Device for preventing low-melting-point heat-transfer medium from oxidization
a heat-transfer medium and low-melting point technology, applied in the direction of semiconductor devices, electrical equipment, semiconductor/solid-state device details, etc., can solve the problems of low overall heat dissipation efficiency, inefficient heat transfer of thermal grease, and small transfer coefficient of thermal grease, so as to prevent the oxidization of low-melting alloy and prevent the oxidation of low-melting alloy. , the effect of high heat-transfer efficiency of low-melting alloy
Inactive Publication Date: 2007-03-15
WONG LUK SHAN
View PDF3 Cites 6 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
[0010] An objective of the present invention is to provide a device for preventing a low-melting point heat-transfer medium from oxidizing. In the present invention, an oxidization-proof layer is disposed on the bottom of the heat sink. The oxidization-proof layer surrounds the low-melting-point alloy, which is disposed between the heat sink and the heat source. The oxidization-proof layer can effectively prevent the low-melting-point alloy from invasion by ambient air by isolating the low-melting-point alloy from the ambient air. Hence, the oxidization of the low-melting-point alloy is prevented. By using the present invention, the high heat-transfer efficiency of the low-melting-point alloy is kept.
Problems solved by technology
However, the heat transfer coefficient of the thermal grease is very small, so the thermal grease is inefficient in heat transfer.
Hence, heat generated by chips or CPUs usually cannot be passed to the heat-dissipating device effectively, resulting in a low overall heat dissipation efficiency.
Thus, the ambient air easily invades the alloy, and oxidizes the alloy.
This oxidation degrades the heat-transfer efficiency of the alloy.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0018] Reference is made to FIGS. 1-4. The present invention provides an oxidization-proof device. It includes a heat sink 1, an oxidization-proof layer 2, and a low-malting-point alloy 3. The heat sink 1 is made of copper or aluminum, which has a good heat-transfer property. The shape or structure of the heat sink 1 is not limited. The heat sink 1 can be any type of heat sink. In this embodiment, the heat sink 1 has a base 11 and multiple fins 12. The fins 12 project from the base 11 and are formed on the base 11 as integral parts. In practice, the fins 12 can also be formed as a separate component and are attached to the base 11 when in use.
[0019] The oxidization-proof layer 2 is disposed on a bottom of the base 11 of the heat sink 1. The oxidization-proof layer 2 can be made of a condensable material. The top and bottom of the oxidization-proof layer 2 are kept as flat as possible. The oxidization-proof layer 2 is disposed on the heat sink 1 via attachment. In this embodiment, t...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A device for preventing a low-melting point heat-transfer medium from oxidization is proposed. The device has a heat sink, a low-melting-point alloy, and an oxidization-proof layer. The low-melting-point alloy is disposed on the heat sink and serves as a heat-transfer medium to contact a heat source. The oxidization-proof layer is made of a condensable material and disposed on the heat sink. The oxidization-proof layer surrounds the low-melting-point alloy. The oxidization-proof layer can effectively prevent the low-melting-point alloy from invasion by ambient air by isolating the low-melting-point alloy from the ambient air. Hence, the oxidization of the low-melting-point alloy is prevented and the high heat-transfer efficiency of the low-melting-point alloy is kept.
Description
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention is related to a device for preventing a low-melting point heat-transfer medium from oxidization, and more particularly, to a device that can prevent the low-melting point heat-transfer medium from contacting ambient air so as to prevent it from oxidization. In this way, a high heat-transfer efficiency of the low-melting point heat-transfer medium is kept. [0003] 2. Description of Related Art [0004] With the rapid progress of computer industries, electronic heat sources, such as chips or central processing units (CPUs), have faster and faster processing speeds and produce more and more heat. In order to dissipate heat and maintain normal operations, the electronic heat source is usually attached to a heat-dissipating device having a larger heat-dissipating surface. The heat-dissipating device uses its heat-dissipating fins to dissipate heat. An example of a conventional heat-dissipating device i...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L23/34
CPCH01L23/3736H01L23/3737H01L2924/0002H01L2924/00
Inventor WONG, LUK-SHAN
Owner WONG LUK SHAN