Electronic device sealed under vacuum containing a getter and method of operation

Abstract

An electronic device that is sealed under vacuum includes a substrate, a transistor formed on the substrate, and a dielectric layer covering at least a portion of the transistor. The electronic device further includes a layer of non-evaporable getter material disposed on a portion of the dielectric layer; and a vacuum device disposed on a portion of the substrate. Electrical power pulses activate the non-evaporable getter material.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional application and claims the benefit and priority of U.S. patent application Ser. No. 10 / 328,261 filed Dec. 19, 2002 which is a continuation of U.S. Pat. No. 6,534,850, filed Apr. 16, 2001.FIELD OF THE INVENTION [0002] This invention relates generally to electronic devices that incorporate a vacuum packaged microelectronic device. More particularly, the present invention relates to an electronic device having a non-evaporable getter material disposed on the same substrate as the active transistors and other logic devices. BACKGROUND OF THE INVENTION [0003] The ability to maintain a vacuum for a prolonged period in a microelectronic package is increasingly being sought in such diverse areas as field emission displays (FEDs), micro-electro-mechanical systems (MEMS) and atomic resolution storage devices (ARS) that are used in connection with computers, displays, television sets as a few examples. Both FEDs an...

AI Technical Summary

Benefits of technology

"The patent describes a sealed electronic device that includes a transistor and a layer of non-evaporable getter material. The device also has a vacuum device. The non-evaporable getter material is activated by electrical power pulses to improve its performance. The technical effect of this patent is to provide a more efficient and reliable electronic device that can operate in a vacuum."

Problems solved by technology

One of the major problems with vacuum packaging of electronic devices is the continuous outgassing of hydrogen, water vapor, and other components found in ambient air from the internal components of the electronic device.

At these temperatures both active devices as well as polymeric materials will be damaged and / or deformed.

In order to avoid these damaging effects the getter material must be kept apart from the actual device, thus leading to a bulkier package as well as greater difficulty in assembly.

In addition, the incorporation of a separate cartridge, especially for small electronic devices with narrow vacuum gaps, also results in a bulkier package.

Further, the utilization of a separate cartridge increases the cost of manufacturing because it is a separate part that requires accurate positioning and then it must be secured to another component part to prevent it from coming loose.

Loose cartridges are a potential serious problem by either acting as a source of small particles that break away from the cartridge or create particles from materials the cartridge is in contact with.

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