Heat dissipation device with heat pipe

Abstract

A heat dissipation device includes a heat pipe. The heat pipe includes an evaporating section connecting with a heat spreader, a condensing section connecting with a fin assembly, and a connecting section interconnecting the evaporating section and the condensing section. The evaporating section of the heat pipe has a diameter smaller than that of the condensing section.

Description

BACKGROUND[0001]1. Technical Field[0002]The disclosure relates to a heat dissipation device and, more particularly, to a heat dissipation device incorporating heat pipes for removing heat from an electronic device.[0003]2. Description of Related Art[0004]As computer technology continues to advance, electronic components such as central processing units (CPUs) of computers are being made to provide faster operational speeds and greater functional capabilities. When a CPU operates at a high speed in a computer enclosure, its temperature greatly increases. It is desirable to dissipate the heat quickly, for example by using a heat dissipation device attached to the CPU in the enclosure. This allows the CPU and other electronic components in the enclosure to function within their normal operating temperature ranges, thereby assuring the quality of data management, storage and transfer.[0005]A typical heat dissipation device comprises a base contacting an electronic component, a fin assem...

AI Technical Summary

Benefits of technology

[0006]However, since most parts of the heat pipe of the conventional heat dissipation device are even in diameters, which results in more material is used for forming the evaporating portion of the heat pipe when the evaporating portion can have a smaller diameter. Furthermore, the evaporating portion of the heat pipe, which has the same diameter as that of the condensing portion, sometimes may hinder the applicability of the heat pipe to dissipate heat from an electronic component which is miniature.

Problems solved by technology

However, since most parts of the heat pipe of the conventional heat dissipation device are even in diameters, which results in more material is used for forming the evaporating portion of the heat pipe when the evaporating portion can have a smaller diameter.

Furthermore, the evaporating portion of the heat pipe, which has the same diameter as that of the condensing portion, sometimes may hinder the applicability of the heat pipe to dissipate heat from an electronic component which is miniature.

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