Bendable circuit structure for LED mounting and interconnection

Abstract

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

Description

FIELD OF THE INVENTION[0001]This invention is directed to a flexible substrate structure used for LED (light emitting diode) mounting and Interconnection.TECHNICAL BACKGROUND OF THE INVENTION[0002]Insulated metal substrates are being used for the mounting and interconnection of light emitting diodes (LEDs) in applications such as display back lighting, automotive lighting and general commercial and consumer lighting uses. The substrates currently being used are generally rigid and are not able to be deformed and bent without degradation or damage to their mechanical, electrical and thermal properties. It is desirable to be able to form or bend such substrate materials to make angles, curves or bends, while maintaining mechanical and thermal integrity and without causing degradation of the substrate or of its electrical properties.[0003]Multi-functional electronic substrate materials of various kinds are known in the art. Some of the layers of these substrates can be made of various ...

AI Technical Summary

Benefits of technology

[0014]The laminate may be a thin polymer based copper clad filled polyimide (PI), for example a CooLam™ thermal laminate such as LC (Alumina Filled PI) and LX (Alumina Filled PI), used in conjunction with an aluminum alloy composition substrate. The laminate may also be an anodized aluminum CooLam™ thermal laminate, such as LU (Anodized Aluminum and with adhesive). Such laminates must be designed to be used in a composition of the proper thickness for LED applications. Use of such laminates creates a versatile and bendable structure for ease of use in LED packaging.

Problems solved by technology

The substrates currently being used are generally rigid and are not able to be deformed and bent without degradation or damage to their mechanical, electrical and thermal properties.

In general, these are rigid structures with little flexibility, unless the structure is grooved.

However, no mention is made of any flexibility of such alloy substrates.

In an article titled “Poor fixtures threaten to jeopardize the illumination potential of LEDs” by Richard Stevenson, Compound Semiconductor, Jun. 2007, the author points out that the low efficiency of many fixtures in the industry results from lack of skills relating to working on the design aspects of these fixtures, by the workforce of many companies, who work with the electrical systems used in powering LEDs.

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