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Printed electronic component assembly enabled by low temperature processing

Inactive Publication Date: 2010-04-08
MOTOROLA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]A manufacturing method and manufacturing system for creating a modular printed electronic assembly are disclosed. The manufacturing system may position a contact terminal of a printed electronic component module relative to a cont

Problems solved by technology

Single-point bonding may be a more time-consuming process than gang bonding.

Method used

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  • Printed electronic component assembly enabled by low temperature processing
  • Printed electronic component assembly enabled by low temperature processing
  • Printed electronic component assembly enabled by low temperature processing

Examples

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Embodiment Construction

[0015]Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The features and advantages of the invention may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. These and other features of the present invention will become more fully apparent from the following description and appended claims, or may be learned by the practice of the invention as set forth herein.

[0016]Various embodiments of the invention are discussed in detail below. While specific implementations are discussed, it should be understood that this is done for illustration purposes only. A person skilled in the relevant art will recognize that other components and configurations may be used without parting from the spirit and scope of the invention.

[0017]The present invention comprises a variety of embodim...

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Abstract

A manufacturing method and manufacturing system for creating a modular electronic assembly are disclosed. The manufacturing system 300 may position a contact terminal 202 of a printed electronic component module 102 relative to a contact pad 204 of a printed electronic substrate 112. The manufacturing system 300 may connect the contact terminal 202 to the contact pad 204 using a conductive adhesive connection 116.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a method and system for creating a printed electronic assembly. The present invention further relates to creating a set of printed electronic component modules to be joined together to create a printed electronic assembly.INTRODUCTION[0002]Tape automated bonding (TAB) may locate and bond components and small circuits to printed wire boards, by mounting a die on a flexible tape made of polymer material, such as polyimide. The mounting may be done such that the bonding sites of the die, usually in the form of bumps or balls made of gold or solder, are connected to fine conductors on the tape, providing the means of connecting the die to the package or directly to external circuits. Sometimes the tape on which the die is bonded may already contain the actual application circuit of the die.[0003]The TAB bonds connecting the die and the tape may be inner lead bonds (ILB), while those that connect the tape to the package or to e...

Claims

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Application Information

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IPC IPC(8): H05K3/22H05K1/14
CPCH01L21/4867H01L23/498H05K1/111H05K3/225H05K3/321H05K3/3463Y10T29/49004H05K2201/0373H05K2201/10628H05K2203/176H01L2924/0002H05K2201/0257H01L2924/00
Inventor SCHEIFERS, STEVEN M.CHIK, HOPE W.SKIPOR, ANDREW F.
Owner MOTOROLA INC