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Methods and apparatus for using a rolling backing pad for substrate polishing

Inactive Publication Date: 2008-11-27
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0019]In aspects of the invention, an apparatus is provided for polishing an edge of a substrate. The apparatus comprises a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. In some other aspects of the invention, a system is provided for po

Problems solved by technology

During processing, the edge of the substrate may become dirty which may negatively affect the semi-conductor devices on the substrate.
Conventional systems may not take the notch into account when cleaning the substrate edge, and the impact of the abrasive tape on the rotating substrate may result in damage to the notch.

Method used

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  • Methods and apparatus for using a rolling backing pad for substrate polishing
  • Methods and apparatus for using a rolling backing pad for substrate polishing
  • Methods and apparatus for using a rolling backing pad for substrate polishing

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Embodiment Construction

[0028]The present invention provides improved methods and apparatus for cleaning and / or polishing the edge of a substrate. The edge of a substrate may be polished by application of an abrasive polishing pad or abrasive polishing tape contacting the substrate edge via a polishing pad or head, for example, as the substrate is rotated or otherwise moved (e.g., oscillated). According to the present invention, the width of the polishing or backing pad may be large enough such that the backing pad spans beyond the width of the notch in the substrate edge. This extended width may prevent the backing pad from entering into and / or damaging the notch as the substrate edge is polished.

[0029]With reference to FIG. 1, a substrate 100 may include two major surfaces 102, 102′ and an edge 104. Each major surface 102, 102′ of the substrate 100 may include a device region 106, 106′ and an exclusion region 108, 108′. (Typically however, only one of the two major surfaces 102, 102′ will include a devic...

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Abstract

An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided.

Description

[0001]The present application claims priority from U.S. Provisional Patent Application Ser. No. 60 / 939,344, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING” (Attorney Docket No. 11566 / L) which is hereby incorporated herein by reference in its entirety for all purposes.CROSS-REFERENCE TO RELATED APPLICATIONS[0002]The present application is related to the following commonly-assigned, co-pending U.S. Patent Applications, each of which is hereby incorporated herein by reference in its entirety for all purposes:[0003]U.S. patent application Ser. No. 11 / 299,295, filed on Dec. 9, 2005, and entitled “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10121);[0004]U.S. patent application Ser. No. 11 / 298,555, filed on Dec. 9, 2005, and entitled “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10414);[0005]U.S. patent application Ser. No. 11 / 693,695, filed on Mar. 29, 2007, and entitled “METH...

Claims

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Application Information

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IPC IPC(8): B24B5/00B24B1/00
CPCB24B9/065B24B21/002
Inventor KOLLATA, EASHWERCHANG, SHOU-SUNGZHANG, ZHENHUABUTTERFIELD, PAUL D.KO, SEN-HOUMANENS, ANTOINE P.ETTINGER, GARY C.MARTINEZ, RICARDO
Owner APPLIED MATERIALS INC