Hot water circulation system associated with heat pump
a technology of hot water circulation and heat pump, which is applied in the direction of heat pumps, heating types, lighting and heating apparatus, etc., can solve the problems of deteriorating heat exchange efficiency, difficult to achieve an adequate amount of heat for heating water and floor, and limitations of typical hot water circulation systems associated with heat pumps
Inactive Publication Date: 2010-09-30
LG ELECTRONICS INC
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Benefits of technology
[0011]In one embodiment, a hot water circulation system associated with a heat pump includes: an outdoor unit including a heat pump refrigerant cycle; an indoor unit for air-conditioning an indoor space by allowing refrigerant to heat-exchange with indoor air; and a refrigerant heating apparatus that is selectively connected to the outdoor unit and heats the refrigerant in the heat pump refrigerant cycle in an extreme cold front area, wherein the refrigerant heating apparatus heats the refrigerant by heating the water circulating a water heating passage, which is a closed-circuit along which the water circulates, using a heating source and allowing the heated water to heat-exchange with the refrigerant in the heat pump refrigerant cycle.
Problems solved by technology
Since a water-refrigerant heat exchanger for the heat exchange between the refrigerant and the water has lower heat-exchange efficiency, it is difficult to attain an enough amount of heat for heating the water and floor.
However, the typical hot water circulation system associated with the heat pump has following limitations.
Evaporation of the refrigerant is not effectively realized in a cold front area and thus heat-exchange efficiency is deteriorated.
Due to the low heat-exchange efficiency, only one of the floor heating and hot water supply should be performed and thus use convenience is deteriorated.
Method used
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[0026]Reference will now be made in detail to the embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings.
[0027]In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific preferred embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is understood that other embodiments may be utilized and that logical structural, mechanical, electrical, and chemical changes may be made without departing from the spirit or scope of the invention. To avoid detail not necessary to enable those skilled in the art to practice the invention, the description may omit certain information known to those skilled in the art. The following detailed description is, therefore, not to be taken in a limiting sense, a...
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A hot water circulation system associated with a heat pump. The system includes a water-refrigerant exchanger for heating the refrigerant and a pump for forcedly circulating the heated water, and a heating tank for storing the heated water.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application claims priority under 35 U.S.C. 119 and 35 U.S.C. 365 to Korean Patent Application No. 10-2009-0027016 filed on Mar. 30, 2009, which is hereby incorporated by reference in its entirety.BACKGROUND[0002]The present disclosure relates to a hot water circulation system associated with a heat pump, which can perform floor heating, hot water supply, and multi-space heating simultaneously.[0003]A heater assembly for supplying hot water and heating indoor spaces is formed by a combination of a heat pump cycle and a hot water circulation cycle. The heater assembly supplies the hot water and heats the floor by allowing refrigerant discharged from a compressor of a heat pump refrigerant circuit to heat-exchange with the water.[0004]Since a water-refrigerant heat exchanger for the heat exchange between the refrigerant and the water has lower heat-exchange efficiency, it is difficult to attain an enough amount of heat for heati...
Claims
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Patent Timeline
Login to View More IPC IPC(8): F25B13/00F25B27/00
CPCF24D3/18F24D11/0221Y02B30/126Y02B10/70Y02B30/12Y02B10/20F24D19/1072F24D2200/123F24D2220/046F24F1/0003F24F11/83F24F11/84F25B30/00F24D15/04F24D3/02
Inventor HAN, WANG KUKLEE, JU HYEONG
Owner LG ELECTRONICS INC