Fin, thermal module, and method for assembling the same

Abstract

This invention provides a method for assembling the thermal module. According to the invention, the fin can be combined with a heat pipe and a joint material to form the thermal module. The fin includes a main body having a through hole and an feeding hole communicating with each other. The heat pipe passes through the through hole. The joint material is injected into the feeding hole to fill a clearance between the heat pipe and the inner wall of the through hole. In addition, when the fin is combined with the heat pipe, the feeding hole is above the through hole, the joint material flows downward along the clearance, and the clearance gradually narrows along a flowing direction of the joint material.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 097134173 filed in Taiwan, Republic of China on Sep. 5, 2008, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to a cooling fin, a thermal module including the cooling fin, and a method for assembling the thermal module.[0004]2. Description of the Related Art[0005]In past, only a central processing unit needs a thermal module to keep an operating temperature and stability of the central processing unit. With improvement of operating performance of other electronic elements, such as a graphic chip, a north bridge chip, a south bridge chip, a light-emitting diode and so on, the thermal module becomes more and more important for preserving stability of the electronic elements and the electronic devices having the electronic elements.[0006]F...

AI Technical Summary

Benefits of technology

[0012]One objective of this invention is to provide a cooling fin and a method for assembling the thermal module. Particularly, the invention can uniformly spread the solder material to the clearance between the heat pipe and the fins of the thermal module. The soldering quality and the heat transfer performance can be well improved, thus to improve the prior art.

Problems solved by technology

For manufacturing light, slim, and powerful electronic device, a plurality of electronic elements is assembled on a circuit board with a limited area, which results in a high heat flux of heat dissipation.

Thus, additional labor is needed, and the solder paste 74 is wasted.

Further, the distribution of the solder paste 74 is non-uniform, deteriorating the heat dissipation.

In addition, the non-uniform distribution of the solder paste 94 may also deteriorate the heat dissipation.

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