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Method of assembling chips of laser diode

An assembly method and a technology of laser diodes, which are applied to lasers, laser components, semiconductor lasers, etc., can solve problems such as uneven temperature distribution of sub-mounting boards 11, and achieve the effects of improving reliability, improving efficiency, and shortening time

Inactive Publication Date: 2007-02-21
LEJIN GUANGDIAN ELECTRONIC CO LTD SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0022] This one-point heating method makes the device constituting the heat source 20 relatively simple, and the process is also relatively simple, but the temperature distribution on the sub-mounting board 11 is not uniform due to the heat conduction phenomenon of the transistor base 10a, and the same phenomenon also exists during cooling

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  • Method of assembling chips of laser diode
  • Method of assembling chips of laser diode
  • Method of assembling chips of laser diode

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Embodiment Construction

[0043] Embodiments of the method for assembling laser diode chips of the present invention will be described in detail below with reference to the accompanying drawings.

[0044] image 3 is a schematic diagram of the laser diode chip assembly method according to the present invention. One side of the transistor tube base (stem) 100a is connected with one side of a heat sink (heat sink) 100 joined with a sub mount (sub mount) board 110 at the top; 1 heat source (heat source) 200; Install the second heat source 210 on the other side of the heat sink 100; Install the third heat source 220 on the bottom of the heat sink 100; Bond the sub-mount board 110 on the top of the heat sink 100; The upper part of 110 is placed with solder and the laser diode chip 120 that is to be combined with the solder on the upper part of the sub-mounting board; the first to third heat sources 200, 210, 220 mentioned above are heated, and the heat transmitted by the transistor base 100a is melted The...

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Abstract

The method includes steps: one side face of stem is connected to one side face of a thermal fin jointed to a sub mounting plate in up part; first heat source is installed on the other side face of stem; second heat source is installed on the other side face of the thermal fin; third heat source is installed on low sect of the thermal fin; solder, and chip of laser diode to be jointed to the sub mounting plate in up part are setup on up sect of the sub mounting plate; using heat transferred by stem melts solder to band chip of laser diode and sub mounting plate together. Advantages are: banding chip of laser diode sub mounting plate together evenly, raised degree of belief in use, shortening time for assembling chip of laser diode, and improving production efficiency.

Description

technical field [0001] The present invention relates to the technology of the assembly method of the laser diode chip, especially refers to installing the first to the third heat sources on one side of the transistor base, one side and the lower part of the heat sink respectively, so as to realize heat transfer and make the laser diode chip uniform. Combined with the sub-mounting board, the reliability of use is improved, the time of laser diode assembly process is shortened, and the efficiency of production is improved. Background technique [0002] Recently, with the development of highly integrated CDRW (Compact Disk-Rewritable), DVDRW (Digital VideoDisk-Rewritable), and BDRW (Blu-ray Disk-Rewritable), the development of high-output laser diodes used as light sources is particularly important. [0003] Such high-output laser diodes are required to have high-level electronic, mechanical, and optical characteristics such as high output, high reliability, precision, thermal ...

Claims

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Application Information

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IPC IPC(8): H01S5/024H01S5/022
Inventor 余德镐
Owner LEJIN GUANGDIAN ELECTRONIC CO LTD SHANGHAI