Package of image sensor, and packaging procedure

Abstract

The package of image sensor includes a base plate, an image-sensing chip, multiple leads, a piece of mucilage glue and a cover body. The base plate possesses an up surface where there are multiple up weld pads. The image-sensing chip is fixed on the up surface, and a sensing area is positioned on the top surface. There are also multiple weld pads for chip on the image-sensing chip. Ends of multiple leads are connected to weld pads of image-sensing chip, and the other ends of multiple leads are connected to weld pads on base plate electrically. Mucilage glue is coated to top surface around image-sensing chip to cover joint between leads and pads of chip. Height of the mucilage glue is higher than height of leads. The cover body is a transparent sheet fixed on the mucilage glue. Advantages are: small size of package, reducing pollution on the sensing area from dust effectively so as to raise rate of good production.

Description

【Technical field】 [0001] The present invention relates to chip packaging and packaging process, in particular to a small-size image sensor package and packaging process. 【Background technique】 [0002] Image sensors can detect light sources in space and convert them into electrical signals. They have been widely used in various optoelectronic products and become one of the key components. At present, mobile phones are developing toward multifunctional trends, and mobile phones with camera functions are very popular once they are released. Camera modules used in mobile phones must not only meet the requirements of thinness, lightness and compactness, but also have better photographic performance. The image sensor is one of the main factors that determine the size and camera performance of the camera module. [0003] Such as figure 1 A traditional image sensor package shown, the image sensor package includes a substrate 10, an image sensor 12 and a cover 14, wherein the sub...

AI Technical Summary

Problems solved by technology

In this way, it cannot meet the requirements of current electronic products that are light, thin and short

[0005] In addition, although it is unavoidable that the substrate 10 and the cover 14 generate dust to contaminate the sensing area 121 of the image sensor 12, the space enclosed by the substrate 10 and the cover 14 where the image sensor 12 is located is relatively small. Larger, the dust-generating surface is also larger, and the sensing region 121 is more susceptible to dust contamination, resulting in a lower production yield of the image sensor package.

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