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426results about How to "Plenty of space" patented technology

Plunger type motor pump

The invention discloses a plunger type motor pump, and belongs to a plunger pump. The problems of weak strength and low overall power density of a cylinder of the conventional plunger motor pump are solved. According to the plunger type motor pump, a motor stator is assembled in a housing. The two ends of the cylinder are supported in the centers of a left end cover and a right end cover respectively. A motor rotor is sleeved on and fixedly connected with a lug boss on the middle part of the cylinder. N plunger cavities are reserved in each of the left and right end faces of the lug boss of the cylinder. A plunger piston shoe component is arranged in each plunger cavity. Suction and forcing valve components are arranged in correspondence to each plunger piston shoe component on the lug boss of the cylinder. A left swash plate is fixed on the inner side of the left end cover, and a right swash plate is fixed on the inner side of the right end cover. The plate surfaces of the left and right swash plates are parallel. Every two coaxial plunger piston shoe components are pressed against each other through a support rod, and piston shoe heads at the two ends are pressed on the plate surfaces of the left and right swash plates respectively. Reverse thrust generated between the plunger piston shoe components at the two ends and the swash plates and hydraulic acting force in the cylinder are transmitted through the support rods, and internal reacting force is fully utilized, so that the number of the parts is decreased, the overall strength of the pump is strengthened, and the internal space utilization rate of the cylinder is increased.
Owner:HUAZHONG UNIV OF SCI & TECH

Low-temperature glass solder bonding and encapsulating method based on disc level glass micro-chamber

The invention discloses a low-temperature glass solder bonding and packaging method based on wafer-level glass microcavities, which comprises the following steps: firstly, utilizing a silk-screen printing process to coat low-temperature glass solder on a packaging contact part of a Pyrex7740 glass substrate provided with a microcavity structure, preliminarily drying the low-temperature glass solder, and making the low-temperature glass solder be cured and cling to the Pyrex7740 glass substrate provided with the microcavity structure; secondly, aligning a Pyrex7740 glass packaging wafer which is cured with the low-temperature glass solder and a silicon substrate wafer comprising an MEMS device or a CMOS circuit, and making the microcavity structure on the Pyrex7740 glass substrate correspond to the position of the MEMS device or the CMOS circuit to be packaged of a silicon substrate; and thirdly, using a clamper to firmly clamp the two aligned wafers, applying the pressure, sintering the glass solder in a specified packaging atmosphere, and cooling the glass solder. The whole process is based on integral processing of the silicon wafer and the Pyrex7740 glass wafer, belongs to a process for manufacturing and packaging a wafer-level MEMS, and has the characteristics of simple method, adjustable packaging space and low cost.
Owner:SOUTHEAST UNIV
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