Method of resin seal moulding electronic component and apparatus therefor

A technology for resin sealing and electronic components, which is applied to electrical components, electric solid devices, circuits, etc., can solve the problems of unsimplified metal mold structure, large amount of resin, uneconomical and other problems, achieve easy metal mold maintenance operations, and suppress waste resin. The effect of easy generation and practical application
CN1941308AInactive Publication Date: 2007-04-04TOWA
2 Cites 4 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOWA
Publication Date
2007-04-04
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A mold (110) for resin-seal-molding an electronic component is constituted by a first mold (111) and a second mold (112). A molding face (PL) of the molds has a substrate supply-set surface (113), which has a flat shape without a step. A pot block (140) is joined with and separated from a side position (110a) of the mold (110) perpendicular to the mold face (PL). In a state where the mold face and the pot block (140) are joined, a molten resin material in the pot block (140) is injected into a cavity (114). Further, a mold-opening is performed where the second mold (112) is separated away from the one mold (111) in a state where the resin-seal-molded substrate is fixed to a mold surface of the one mold (111). According to the present method, the overall structure of the mold (110) for resin-seal-molding an electronic component can be simplified.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a method of sealing and molding relatively small electronic components such as semiconductor chips with a resin material, and a resin sealing and molding apparatus for electronic components used for carrying out the method. Background technique

[0002] In particular, in recent years, higher functionality has been demanded for semiconductor packages (hereinafter simply referred to as "semiconductor packages") in which relatively small electronic components such as semiconductor chips (hereinafter simply referred to as "electronic components") are sealed and molded with a resin material. Specifically, for example, such as a so-called molded array package (Japanese: Map) type large substrate, etc., there are strong demands for high integration, high reliability, and miniaturization (that is, light, thin, short, and small).

[0003] Therefore, when molding a semiconductor package, it is necessary to resin-seal and mold the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More