, which has a bulk surface (12) from which protruding features (14, 14') extend. A barrier layer (20) covers the bulk surface (12) and the protruding features (14, 14'). After applying an ink solution to the elastomeric stamp (10) and drying the elastomeric stamp (10), the elastomeric stamp (10) is brought into contact with a surface (42) of a first substrate (40). The surface (42) of the first substrate (40) has a high affinity with the ink molecules (32), which is utilized to effectively remove the ink molecules (32) from the contact surfaces (16, 16') of the protruding features (14, 14'). Subsequently, the elastomeric stamp (10) is brought into contact with the surface (52) of a second substrate (50). Ink molecules 32 are transferred from the edges (18, 18') of the protruding features (14, 14') to the surface (52) of a second substrate (50), thus forming an ink pattern in the form of a selfassembled monolayer on this surface (52). The patterning method of the present invention allows for the formation of high-definition ink patterns on a substrate (50) using a wide variety of inks.

Description

technical field [0001] The present invention relates to a method of patterning the surface of a substrate with ink. Background technique [0002] Typically, microscopic patterns of devices including electronic devices are formed using photolithographic steps that include masks to define these patterns on the substrate of the electronic devices. However, as predicted by Moore's Law, as the semiconductor feature size shrinks, the patterns formed on the substrate become increasingly complex, which usually results in the need for a greater number of masks, which are expensive processes to produce, This further increases the production costs of the electronic device. In addition, the foregoing conventional photolithographic techniques are generally considered to have matured to such an extent that further reductions in feature size on electronic device substrates using these techniques would be difficult to achieve. [0003] Alternative techniques for patterning electronic devi...

AI Technical Summary

Problems solved by technology

[0005] However, this particular technique has many disadvantages

This dewetting step can leave ink marks on the contact surface of the imprinted raised parts, which can cause blurring of parts printed on the substrate

In addition, only a few hydrophilic ink solutions will show the desired dewetting effect on the imprint, which also limits the application of this technology.

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