Method of transferring a substrate

a substrate and module technology, applied in the direction of charge manipulation, packaging goods, furniture, etc., can solve the problems of contaminating the substrate received in the foup and the semiconductor substrate being transferred by the substrate transfer robot, affecting the effect of the substrate, and reducing the amount of purge gas used in the substrate transfer modul
US20060225299A1Inactive Publication Date: 2006-10-12SAMSUNG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
SAMSUNG ELECTRONICS CO LTD
Publication Date
2006-10-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method of controlling contamination in a substrate transfer chamber that is disposed between a load port for supporting a container to receive a plurality of substrates and a substrate process module for processing the substrates includes supplying a purge gas into the substrate transfer chamber to purge an interior of the substrate transfer chamber, circulating the purge gas supplied into the substrate transfer chamber through a gas circular pipe, removing particles and airborne molecular contaminants from the purge gas being circulated, and resupplying the circulated purge gas into the substrate transfer chamber.
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Description

CROSS REFERENCE TO RELATED APPLICATION

[0001] This is a continuation application based on pending application Ser. No. 10 / 763,203, filed Jan. 26, 2004, the entire contents of which is hereby incorporated by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention is related to a module for transferring a substrate. More particularly, the present invention is related to a module for transferring a substrate between a container to receive a plurality of substrates and a module for processing the substrate.

[0004] 2. Description of the Related Art

[0005] Generally, semiconductor devices are manufactured through a three-step process. First, a fabrication process is performed for forming electronic circuits on a silicon wafer used as a semiconductor substrate. Second, an electrical die sorting (EDS) process is performed for inspecting electrical characteristics of the semiconductor devices on the semiconductor substrate. Third, a packaging proce...

Claims

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