Cooler module and heat pipe for cooler module
a technology of cooler module and heat pipe, which is applied in the direction of indirect heat exchangers, lighting and heating apparatus, tubular elements, etc., can solve the problems of inability to use the aforesaid thermal buffer member c, inability to function well or damage the heat pipe a, and inability to prevent damage to the internal parts. to achieve the effect of preventing thermal resistan
Inactive Publication Date: 2007-12-13
COMPAL ELECTRONICS INC
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- Application Information
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Benefits of technology
The present invention is a cooler module with a heat pipe. The heat pipe has a heat absorbing section at one end, which has a thicker and larger outer diameter than the heat pipe. The heat absorbing section prevents thermal resistance when bonding to a thermal chip. The technical effect of this invention is to improve the cooling efficiency of the computer cooler module.
Problems solved by technology
Accumulation of heat energy inside the housing will cause damage to the internal parts.
If directly attach the heat pipe A to the thermal chip D to absorb heat energy from the thermal chip D directly, the uneven and continuous high temperature will cause the heat pipe A to dry out, and the heat pipe A will be unable to function well or may damage.
However, the use of the aforesaid thermal buffer member C still has drawbacks.
Further, the use of the thermal buffer member C greatly increases the labor and material cost.
Method used
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Embodiment Construction
[0014]Referring to FIG. 2, a cooler module in accordance with the present invention is shown comprised of a heat pipe 1, and a heat sink 2.
[0015]The heat pipe 1 is a hollow pipe (see FIG. 3), having a heat conductive metal outer pipe wall and an inner pipe wall formed of a thermal lining 11. When the fluid, for example, pure water in the heat pipe 1 is heated into steam, the thermal lining 11 rapidly transfers steam to the heat sink 2 so that the heat sink 2 dissipates heat from steam into the outside open air. The thermal lining 11 is a sintered device having a powdered, meshed, or grooved structure. The heat pipe 1 can be made having a circular, oval, or rectangular cross section.
[0016]The heat pipe 1 has one end connected to the heat sink 2, and the other end terminating in a heat absorbing section 12 (see FIG. 4). The heat absorbing section 12 comprises a heat conductive metal outer pipe wall and an inner pipe wall formed of a thermal lining 11.
[0017]Referring to FIG. 4, the hea...
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A cooler module includes a heat pipe, which has one end terminating in a heat absorbing section that has at least one pane closely attached to the CPU to absorb heat from the CPU and a relatively greater metal wall thickness than the metal wall thickness of the heat pipe, and a heat sink connected to the other end of the heat pipe for dissipating heat absorbed from the CPU by the heat absorbing section of the heat pipe. The invention also provides a heat pipe for use in such a cooler module.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a cooler module for cooling a thermal chip or the like and more particularly, to such a thermal cooler in which the part of the heat pipe to be attached to the thermal chip has a relatively greater wall thickness.[0003]2. Description of the Related Art[0004]During the operation of an electronic apparatus, the internal chip will emit heat. When the operating speed is increased, the amount of the emitted thermal energy will be relatively increased. This is commonly seen in a computer CPU, VGA, southbridge chip, and northbridge chip. During the operation of an electronic apparatus, heat must be quickly carried out of the housing of the electronic apparatus. Accumulation of heat energy inside the housing will cause damage to the internal parts. Therefore, “cooling”, in another world, “heat dissipation” is an important subject to manufacturers of notebook computers or the like.[0005]A convent...
Claims
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IPC IPC(8): F28F1/00
CPCF28D15/0266F28F2275/025F28D15/046
Inventor TIEN, CHI-WEIPAN, JENQ-HAURWU, CHANG-YUAN
Owner COMPAL ELECTRONICS INC