Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Orthoris having a particular relief

A raised part, orthopedic technology, applied in insoles, medical science, clothing, etc., can solve problems such as high cost

Inactive Publication Date: 2007-05-09
埃里克·帕兰
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The result is almost individually handcrafted, thus resulting in high costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Orthoris having a particular relief
  • Orthoris having a particular relief
  • Orthoris having a particular relief

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] [24] The plantar orthopedic pad shown in FIG. 1 has a base 10 at its lower part, the base being cut from a thick sheet of flat material, for example, and forming a flat first layer. Some areas are arranged protrudingly on the base, the areas are the inferior metatarsal head area 11 of the first metatarsal, the inferior metatarsal head area 12 of the fourth and fifth metatarsals, and a posterior metatarsal head space area or posterior. Metatarsal head support area 13, an inner half-dome area 14, an outer half-dome area 15, and a heel ring 16.

[0025] [25] According to the present invention, the arrangement shown in Figure 1 determines the contour lines of different regions, of course these regions may vary in their width or length. The length and / or width of the area can preferably be changed within a limit of ±10%, and preferably within a limit of ±7%, relative to the dimensions appearing in the figure, these dimensions being proportional to the size of the orthopedic pad....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An orthoris comprising, from the front to the back, sub-areas known as sub-capitals, in an area which is substantially planar (17), i.e. one area (11) for the first metatarsal and one area (12) for the fourth and fifth metatarsals and a capital bar area or retro capital support (13) located behind said areas which are separate from each other. The contours essentially comprised in said areas are represented in figures 1 and 2.

Description

Technical field [0001] [01] The present invention relates to a new type of orthopedic plantaire or semelle orthopédique. Background technique [0002] [02] The bottom pad can be implemented in a detachable form, or a plantar orthopedic pad or a clean pad, or the bottom pad may not be detachable, and constitute a sticky clean pad, or the first layer of the shoe Upper part. [0003] [03] In orthopedics, orthopedic foot and plantar pads are generally made as needed, and at least the orthopedic surgeon must determine the orthopedic foot and plantar pads for people who need to wear the orthopedic pad. As a result, it has to be made almost individually by hand, which leads to high costs. Summary of the invention [0004] [04] The purpose of the present invention is to overcome these shortcomings. [0005] [05] It has been discovered through the present invention that in reality, a single orthopedic pad or orthopedic bottom pad can be manufactured, which can treat most individual cases...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): A43B7/22A61F5/14A43B17/00A43B13/38
CPCA43B17/00A43B7/223A43B13/38A43B7/141
Inventor 埃里克·帕兰
Owner 埃里克·帕兰
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products