Cooling device for add-on card

Abstract

A cooling device for cooling an add-on card includes a heat absorption member attached to the add-on card to absorb heat therefrom, a heat sink and a clip for clasping the heat sink onto the heat absorption member. The heat sink includes a supporting plate, and a first plate and a second plate respectively extending from opposite sides of the supporting plate and attached to the heat absorption member tightly. The clip includes an operation board, and an engaging board and a supporting board respectively extending from opposite sides of the supporting plate. The engaging board and the supporting board respectively abut the first plate and the second plate of the heat sink. A tongue extends from the engaging board rearwards and downwards toward the operation board. The tongue is provided for blocking a separation of the clip from the heat sink.

Description

BACKGROUND[0001]1. Technical Field[0002]The disclosure generally relates to cooling devices for add-on cards, and more particularly to a cooling device having a clip for clasping the cooling device onto an add-on card.[0003]2. Description of Related Art[0004]Advances in microelectronics technology have resulted in add-on cards of electronic devices, such as computers, which process signals and data at unprecedented high speeds. During operation of many contemporary add-on cards, a large amount of heat are produced, and a heat sink is usually mounted onto the add-on card to efficiently remove the heat to prevent the electronic device from becoming unstable or being damaged.[0005]Generally, the heat sink includes a first heat absorbing plate, a second heat absorbing plate and a connecting portion interconnecting the first plate and the second heat absorbing plate. The add-on card is sandwiched between and thermally contacts with the first and second heat absorbing plates with a latera...

AI Technical Summary

Benefits of technology

[0005]Generally, the heat sink includes a first heat absorbing plate, a second heat absorbing plate and a connecting portion interconnecting the first plate and the second heat absorbing plate. The add-on card is sandwiched between and thermally contacts with the first and second heat absorbing plates with a lateral side thereof abutting against the connecting portion of the heat sink. When the add-on card assembled with the heat sink is pushed downwardly to engage with a socket of the electronic device, the add-on card generates an upward force to the heat sink, and thus the heat sink usually generates a movement relative to the add-on card. Therefore, a position of the heat sink on the add-on card is unfavorably changed, and contact between the heat sink and the electronic components of the add-on card is bad. Finally, a cooling efficiency of the heat sink is decreased.

Problems solved by technology

Therefore, a position of the heat sink on the add-on card is unfavorably changed, and contact between the heat sink and the electronic components of the add-on card is bad.

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