Bendable circuit structure for LED mounting and interconnection
a circuit structure and led mounting technology, applied in the direction of lighting and heating equipment, transportation and packaging, lighting support devices, etc., can solve the problems of inability to deform and bend without degradation or damage to mechanical, electrical and thermal properties, rigid structures with little flexibility, and no mention of the flexibility of alloy substrates. , to achieve the effect of bending and bending structur
Inactive Publication Date: 2012-02-02
EI DU PONT DE NEMOURS & CO
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
The present invention is about a special laminate that can be used in LED packaging. The laminate consists of a copper or aluminum metal layer, a polyimide or adhesive layer, a copper foil layer, and a liquid or film solder mask layer. The laminate can be made using a thin polymer based copper clad filled polyimide, which is attached to an aluminum alloy composition substrate. The laminate is designed to be flexible and bendable, making it easy to use in LED packaging. The use of this laminate creates a versatile and reliable structure for LED packaging.
Problems solved by technology
The substrates currently being used are generally rigid and are not able to be deformed and bent without degradation or damage to their mechanical, electrical and thermal properties.
In general, these are rigid structures with little flexibility, unless the structure is grooved.
However, no mention is made of any flexibility of such alloy substrates.
In an article titled “Poor fixtures threaten to jeopardize the illumination potential of LEDs” by Richard Stevenson, Compound Semiconductor, June 2007, the author points out that the low efficiency of many fixtures in the industry results from lack of skills relating to working on the design aspects of these fixtures, by the workforce of many companies, who work with the electrical systems used in powering LEDs.
Method used
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Tests to Determinate Interconnection Integrity of the Present Laminate.
[0022]Tests to determine interconnection integrity of CooLam™ laminate under bending stress were performed on substrates fabricated with 17 micron thick CooLam™ thermal laminate and 2 mm thick Aluminum Alloy 5005 using a LCD Backlight Unit circuit design. The purpose of this testing was to determine the feasibility of offering this type of construction for applications in LED lighting.
[0023]The overall sample size was 17 mm×423 mm (⅝″×17″) and consists of 6 identical segments is shown in FIG. 1.
[0024]Three locations on each of six pieces were tested as shown in FIG. 1. The resistance of two 11.8 mil 1.4 mil thick traces, shown as 9 and 10 in FIG. 2, in each location was measured before and after bending. The bend point centerline on each segment was positioned on the centerline of a 1⅛″ diameter mandrel and bent by hand to an approximate 90 degree bend. The laminate / conductor was on the outside of the bend puttin...
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Abstract
This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.
Description
FIELD OF THE INVENTION[0001]This invention is directed to a flexible substrate structure used for LED (light emitting diode) mounting and Interconnection.TECHNICAL BACKGROUND OF THE INVENTION[0002]Insulated metal substrates are being used for the mounting and interconnection of light emitting diodes (LEDs) in applications such as display back lighting, automotive lighting and general commercial and consumer lighting uses. The substrates currently being used are generally rigid and are not able to be deformed and bent without degradation or damage to their mechanical, electrical and thermal properties. It is desirable to be able to form or bend such substrate materials to make angles, curves or bends, while maintaining mechanical and thermal integrity and without causing degradation of the substrate or of its electrical properties.[0003]Multi-functional electronic substrate materials of various kinds are known in the art. Some of the layers of these substrates can be made of various ...
Claims
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IPC IPC(8): H05K1/09B32B7/02B32B3/00B32B15/08B32B15/04
CPCH05K1/056Y10T29/49002H05K3/386H05K2201/0154H05K2201/0209H05K2201/10106H05K2203/0315H05K2203/302H05K1/028H05K3/22F21V21/00H05K1/0271Y10T428/24975Y10T29/49117Y10T428/24Y10T29/49147Y10T428/12569Y10T29/49126Y10T29/49144Y10T29/49124H05K1/189Y10T428/31681Y10T428/31678
Inventor AMEY, DANIEL I.GRAVELY, DEBORAH R.GREEN, MICHAEL J.WHITE, STEVEN H.
Owner EI DU PONT DE NEMOURS & CO