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Encapsulation method and structure of light emitting diode

A technology of light-emitting diodes and packaging structures, which is applied to semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, light sources, etc., can solve problems such as difficult heat, large thermal resistance, and unfavorable heat dissipation, and achieve heat dissipation. Prevents local hot spots and reduces thermal resistance

Inactive Publication Date: 2007-04-25
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in this heat dissipation method, the heat generated by the LED chip 21 must first pass through the copper base 23 and then be transferred to the metal heat dissipation plate 29, resulting in a large thermal resistance during the heat transfer process, and the heat transfer of the metal heat dissipation plate 29 The speed is also slow, and the heat is not easy to disperse quickly and evenly on the heat dissipation plate 29, resulting in the formation of hot spots (Hot Spots) at the junction of the copper base 23 and the metal heat dissipation plate 29, which is not conducive to the further dissipation of heat

Method used

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  • Encapsulation method and structure of light emitting diode
  • Encapsulation method and structure of light emitting diode
  • Encapsulation method and structure of light emitting diode

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Embodiment Construction

[0020] 4 discloses the first embodiment of the packaging structure of the light emitting diode of the present invention, including a heat sink 30, a heat pipe 40 (Heat Pipe), a circuit substrate 50 and a plurality of light emitting diode (LED) chips 60; wherein the heat sink 30 It includes a base 31 and a plurality of heat dissipation fins 32 formed on the base. A groove 311 is concavely formed along the surface of the base 31 to accommodate the heat pipe 40; in this embodiment, the heat pipe 40 is flat The heat dissipation fins 32 are several thin columns arranged in multiple rows and columns; the circuit substrate 50 can be a printed circuit board (PCB) or a ceramic substrate, and several perforations 51 are arranged on the upper and lower surfaces of the circuit substrate 50. , for the LED chips 60 to be placed therein; of course, the circuit substrate 50 is also provided with positive and negative lines to form an electrical connection with the LED chips 60, which is a prio...

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Abstract

The invention relates to a light emitting diode package structure with high heat emission efficiency and relative packing method. Wherein, it plasters the chip of light emitting diode on one soaking device; said soaking device contains working fluid for transmitting heat; the phase change or quick flow of said soaking device can quick distribute the heat of chip on the soaking device uniformly, to reduce thermal resistance and avoid local hot spot.

Description

【Technical field】 [0001] The invention relates to a packaging structure and a packaging method of a light-emitting source, in particular to a packaging structure and a packaging method of a light-emitting diode with high heat dissipation efficiency. 【Background technique】 [0002] Light-emitting diodes (LEDs, Light-emitting Diodes), as light sources, are widely used in the fields of automobiles, traffic signal lights, screen displays, and even lighting due to their high-efficiency characteristics. As a characteristic of the solid light source itself, the LED light source will also emit heat when it is working, and whether the heat emitted by it can be exported or dissipated in time will become a key factor affecting the quality and life of the LED light. This is because, As the temperature rises, the luminous efficiency of LED will decrease significantly, seriously affecting its luminous brightness and shortening its service life. [0003] Fig. 1 discloses one of the packag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H01L23/34H01L21/50H01L33/00H01L25/075H01L33/64
CPCF21V29/006F21Y2101/02F21K9/00F21V29/30H01L33/648F21V29/2293F21V29/2275F21V29/004F21V29/2206F21V29/51F21V29/56F21V29/74F21V29/80F21V29/83F21Y2115/10H01L2224/48091H01L2224/48247H01L2924/00014
Inventor 胡祯祥谢逸中谭理光
Owner FU ZHUN PRECISION IND SHENZHEN