Image sensor module package structure

An image sensor and module technology, which is applied in electric solid state devices, semiconductor devices, radiation control devices, etc., can solve problems such as inconvenience and lack of structure in products, avoid optical path interference, and enhance functionality and electrical transmission. The effect of efficiency

Inactive Publication Date: 2007-04-25
CHIPMOS TECH INC
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Problems solved by technology

[0005] It can be seen that the above-mentioned existing image sensor packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the problems existing in the packaging structure of the image sensor, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure for general products to solve the above problems. , this is obviously a problem that relevant industry players are eager to solve

Method used

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Embodiment Construction

[0051] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, in conjunction with the accompanying drawings and preferred embodiments, the specific implementation, structure, Features and their functions are described in detail below.

[0052] Please refer to FIG. 2 , which is a schematic cross-sectional view of a first embodiment of the packaging structure of the image sensor module according to the present invention. An image sensor module packaging structure 200 according to the first embodiment of the present invention mainly includes a glass substrate 210, a flip-chip image sensor chip 220 and a plurality of passive components 230, wherein:

[0053] The glass substrate 210 has a first surface 211 and a second surface 212 corresponding to the first surface 211 , and the first surface 211 defines a light incident region 213 . In addition, the glass substrate 210 includes a plurality of connecti...

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Abstract

The invention relates to an image sensor mould package structure. Wherein, dual connecting pads are on the first surface of said glass base plate and outside the incident area of base plate; one wire layer is on the second surface of said glass base plate to be electrically connected to the connecting pads and wire layer via dual through hole of base plate; one image sensor chip is at the second surface of base plate, to aim the sensing area of chip to the incident area of base plate; and the chip is electrically connected to the wire layer of glass base plate; said connecting pads can be used in external connections; or dual inactive elements can be arranged on wire layer to improve the function and electric transmission efficiency of said invention. The invention can improve the electric efficiency and avoid light path interference.

Description

technical field [0001] The invention relates to an image sensor packaging structure, in particular to an image sensor module packaging structure in which an image sensor chip is flip-chip disposed on a glass substrate. Background technique [0002] In today's electronic products, the image sensor packaging structure (image sens or package) is widely used, such as: digital cameras, mobile phones, personal digital assistants (PDA), etc., and in addition to strict requirements on image sensing quality , It is even more required to strengthen its functionality to meet the needs of consumers. [0003] Please refer to FIG. 1 , which is a schematic cross-sectional view of a conventional image sensor module packaging structure. The conventional image sensor packaging structure 100 includes a glass substrate 110, a flip-chip image sensor chip 120, a sealant 130 and a plurality of solder balls 140. The glass substrate 110 has a first A surface 111 and a second surface 112, the first...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L25/16H01L23/488
CPCH01L2224/10
Inventor 赵永清刘安鸿黄祥铭李宜璋李耀荣
Owner CHIPMOS TECH INC
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