Method of resin seal moulding electronic component and apparatus therefor

A technology for resin sealing and electronic components, which is applied to electrical components, electric solid devices, circuits, etc., can solve the problems of unsimplified metal mold structure, large amount of resin, uneconomical and other problems, achieve easy metal mold maintenance operations, and suppress waste resin. The effect of easy generation and practical application

Inactive Publication Date: 2007-04-04
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the basic metal mold structure is not simplified
In addition, the amount of resin cured at these parts (the amount of discarded resin) is large and uneconomical.

Method used

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  • Method of resin seal moulding electronic component and apparatus therefor
  • Method of resin seal moulding electronic component and apparatus therefor
  • Method of resin seal moulding electronic component and apparatus therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] FIG. 1 schematically shows the overall configuration of a resin sealing molding device.

[0079] This resin sealing and molding apparatus includes: a resin sealing and molding unit 100 for resin sealing and molding an electronic component on a substrate; for transporting and supplying a substrate before resin sealing and molding to a predetermined position described later in the resin sealing and molding unit; a substrate supply and take-out mechanism 200 for taking out the resin-encapsulated substrate from the resin-encapsulation-molding section; Agency 300.

[0080] The resin sealing and molding part 100 includes: a mold 110 for resin sealing and molding electronic components; a mold opening and closing mechanism 120 for opening and closing the mold; A pressurizing mechanism (Japanese: press frame mechanism) 130 for applying the necessary mold clamping pressure to the mold; a feed block (Japanese: pottoblock) 140 arranged on the side of the mold 110 for supplying res...

Embodiment 2

[0133] 15 to 17 show a resin sealing molding apparatus according to another embodiment of the present invention. The difference between this apparatus and the resin sealing molding apparatus of the above-mentioned first embodiment is as follows.

[0134] That is, in the resin sealing molding apparatus of the first embodiment, a resin sealing region (see FIG. 10 ) for resin sealing electronic components is provided on one main surface of a substrate 400, but in FIG. In the resin sealing molding device of this embodiment, there are multiple resin sealing areas (two in the illustration). In addition, the device of this embodiment is similar to the first embodiment in terms of being provided with the feeding chamber 141 for supplying the resin material, the push rod 142 for pressurizing the resin material, and the reciprocating drive mechanism 143 for the push rod, etc. The device of one embodiment is different.

[0135] In addition, the device shown in FIG. 16 has basically the ...

Embodiment 3

[0139] 18 and 19 show a resin sealing and molding apparatus according to another embodiment of the present invention, which is a modified example of the resin sealing and molding apparatus of the second embodiment shown in FIGS. 15 and 16 above.

[0140] Although the number of processed resin-sealed molded products can be increased by using the device of the second embodiment shown in Figure 15 and Figure 16, the device of the third embodiment shown in Figure 18 and Figure 19 can further increase the number of resin-sealed molded products. The number of products processed.

[0141] In the device shown in FIG. 18, the device of the second embodiment shown in FIG. 15 is symmetrically arranged in the figure. In the device shown in FIG. The devices are arranged bilaterally symmetrically in the figure.

[0142] Furthermore, in the apparatus of the third embodiment, the mold clamping pressure described above is applied to each of the molds 110 arranged bilaterally symmetrically. T...

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PUM

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Abstract

A mold (110) for resin-seal-molding an electronic component is constituted by a first mold (111) and a second mold (112). A molding face (PL) of the molds has a substrate supply-set surface (113), which has a flat shape without a step. A pot block (140) is joined with and separated from a side position (110a) of the mold (110) perpendicular to the mold face (PL). In a state where the mold face and the pot block (140) are joined, a molten resin material in the pot block (140) is injected into a cavity (114). Further, a mold-opening is performed where the second mold (112) is separated away from the one mold (111) in a state where the resin-seal-molded substrate is fixed to a mold surface of the one mold (111). According to the present method, the overall structure of the mold (110) for resin-seal-molding an electronic component can be simplified.

Description

technical field [0001] The present invention relates to a method of sealing and molding relatively small electronic components such as semiconductor chips with a resin material, and a resin sealing and molding apparatus for electronic components used for carrying out the method. Background technique [0002] In particular, in recent years, higher functionality has been demanded for semiconductor packages (hereinafter simply referred to as "semiconductor packages") in which relatively small electronic components such as semiconductor chips (hereinafter simply referred to as "electronic components") are sealed and molded with a resin material. Specifically, for example, such as a so-called molded array package (Japanese: Map) type large substrate, etc., there are strong demands for high integration, high reliability, and miniaturization (that is, light, thin, short, and small). [0003] Therefore, when molding a semiconductor package, it is necessary to resin-seal and mold the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B29C45/14B29C45/26
CPCB29C45/14655B29C45/44H01L21/565B29C45/02H01L2924/0002H01L2924/00
Inventor 前田启司
Owner TOWA
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