Unlock instant, AI-driven research and patent intelligence for your innovation.

Wiring architecture of printed circuit board

A printed circuit board and wiring technology, applied in the field of printed circuit board wiring structure, can solve the problems of power supply delay, circuit board wiring space redundancy, increasing resistance of conductive areas, etc.

Inactive Publication Date: 2007-07-04
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The defect of the above-mentioned wiring structure is that: in the small area 80 provided, there is a certain distance between the pads 70, thus causing redundancy in the wiring space of the circuit board, and thus resulting in a small area of ​​the conductive area of ​​the signal layer, thereby Increase the resistance of the conductive area, delaying the power supply of the power supply and affecting the normal operation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wiring architecture of printed circuit board
  • Wiring architecture of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Please refer to FIG. 2 , which is a schematic diagram of a preferred embodiment of the wiring structure of the printed circuit board of the present invention. A printed circuit board wiring structure is used in the inner frame of the "back"-shaped computer CPU installation area, which includes a signal layer 50, a number of pad pairs 51, and a number of ground vias 52.

[0013] There is a conductive metal foil 57 on the signal layer 50, and each pad pair 51 includes a pad 53 that needs to be grounded and a pad 54 that does not need to be grounded, and each pad 53 that needs to be grounded and its nearby ground via hole 52 Corresponding connections are made via traces 58 . The pad 53 to be grounded and the ground via hole 52 are isolated from the conductive metal foil 57 by the insulating area 56 , and the wiring 58 is isolated from the conductive metal foil 57 by the insulating area 56 . The ground vias 52 are arranged independently of each other.

[0014] In the inne...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a circuit structure of printed circuit board, wherein said printed circuit board comprises signal layer, several welding discs, and several grounding holes; at the connection direction of the lines of two couple welding discs, two grounded welding discs are distanced via one non-grounded welding disc; each grounded welding disc is connected to nearby grounding holes; the grounding holes and grounded welding discs via their insulated edges are separated from the conducive metal foil of signal layer; the circuit structure of printed circuit board can reduce space and improve conductive area of signal layer.

Description

【Technical field】 [0001] The invention relates to a printed circuit board wiring structure. 【technical background】 [0002] In the wiring structure of the mainboard of the computer, the signal layer includes a "back"-shaped central processing unit installation area, which includes a number of pads and vias, and the socket of the central processing unit of the computer is welded on the pad. The socket of the central processing unit is also in the shape of "back". Therefore, there is a certain wiring space in the frame in the installation area of ​​the central processing unit. Usually, in order to save the wiring space of the circuit board, several capacitors are set in this area to filter out high-frequency AC signals mixed in the circuit. [0003] Several capacitors are arranged in the installation area of ​​the central processing unit, and the two pins of each capacitor need to be connected to the signal layer and the ground layer respectively, and there is no connection ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/16
CPCH05K1/0231H05K1/112H05K2201/10734H05K2201/10325
Inventor 舒生云
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD