Wick, plate type heat pipe and container

a heat pipe and wicking technology, applied in the field of wicks, plate types of heat pipes, containers, etc., can solve the problems of water not being used as working fluid in the container made of aluminum, applying the above-mentioned method to seal the container, and difficult to form the container shown in fig. 11 which is made of copper by extrusion
US20040011512A1Inactive Publication Date: 2004-01-22NODA HAJIME +3
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
NODA HAJIME
Publication Date
2004-01-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

A plate type thin heat pipe comprises: a group of wire members comprising a plurality of first metal wire members placed in a same plane in parallel with a prescribed distance spaced out, and a plurality of second metal wire members placed in a same plane in parallel with a prescribed distance spaced out and placed so as to cross the plurality of first metal wire members; a container having a hollow portion which is reduced in inner pressure and hermetically sealed comprising an upper plate member and a lower plate member placed face to face, each of which is made of thin copper plate, formed in such a manner that each of the upper plate member and the lower plate member contacts the group of wire members, and the group of wire members are sandwiched by the upper and lower plate members, and water as a working fluid received in the container.
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Description

[0001] This application is a divisional of U.S. patent application Ser. No. 09 / 655,664, filed Sep. 6, 2000, the entire disclosure of which is hereby incorporated by reference, and which claims priority to Japanese Application Nos. 1999-252748, filed on Sep. 7, 1999, and 1999-252749, filed on Sep. 7, 1999. This application is related to U.S. Non-Provisional application Ser. No. 10 / ______ , filed on even date herewith (having attorney docket number KAWAW6.001DV2), the entire disclosure of which is hereby incorporated by reference.

[0002] 1. Field of the Invention

[0003] The present invention relates to a plate type heat pipe, wick and container used for cooling electronic devices.

[0004] 2. Description of the Related Art

[0005] As one of the means to effectively dissipate the heat generated from semiconductor chips in the electronic devices which has been increasing, there is proposed a heat pipe. In particular, a plate type heat pipe is perceived to be effective among various heat pipes ...

Claims

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