Bonding apparatus and bonding method

Abstract

To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a divisional of U.S. application Ser. No. 11 / 503,907, filed on Aug. 15, 2006 which is based upon and claims the benefits of the priority from the prior Japanese Patent Application No. 2006-075375 filed on Mar. 17, 2006, the entire contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably.[0004]2. Description of the Related Art[0005]Electronic devices (e.g., computers) have become faster and smaller, and there is an increasing demand for high-density packaging of electronic components. Against this background, substrates for large scale integration have been used, in w...

AI Technical Summary

Benefits of technology

This approach enhances product quality and yield by accurately controlling the pressing force, detecting abnormalities, and preventing electronic component damage, thereby stabilizing the bonding process and ensuring high-quality products.

Problems solved by technology

However, if bump connection terminal pitch reaches as small as 40 μm or less, a concern arises regarding the occurrence of connection defects, such as short-circuits between terminals, and damages to the electric component if it fails to achieve high-precision positioning (tolerances to ±1 μm) and / or stable load control because of variations in the fabrication precision of the substrate and in the formation of bumps.

Short circuits between terminals occur due to, for instance, excessively crushed bumps and displacement after recognition.

Damages to the electronic component include failures of, for example, bumps and terminals of the electronic component and substrate.

However, when high-precision positioning and high-precision load control are required in connection with reduced pitch between bump connection terminals, variations occur in the in-plane stress due to variations in the precision of components (e.g., substrates and bumps), even though the detected load values falls within a set reference load for a bonding operation, leading to reduced product yields due to connection failures and the like.

Thus, in a case of a load sensor provided on the upper side of the bonding tool support, available locations or areas for the load sensor are limited.

In addition, the load sensor is susceptible to heat generated due to friction of the components and thus tends to produce different values for the detected load.

Accordingly, bonding apparatuses with conventional load detection mechanisms, as disclosed in the foregoing Patent Literatures, cannot achieve further increase in the product quality; therefore, bonding technology has been sought after that enables high-precision pressing force control for increased product quality.

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