Three dimensional vapor chamber

Abstract

A three dimensional vapor chamber is disclosed which has a horizontal vapor chamber portion and a vertical flat heat pipe portion. The interiors of the two portions are in fluid communication and can have a wick material saturated with a working fluid such as water. The vertical flat heat pipe portion can also have fins or other heat exchange structure connected to the exterior thereof to increase heat transfer away from the heat pipe portion. In operation, the vapor chamber portion is placed in contact with a heat source, thus causing the working fluid to evaporate and move into the vertical flat heat pipe portion, where it is condensed. The fluid is then transported back to the vapor chamber portion via capillary action through the wick. The interiors of the two portions may be constructed as a vacuum chamber, so that evaporation of the working fluid can occur at lower temperatures than would occur at atmospheric pressure.

Description

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AI Technical Summary

Benefits of technology

The patent describes a vapor chamber that has a heat pipe attached to it. The vapor chamber has a larger size than the heat pipe and the two parts are connected at their edges. The heat pipe is attached to the vapor chamber in a way that it is narrower and longer than the vapor chamber. The vapor chamber has a wick structure inside it that allows fluid to flow through it. The technical effect of this design is that it allows for better heat transfer and more efficient cooling of the vapor chamber.

Problems solved by technology

The patent text discusses the increasing heat generation in electronic devices and the challenge of managing this heat in a cost-effective and efficient way. The text highlights the need to find effective thermal solutions to reduce system costs and time-to-market, while also addressing the non-uniform heat distribution and the trend towards miniaturization of electronic devices. The technical problem addressed in the patent is to provide a thermal management architecture that can accumulate and transfer variable amounts of thermal energy while avoiding or minimizing the use of non-passive, tandem cooling or refrigeration systems for cooling.

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