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Computer system with cooling apparatus

A computer system and cooling device technology, applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., can solve problems such as temperature increase, airflow cannot be discharged in time, and unfavorable heat dissipation of the central processing unit

Inactive Publication Date: 2007-05-16
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this airflow path is that the hot air flowing through the CPU must pass through other electronic components between the CPU and the back panel before it can pass through the hole in the back panel and flow out of the computer case.
As a result, the airflow will be obstructed to some extent by the electronic components between the CPU and the rear panel and cannot be exhausted to the outside of the case in time.
Due to the retention of these hot air in the casing, the temperature in the casing will increase, which is not conducive to the heat dissipation of the central processing unit.

Method used

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  • Computer system with cooling apparatus
  • Computer system with cooling apparatus
  • Computer system with cooling apparatus

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Embodiment Construction

[0012] Please refer to Fig. 1, the computer system of the present embodiment comprises a casing (unlabeled), the circuit board that is installed in the casing, as motherboard 100, the heating electronic element that is located on the motherboard 100, as central processing unit 150 and a cooling device 400 installed on the motherboard 100 for cooling the CPU 150 .

[0013] The casing includes first and second boards 210 , 240 parallel to each other, and a third board 270 located between the first and second boards 210 , 240 . The distance between the first and second boards 210, 240 constitutes the height of the casing. The third plate body 270 vertically connects the first and second plate bodies 210 , 240 . The first board 210 defines a plurality of air inlets 212 adjacent to the third board 270 . The second plate body 240 is adjacent to the third plate body 270 to define a plurality of exhaust holes 242 opposite to the air intake holes 212 . The height of the casing is sh...

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Abstract

This invention relates to one computer system, which comprises one shell, one circuit board inside shell, one heating electron element on circuit board and one cooling device, wherein, the shell has relative first and second boards with first one set with gas in hole and second board set with discharge hole. The gas in hole and discharge hole form one gas flow path outside gas flow path. The cooling device comprises first dissipation part of electron element trigger through circuit board edge into gas flow second dissipation part.

Description

【Technical field】 [0001] The invention relates to a computer system, in particular to a computer system with a cooling device. 【Background technique】 [0002] In recent years, the speed of central processing units has continued to increase. To process information at a faster rate, the central processing unit includes more and more transistors, which have a faster clock and consume a corresponding increase in energy. This will result in an ever-increasing amount of heat generated by the CPU. The accumulation of these heats will inevitably increase the temperature inside the computer and lead to a decrease in computer performance and system failure. Therefore, various heat sinks are installed on the central processing unit, so as to dissipate the heat on the central processing unit to the surrounding environment. Usually, the industry also sets a fan in the computer casing to accelerate the air flow through the heat sink installed on the central processing unit, thereby enh...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 翁世勋陈俊吉陈葆春
Owner FU ZHUN PRECISION IND SHENZHEN