Bare die tray clip

a tray clip and die cutting technology, applied in the direction of snap fasteners, buckles, transportation and packaging, etc., can solve the problems of permanent warp/distortion of the tray, damage to the component, and gaps between the trays in the stack, so as to achieve the effect of minimizing warp

Inactive Publication Date: 2005-01-20
PEAK PLASTIC & METAL PRODS INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008] It is an advantage of this invention in that it provides an improved clip for securing a stack of trays that minimizes warp due to tray clip forces.

Problems solved by technology

Prior art designs apply force to a central area of the bottom of the stack, which eventually causes permanent warp / distortion of the trays.
This force causes damage due to the application of the force in the thin and-weak central area.
As the trays warp over time, gaps are produced between trays in a stack.
In some cases, the components stored in a tray can fall through the gaps, or be pinched in a gap, causing damage to the component.
In addition, when a stack of trays is removed from a clip, and a tray is presented to an automated pick and place machine, the warped, distorted tray can cause pick-up errors.
The problem of warped trays is augmented in situations when trays are recycled i.e. re-used after having been used in a stack and become warped.
For example, if a used warped tray is placed in a stack with a new tray or new cover, significant gaps are possible, causing tray components to fall out.
Stack compressive forces applied by the clip are substantially limited to tray and cover perimeter rail portions.

Method used

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Examples

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Embodiment Construction

[0023] While the present invention will be described herein with reference to particular embodiments thereof, a latitude of modifications, various changes and substitutions are intended, and it will be appreciated that in some instances some features of the invention will be employed without a corresponding use of other features without departing from the spirit and scope of the invention as described with respect to the preferred embodiments set forth herein.

[0024] Referring now to FIG. 5 of the drawing, a particular embodiment of the present invention is shown in the form of a clip 36 for holding a stack, such as stack 38 including a tray 40 and cover 42. The clip 36 forms a channel structure providing a channel 44. The structure includes a clip base 46, and has first and second retaining segments 48 and 50 that can be of various forms, illustrated in FIG. 5 as vertically oriented walls providing left and right captivation of a stack. The retaining segments and base restrict late...

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PUM

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Abstract

A clip is provided for holding a stack of at least one tray and tray cover. Stack compressive, forces applied by the clip are substantially limited to tray and cover perimeter rail portions. The clip has a channel base with left and right side retaining walls attached for restricting movement of a stack in left and right directions. Left and right rods protrusions above the base extend inward towards the walls of the channel from the left and right side walls respectively for captivating the stack in an upward direction. Spring protrusions extend upward from the base on input and output ends of the channel, and are configured for applying an upward spring force on opposing bottom edge areas of the stack.

Description

[0001] This application is related to U.S. patent application entitled “Open Frame Tray Clip” [Attorney Docket No. 67810-0304489] filed the same day as this application, and which is expressly incorporated by reference herein.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] This invention relates generally to apparatus for securing trays that are used in storing or transporting components such as semiconductors, and more particularly to a clip for securing a tray and cover or stack of trays and a cover that places stack compression forces on tray perimeter rails in order to minimize tray distortion caused by clip forces. [0004] 2. Description of the Prior Art [0005] Small components such as semiconductors are often stored or shipped in molded plastic trays such as tray 10 shown in FIG. 1. With the components (not shown) in pockets 12, a cover such as cover 14 is placed over the tray 10 for captivating the components in the pockets 12. It is then often necessary to...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): A44B99/00B65D67/02B65D45/16B65D85/86H01L21/673
CPCY10T24/44983H01L21/67333
Inventor PYLANT, JAMES D.BRADLEY, SCOTT C.WABER, ALAN
Owner PEAK PLASTIC & METAL PRODS INT
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