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Protecting component of electronic circuit

A technology for protecting components and electronic circuits, applied in the direction of electrical components, including printed electrical components, printed circuit components, etc., can solve the problems of increasing manufacturing costs and waste of resources

Inactive Publication Date: 2007-04-04
INPAQ TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to change the above-mentioned shortcomings existing in the prior art by providing a protective element applicable to various electronic circuits, and to waste resources and increase manufacturing costs in view of the fact that each passive element or protection needs to be manufactured separately. many problems

Method used

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  • Protecting component of electronic circuit
  • Protecting component of electronic circuit
  • Protecting component of electronic circuit

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Experimental program
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Embodiment Construction

[0029] The detailed composition of the present invention, manufacturing method step, and its effect, function, can obtain further understanding with reference to the explanation that following accompanying drawing is done:

[0030] The protection element of the electronic circuit of the present invention, as shown in Figure 2A-2F, its manufacturing steps are as follows:

[0031] 1. Please refer to FIG. 2A. First, a base glass 22 is made on the upper surface of the ceramic substrate 21. The size of the base glass 22 is controlled in the center of the ceramic substrate 21, so that the side of the base glass 22 does not touch the edge of the ceramic substrate. ;

[0032] 2. As shown in FIG. 2B, the base glass 22 is coated with a first electrode layer 23, one end of the first electrode layer 23 is connected to the first end of the ceramic substrate 21, and the other end of the first electrode layer 23 is partially ground coated onto the upper end surface of the base glass 22;

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PUM

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Abstract

In the invention, coating a protective layer on the inner wall of circumference of ceramic baseboard; on the protective layer, forming an electrode layer from end of the baseboard to the center; a dielectric layer is located between the overlap sections of the electrode layer and the protective layer; two electrode layers are separated by the dielectric layer; forming a coverage layer on the overlap section; the overlap section is used to cut and form a transverse gap having proper deepness and stopping at the base part of electrode in order to make the overlap section of electrode to become the opposite setting due to the transverse gap. Its discharging electrodes are changed into the discharging type that discharges from upper and lower electrode layers by changing the material of dielectric layer and the material filled into the transverse gap, or controlling the thickness of dielectric layer.

Description

technical field [0001] The present invention relates to a protection element for an electronic circuit, in particular to a type in which the overlapping portion of the upper and lower electrode layers on the substrate has a lateral gap, and the upper and lower electrode layers are separated from each other by a dielectric layer, and A protective component of an electronic circuit in which the discharge electrode discharges the upper and lower electrodes. Background technique [0002] In the circuit, capacitors, resistors and inductors are the three indispensable passive components in current electronic products. The original function of capacitors is to store electrical energy. In the meantime, the functions of storing charge, bypassing, filtering, tuning and oscillating are achieved. According to different dielectric materials, there are three types of capacitors: fixed capacitors, variable capacitors, and chip capacitors. [0003] The function of the resistor is to adjus...

Claims

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Application Information

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IPC IPC(8): H05F3/04H05K1/16H05K1/02H05K3/00
Inventor 徐康能陈清乾刘德邦
Owner INPAQ TECH
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